Currently, there is an increasing availability of wide range of consumer electronic devices. These devices are available in wide range of package types and includes resistors, capacitors, magnets, and semiconductors (integrated circuits). The global market for advanced semiconductor packaging has been gaining a solid momentum in recent years due to growing interest from the funding and investment community. Evolving consumer preferences and choices in terms of latest gadgets and technology coupled with constant innovation in the field of consumer electronics are some of the key factors that are helping to drive the overall development of the global market. Leading companies in the market are consistently offering new and innovative products to attract more users. This too has worked in favor of the development of the global market.

As more and more number of consumers are moving towards connected gadgets and devices, and increasing prevalence as well as popularity of Internet of Things (IoT) is also projected to help in the overall development of the global market for advanced semiconductor packaging in coming years. A growing demand for consumer wearable devices, home appliances, and smartphones are also projected to have a highly positive influence on the overall development of the global market. A key trend emerging in the global advanced semiconductor packaging market is of fan-out wafer level packaging (FOWLP).

With Internet of Things emerging as a major growth driver, security has become a prime concern for users. The leading manufacturers in the semiconductor sector are constantly working in order to develop highly secure chips. The global market is also projected to align themselves with the value chain of the electronics goods industry. Thig development is projected to increase the cost of the integrated circuits (ICs). This might pose some problem for the development of the global market in coming years.

The innovation in the semiconductor packaging technology largely depends on the size of wafer. Hence, the increasing focus on wafer-level packages is resulting in chip industry to come up with advanced packaging solutions. The Fan-Out Wafer-Level Packaging (FO-WLP) technology is emerging as an alternative to the 2.5D packaging. Moreover, Fan-out wafer-level packaging can manage multiple dies as compared to the fan-in wafer-level packaging that can handle only single die. Fan-out packaging technology is also witnessing significant growth as it eliminates the need for process flows including wafer fluxing, bumping, cleaning, curing, flip-chip assembly, and underfill dispensing.  

Manufacturers are also focusing on producing larger diameter wafers due to increasing demand this is likely to cut down manufacturing cost and will also lead to the development of advanced semiconductor packaging solution.

A study by Transparency Market Research (TMR) is expecting the global market for advanced semiconductor packaging to experience robust growth. It also projects the market to increase to 10.9% CAGR throughout the forecast period. The global market for advanced semiconductor packaging is also likely to bring in US$ 67,208.2 million revenue towards 2026 end.

global advanced semiconductor packaging market

Flip Chip (FC) to Account for Maximum Revenue Share as the Packaging Type

Compared to other types of advanced semiconductor packaging, Flip Chip (FC) is likely to account for maximum revenue share. By the end of 2026, Flip Chip (FC) packaging is estimated to reach close to US$ 45,700 million revenue. Owing to the lighter, smaller, and thinner consumer products, smaller package types are being used on a large scale. Compared to other packaging types, flip chip offers faster signal transfer, lower profile, and high I/O density.

Advanced Semiconductor Packaging to find Largest Application in Central Processing Units/Graphical Processing Units

Advanced semiconductor packaging is likely to find the largest application in Central Processing Units/Graphical Processing Units. Towards 2026 end, Central Processing Units/Graphical Processing Units is likely to bring in more than US$ 11,500 million revenue. Meanwhile, Dynamic Random Access Memory is also likely to witness robust growth between 2017 and 2026.

Consumer Electronics to be the Largest End Users of Advanced Semiconductor Packaging

Among various industries as end users of advanced semiconductor packaging, consumer electronics is likely to emerge as the largest end user. By 2026 end, consumer electronics are estimated to bring in nearly US$ 15,600 million revenue. Increasing demand for various devices including tablets, smartphones, wearable devices and other connected consumer electronics, is resulting in the advanced semiconductor packaging technologies. Meanwhile, System-In-Package (SIP) technology is also gaining momentum as it allows more features to be integrated into small form factors such as medical implants and wearable devices. 

APEJ to Emerge as the Leading Region in Terms of Revenue in the Global Market for Advanced Semiconductor Packaging

Asia Pacific Excluding Japan (APEJ) is anticipated to emerge as the major revenue contributor to the advanced semiconductor packaging market between 2017 and 2026. Prominent semiconductor manufacturing companies present in the region are fueling the demand for advanced semiconductor packaging. Moreover, companies are also investing heavily in the research and development activities for developing new semiconductor packages with advanced features.

Competition Tracking

AMD, Intel Corp, Amkor Technology, STMicroelectronics, Hitachi Chemical, Infineon, Avery Dennison, Sumitomo Chemical Co. Ltd., ASE Group, and Kyocera, are the leading market players in the global market for advanced semiconductor packaging.

