3d Ics Market

Global 3D ICs Market (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) - Industry Analysis, Size, Share, Growth, Trends and Forecast 2013 - 2019

  • Rep Id : TMRGL1755
  • Published On : Jan 2014
  • No. of Pages : 83
  • Category : Electronics & Semiconductors

 
Chapter 1 Preface
1.1 Report description and scope
      1.1.1 Market segmentation
1.2 Research methodology
 
Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
      3.2.1 Drivers
               3.2.1.1 Growing demand for efficient solutions
               3.2.1.2 Rise in number of portable devices
      3.2.2 Restraints
               3.2.2.1 High cost, thermal and testing issues
      3.2.3 Opportunities
               3.2.3.1 Big Data and predictive analytics
3.3 Trends and future outlook
      3.3.1 Multi-chip packaging
      3.3.2 IntSim
3.4 Value chain analysis
      3.4.1 Inbound logistics
      3.4.2 Operations
      3.4.3 Out-bound logistics
      3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
      3.5.1 Bargaining power of suppliers
      3.5.2 Bargaining power of buyers
      3.5.3 Threat of substitutes
      3.5.4 Threat of new entrants
      3.5.5 Degree of competition
3.6 Technology overview
      3.6.1 Shift to 3D IC from 2.5D IC technology
      3.6.2 3D IC fabrication processes
      3.6.3 Standards issues at different levels of 3D IC production
      3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
      3.8.1 Market share of key players, 2012 (%)

Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)
 
Chapter 9 Company Profiles
9.1 Taiwan Semiconductor Manufacturing Company, Ltd.
      9.1.1 Company overview
      9.1.2 Financial overview
      9.1.3 Business strategies
      9.1.4 Recent developments
9.2 XILINX, Inc.
      9.2.1 Company overview
      9.2.2 Financial overview
      9.2.3 Business strategies
      9.2.4 Recent developments
9.3 The 3M Company
      9.3.1 Company overview
      9.3.2 Financial overview
      9.3.3 Business strategies
      9.3.4 Recent developments
9.4 STATS ChipPAC Ltd.
      9.4.1 Company overview
      9.4.2 Financial overview
      9.4.3 Business strategies
      9.4.4 Recent developments
9.5 Tezzaron Semiconductor Corporation
      9.5.1 Company overview
      9.5.2 Financial overview
      9.5.3 Business strategies
      9.5.4 Recent developments
9.6 United Microelectronics Corporation
      9.6.1 Company overview
      9.6.2 Financial overview
      9.6.3 Business strategies
      9.6.4 Recent developments
9.7 Ziptronix, Inc.
      9.7.1 Company overview
      9.7.2 Financial overview
      9.7.3 Business strategies
      9.7.4 Recent developments
9.8 Elpida Memory, Inc. (Micron Technology, Inc.)
      9.8.1 Company overview
      9.8.2 Financial overview
      9.8.3 Business strategies
      9.8.4 Recent developments
9.9 MonolithIC 3D Inc.
      9.9.1 Company overview
      9.9.2 Financial overview
      9.9.3 Business strategies
      9.9.4 Recent developments

List of Tables
 
TABLE 1 3D ICs market segmentation
TABLE 2 Global 3D ICs market snapshot, 2012 & 2019
TABLE 3 Impact analysis of drivers
TABLE 4 Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
TABLE 5 Impact analysis of restraint
TABLE 6 Overview of different 3D IC fabrication processes
TABLE 7 Issues at different levels of 3D IC
TABLE 8 Patents by companies
TABLE 9 Geographical distribution of patents

List of Figures 
 
FIG. 1 Global 3D ICs market, 2011 – 2019 (USD million) and Y-o-Y growth (%)
FIG. 2 Global smartphone and tablet shipment forecast, 2010 – 2015 (million units)
FIG. 3 Value chain analysis
FIG. 4 Porter’s five forces analysis
FIG. 5 Market attractiveness analysis, by end-use sectors, 2012
FIG. 6 Market share of key players, 2012 (%)
FIG. 7 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
FIG. 8 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
FIG. 9 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
FIG. 10 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
FIG. 11 Military 3D ICs market, 2011 – 2019 (USD million)
FIG. 12 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
FIG. 13 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
FIG. 14 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
FIG. 15 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
FIG. 16 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
FIG. 17 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 18 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
FIG. 19 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
FIG. 20 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 21 Global 3D ICs market overview, by product, 2012 & 2019 (%)
FIG. 22 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
FIG. 23 RF SiP 3D ICs market, 2011 – 2019 (USD million)
FIG. 24 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
FIG. 25 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
FIG. 26 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
FIG. 27 HB LED 3D ICs market, 2011 – 2019 (USD million)
FIG. 28 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
FIG. 29 North America 3D ICs market, 2011 – 2019 (USD million)
FIG. 30 Europe 3D ICs market, 2011 – 2019 (USD million)
FIG. 31 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
FIG. 32 RoW 3D ICs market, 2011 – 2019 (USD million)
FIG. 33 Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 – 2012 (USD billion)
FIG. 34 Xilinx, Inc., annual revenues, 2010 – 2012 (USD billion)
FIG. 35 3M Company annual revenues, 2010 – 2012 (USD billion)
FIG. 36 STATS ChipPAC Ltd., annual revenues, 2010 – 2012 (USD million)
FIG. 37 United Microelectronics Corporation annual revenues, 2010 – 2012 (USD billion)
FIG. 38 Micron Technology, Inc., annual revenues, 2010 – 2011 (USD billion)