High Density Interconnect (HID) PCB is one of the fastest growing technologies in PCBs. High density interconnect boards contain blind and buried vias and often contain microvias of 0.006 or less in diameter. They have a higher circuitry density than traditional circuit boards. The evolution of high-density PCB technology has given engineers greater design freedom and flexibility than ever before. Designers using high density interconnect methods can place more components on both sides of the raw PCB if desired. In essence, an high density interconnect PCB gives designers more space to work with, while allowing them to place smaller components even closer together. This means that a high-density interconnect PCB ultimately results in faster signal transmission along with enhanced signal quality.

The factors that drive the global high density interconnect (HID) PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. The factors such as rising trend toward sophisticated safety systems, autonomous driving, and miniaturization of electronic devices in the automobile sector are expected to boost the growth of the global HDI PCB market in the near future. In addition, increase in utilization of high density interconnect technology in healthcare is expected to provide lucrative growth opportunities for the high density interconnect (HID) PCB market. On the contrary, high construction cost is anticipated to restrain the growth of the global high density interconnect (HID) PCB market.

The global high density interconnect (HID) PCB market is segmented on the basis of application, industry vertical, and geographical region. On the basis of application, the market is segmented into mobile phones, touch-screen devices, laptop computers, digital cameras, engine control units, GPS, dashboard electronics and 4G network communications. The high density interconnect PCB is also prominently featured in medical devices, as well as various electronic aircraft parts and components. By industry vertical, high density interconnect (HID) PCB market can be segmented into consumer electronics, automotive, industrial electronics, it & telecommunications, and others. The growing sales of consumer electronics and a substantial rise in the demand for HDI PCBs in these applications are driving the growth of the high density interconnect (HID) PCB market. Therefore, the consumer electronics industry is becoming one of the important end-user markets for high-density technology. Currently, application of these boards in consumer electronic devices such as smartphones, smart wearable, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global high density interconnect (HID) PCB market is projected to grow in the forecast period. By geographical region the global high density interconnect (HID) PCB market is split up into North America, Europe, Asia Pacific, Middle East & Africa and South America. Asia Pacific is expected to have largest market share during estimated period and is expected to witness significant growth owing to the presence of large manufacturing of electronics companies in this region. The region, along with Europe, is one of the developers in adopting new technologies, which is also one of the key factors for the high CAGR in this region.

Acquisitions and Merger, new product introductions, investments, and corporations & developments are the key strategies adopted by market companies to ensure their growth in the high density interconnect (HID) PCB market. The key players are Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, TTM Technologies, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporation, Epec, LLC, and Meiko are some major players in the high density interconnect (HID) PCB market.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market   

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

Disclaimer: This ongoing market research study is a meticulously planned activity where a broad array of factors and aspects that shape the marketing environment and industry are taken into account. However, keeping in mind the constantly changing nature of business dynamics and changing strategic intents, we are always actively making iterations and modifications in our approaches. As always, we are ready to tailor our insights and guidance to suit your requirements. Engage with us to know what more is there for your CXOs.

Enquiry Before Buying

TMR offers Enquiry Before Buying that help clients to get information on their business scenario required where syndicated solutions are not enough.

Enquiry Before Buying

High Density Interconnect (HID) PCB Market Size, Share, Trends, Growth, Export Value, Shipment, Volume & Trade, Sales, Pricing Forecast