Global Advanced Semiconductor Packaging Market- Overview

Semiconductor packaging prevents physical damage and corrosion of the chips that are to be connected to the circuit boards. In the recent years, semiconductor packaging has evolved giving rise to advanced semiconductor packaging technologies. Manufacturers are moving towards new packaging options such as 2.5D integrated circuits and 3D integrated circuits. Meanwhile, manufacturers are also focusing on developing an alternative to the 2.5D packaging.

Internet of Things (IoT) is also expected to have a significant impact on the advanced semiconductor packaging market. Hence, new packaging technologies supporting IoT driven semiconductor industry are being introduced. Miniaturization of devices and thermal dissipation are leading towards the growth of the advanced semiconductor packaging market. Meanwhile, the requirement for less power consumption, improved efficiency is driving the adoption of 3D semiconductor packaging in the advanced semiconductor packaging market.

Global Advanced Semiconductor Packaging Market- Research Methodology

The report on the global advanced semiconductor packaging market offers key insights on the market with help of the data obtained from primary and secondary research. The report has used top-down and bottom-up approach to provide expected market size. The report also offers insights on all the major factors playing an important role in the market growth. The report also includes key trends, market opportunities, factors driving the global market and factors hampering the growth of the market.

During the primary research interview of industry experts was conducted and information provided by them was crosschecked with various data sources. Both micro-economic and macro-economic factors were also taken into account to provide important information on the global as well as regional advanced semiconductor packaging market. 

The report also offers segment-wise analysis and region-wise analysis of the global advanced semiconductor packaging market. The secondary research was done to gather data on the market. Sources used in the secondary research included investor presentations, annual reports and financial reports of the major companies. Absolute dollar opportunity is also provided in the report to identify various market opportunities.  

The report comprises vital information on the key companies operating in the global advanced semiconductor packaging market. The report enlightens on the key business strategies, developments, new product launch by the key market players. The report also includes details on the regulations in the market across the globe. The report also focuses on the technological advancements in the market and how new technologies will impact the growth of the market in future.

Global Advanced Semiconductor Packaging Market- Segmentation

The global advanced semiconductor packaging market is segmented based on packaging type, application, end user, and region. On the basis of packaging type, the advanced semiconductor packaging market is divided into Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), Flip Chip (FC), and 2.5D/3D.

On the basis of application, the market is divided into application processor/ baseband, central processing units/graphical processing units, dynamic random access memory, NAND, image sensor, and other applications.

Based on the end user, the market is divided into telecommunications, automotive, aerospace and defense, medical devices, consumer electronics, and other end users. 

Region-wise the global market for advanced semiconductor packaging is segmented into Japan, Asia Pacific Excluding Japan (APEJ), Europe, North America, Latin America, and the Middle East and Africa (MEA).

Competitive Landscape

Some of the key players in the global advanced semiconductor packaging market are Intel Corp, AMD, Amkor Technology, Hitachi Chemical, STMicroelectronics, Infineon, Sumitomo Chemical Co. Ltd., Avery Dennison, Kyocera, and ASE Group.

1. Global Economic Outlook

2. Global Advanced Semiconductor Packaging Market - Executive Summary

3. Global Advanced Semiconductor Packaging Market Overview
      3.1. Introduction
             3.1.1. Global Advanced Semiconductor Packaging Market Taxonomy
             3.1.2. Global Advanced Semiconductor Packaging Market Definition
      3.2. Global Advanced Semiconductor Packaging Market Size (US$ Mn) and Forecast, 2012-2026
             3.2.1. Global Advanced Semiconductor Packaging Market Y-o-Y Growth
      3.3. Global Advanced Semiconductor Packaging Market Dynamics
      3.4. Advanced Packaging Platforms
      3.5. Semiconductor Industry Segmentation
      3.6. World Semiconductor Spending
      3.7. Competitor Footprint Matrix
      3.8. Main Market Drivers for Power Application
      3.9. Key Participants Market Presence (Intensity Map) By Region

