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Wafer Cutting Blades Market

Wafer Cutting Blades Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2030

Wafer Cutting Blades: Introduction

  • Wafer cutting blades are used for a variety of applications and materials which includes cutting of silicon, compound semiconductor, and glass wafer. These blades are suitable for OEM manual as well as automatic wafer saws such as ADT, disco, accretech, loadpoint, and others.
  • Optimal wafer cutting is done by maximizing the abrasive concentration and size, and selecting the correct cutting speed and load. The optimal wafer cutting is done for delicate samples or sectioning the samples for very precise location.
  • Wafering blades are used for materials such as silicon substrate, gallium arsenide, boron composites, ceramic fiber composites, glasses, and minerals. According to the material, blades with grit concentration is selected.

Integration of microelectronics into consumer electronics

  • Microelectronics have been integrated into consumer electronics and hence the increasing need for thinner wafers. The equipment used for processing thin wafers includes cutting equipment and wafer processing equipment. Electronics such as MEMS, RFID, and power devices are the major sources of demand for wafer cutting blades.
  • Wafer cutting blades have extensive applications in semiconductors, aerospace and defense, medical electronics, and other sectors. These factors are increasing the demand for wafer cutting blades.

Automation of wafer back grinding equipment

  • Increasing automation of wafer back grinding equipment is enabling high quality and reduction of wafer thickness to less than 0.050 mm. Also, demand for better manufacturing processes for processing and dicing is a major factor driving the production of thin wafer.

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Maximum Growth to be observed in the Asia Pacific Market

  • In terms of region, the global wafer cutting blades market can be divided into North America, Europe, Asia Pacific, South America, and Middle East & Africa
  • The wafer cutting blades market in Asia Pacific is anticipated to expand at the maximum CAGR during the forecast period.
  • This growth is attributed to a wide range of applications, increasing investments by developing countries, growing applications of wafer cutting blades, and increasing industrialization, leading to increasing demand for wafer cutting blade products.
  • The wafer cutting blades market in North America and Europe is projected to show stagnant growth rate while the market in Middle East & Africa is likely to show slow growth due to high costs associated with deployment.

Key Players in the Global Market

The global wafer cutting blades market was highly fragmented. Prominent players operating in the global market are focusing on product launch and technological developments to meet the growing demand for wafer cutting blades.

Key players operating in the global wafer cutting blades market include:

  • DISCO Corporation
  • ADT
  • K & S
  • UKAM
  • Ceiba

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Global Wafer Cutting Blades Market: Research Scope

Global Wafer Cutting Blades Market, by Battery Type

  • Fine Grit
  • Medium Grit
  • Coarse Grit
  • Others

Global Wafer Cutting Blades Market, by Application

  • Semiconductors
  • Solar Wafers
  • Others

 Global Wafer Cutting Blades Market, by Region

  • North America
    • U.S.
    • Canada
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Spain
    • Russia & CIS
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • ASEAN
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Mexico
    • Rest of South America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

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