Campus Switch: Introduction

  • DCB stands for Direct Copper Bonding and AMB stands for Active Metal Brazing denotes a process in which copper and ceramic material are fused together, at high temperatures. AMB, or Active Metal Brazing, enables ceramic to be joined to metal without metallization.
  • DCB and AMB ceramic substrates are highly popular for the assembly and packaging of IGBT and MOSFET bare dies in power modules
  • The DCB and AMB process yields a thin base and eliminates the need for thick, heavy copper bases that were used in the past

DCB and AMB Substrate Optimized for Power Electronics

  • DCB and AMB substrate have characteristics such as thermal conductivity: about four times greater than alumina, mechanical properties: a substrate that has excellent mechanical properties, such as high fracture toughness and bending strength, and is durable under severe conditions involving rapid temperature changes, and thermal expansion ratio: close to that of silicon
  • Such physical properties and characteristics boost the use of this substrate in power electronics, such as power transistor modules, electric railway, automotive applications, windmill turbines, traction applications, and high voltage DC transmissions, where high reliability, heat dissipation, and partial discharge are required
  • Power electronics modules are particularly needed for the rapidly expanding e-mobility market. Consistent rise in the number of hybrid and electric vehicles across the globe boosts the demand for efficient, cost-effective, and reliable power electronic components, which in turn is estimated to propel the global DCB and AMB substrate market during the forecast period.
  • Rise in utilization of power semiconductor modules installed in electric drivetrains also drives the global DCB and AMB substrate market
  • Volatility in price of raw materials of substrates and the presence of limited quality cheap products in the market are major factors restraining the global DCB and AMB substrate market

Asia Pacific to Lead Global DCB and AMB Substrate Market

  • In terms of region, the global DCB and AMB substrate market can be divided into North America, Europe, Asia Pacific, Middle East & Africa, and South America
  • The DCB and AMB substrate market in Asia Pacific is estimated to expand at a rapid pace during the forecast period due to an increase in industrial machinery such as machine tools, semiconductor manufacturing equipment, wind power generation, FA robots, and electric railway projects in the region
  • Rapid industrialization, expansion of manufacturing activities, and the presence of a large number of manufacturing companies adopting automation further fuel the demand for DCB and AMB substrate
  • Increasing investments by major player of the electronics industry in Asia Pacific is also boosting the demand for DCB and AMB substrate in the region
  • The DCB and AMB substrate market in North America is estimated to follow Asia Pacific in terms of expansion during the forecast period due to considerably high demand for DCB and AMB substrate in the next few years and rising adoption of hybrid vehicles and industrial machinery technology in the region
  • The DCB and AMB substrate market in Europe is expected to expand at a substantial rate during the forecast period due to a rise in the demand for DCB and AMB substrate from countries in Western Europe. On the other hand, the market in Middle East & Africa and South America is estimated to expand at a moderate pace during the forecast period.

Key Players Operating in Global DCB and AMB Substrate Market

The global DCB and AMB substrate market was highly fragmented in 2020. Major players operating in the global market are focusing on technological advancement and expansion to meet the rising demand for a DCB and AMB substrate. Moreover, manufacturers are undertaking mergers and acquisitions for the development of innovative products.

Key players operating in the global DCB and AMB substrate market are:

  • Ferrotec (USA) Corporation
  • NGK ELECTRONICS DEVICES, INC.
  • Mitsubishi Materials Corporation
  • IXYS Corporation
  • KYOCERA Corporation
  • Rogers Corporation
  • KCC CORPORATION
  • DALEBA ELECTRONICS LTD
  • Denka Company Limited
  • DOWA HD Europe GmbH

Global DCB and AMB Substrate Market: Research Scope

Global DCB and AMB Substrate Market, by Material

  • ZTA Ceramic
  • Al2O3 Ceramic
  • Copper
  • SiN Ceramic
  • AlN Ceramic

Global DCB and AMB Substrate Market, by Thickness

  • 0.1mm to 0.3mm
  • 0.3 mm to 0.6mm
  • 0.6mm to 1.0mm
  • Above 1.0mm

Global DCB and AMB Substrate Market, by End-use Industry

  • Automotive
  • Consumer Electronics
  • Aerospace & Defense
  • IT & Telecommunication
  • Industrial
  • Others (Healthcare, Energy & Utility)

Global DCB and AMB Substrate Market, by Region

  • North America
    • U.S.
    • Canada
    • Rest of North America
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Spain
    • Russia
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • ASEAN
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Mexico
    • Rest of South America
  • Middle East & Africa
    • GCC
    • South Africa
    • Rest of Middle East & Africa

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DCB And AMB Substrate Market