4. Global Advanced Semiconductor Packaging Market Analysis and Forecast 2012-2026 
      4.1. Global Advanced Semiconductor Packaging Market Size and Forecast By Packaging Type, 2012-2026
             4.1.1. Fan-Out Wafer-Level Packaging (FO WLP) Market Size and Forecast, 2012-2026
                      4.1.1.1. Revenue (US$ Mn) Comparison, By Region
                      4.1.1.2. Market Share Comparison, By Region
                      4.1.1.3. Y-o-Y growth Comparison, By Region
             4.1.2. Fan-In Wafer-Level Packaging (FI WLP) Market Size and Forecast, 2012-2026
                      4.1.2.1. Revenue (US$ Mn) Comparison, By Region
                      4.1.2.2. Market Share Comparison, By Region
                      4.1.2.3. Y-o-Y growth Comparison, By Region
             4.1.3. Flip Chip (FC) Market Size and Forecast, 2012-2026
                      4.1.3.1. Revenue (US$ Mn) Comparison, By Region
                      4.1.3.2. Market Share Comparison, By Region
                      4.1.3.3. Y-o-Y growth Comparison, By Region
             4.1.4. 2.5D/3D Market Size and Forecast, 2012-2026
                      4.1.4.1. Revenue (US$ Mn) Comparison, By Region
                      4.1.4.2. Market Share Comparison, By Region
                      4.1.4.3. Y-o-Y growth Comparison, By Region
      4.2. Global Advanced Semiconductor Packaging Market Size and Forecast By End User, 2012-2026
             4.2.1. End User Processor/ Baseband Market Size and Forecast, 2012-2026
                      4.2.1.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.1.2. Market Share Comparison, By Region
                      4.2.1.3. Y-o-Y growth Comparison, By Region
             4.2.2. Central Processing Units/Graphical Processing Units Market Size and Forecast, 2012-2026
                      4.2.2.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.2.2. Market Share Comparison, By Region
                      4.2.2.3. Y-o-Y growth Comparison, By Region
                                   4.2.3. Dynamic Random Access Memory Market Size and Forecast, 2012-2026
                      4.2.3.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.3.2. Market Share Comparison, By Region
                      4.2.3.3. Y-o-Y growth Comparison, By Region
             4.2.4. NAND Market Size and Forecast, 2012-2026
                      4.2.4.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.4.2. Market Share Comparison, By Region
                      4.2.4.3. Y-o-Y growth Comparison, By Region
             4.2.5. Image Sensor Market Size and Forecast, 2012-2026
                      4.2.5.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.5.2. Market Share Comparison, By Region
                      4.2.5.3. Y-o-Y growth Comparison, By Region
             4.2.6. Other Applications Market Size and Forecast, 2012-2026
                      4.2.6.1. Revenue (US$ Mn) Comparison, By Region
                      4.2.6.2. Market Share Comparison, By Region
                      4.2.6.3. Y-o-Y growth Comparison, By Region
      4.3. Global Advanced Semiconductor Packaging Market Size and Forecast By End User, 2012-2026
             4.3.1. Telecommunications Market Size and Forecast, 2012-2026
                      4.3.1.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.1.2. Market Share Comparison, By Region
                      4.3.1.3. Y-o-Y growth Comparison, By Region
             4.3.2. Automotive Market Size and Forecast, 2012-2026
                      4.3.2.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.2.2. Market Share Comparison, By Region
                      4.3.2.3. Y-o-Y growth Comparison, By Region
             4.3.3. Aerospace and Defense Market Size and Forecast, 2012-2026
                      4.3.3.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.3.2. Market Share Comparison, By Region
                      4.3.3.3. Y-o-Y growth Comparison, By Region
             4.3.4. Medical Devices Market Size and Forecast, 2012-2026
                      4.3.4.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.4.2. Market Share Comparison, By Region
                      4.3.4.3. Y-o-Y growth Comparison, By Region
             4.3.5. Industrial Market Size and Forecast, 2012-2026
                      4.3.5.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.5.2. Market Share Comparison, By Region
                      4.3.5.3. Y-o-Y growth Comparison, By Region
             4.3.6. Consumer Electronics Market Size and Forecast, 2012-2026
                      4.3.6.1. Revenue (US$ Mn) Comparison, By Region
                      4.3.6.2. Market Share Comparison, By Region
                      4.3.6.3. Y-o-Y growth Comparison, By Region

5. North America Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      5.1. North America Outlook 
      5.2. North America Parent Market Outlook 
      5.3. North America Target Market Outlook 
      5.4. Revenue (US$ Mn) Comparison, By Country 
             5.4.1. US Market Size and Forecast (US$ Mn), 2012-2026
             5.4.2. Canada Market Size and Forecast (US$ Mn), 2012-2026
      5.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      5.6. Revenue (US$ Mn) Comparison, By End User 
      5.7. Revenue (US$ Mn) Comparison, By End User 

6. Latin America Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      6.1. Latin America Outlook 
      6.2. Latin America Parent Market Outlook 
      6.3. Latin America Target Market Outlook 
      6.4. Revenue (US$ Mn) Comparison, By Country 
             6.4.1. Brazil Market Size and Forecast (US$ Mn), 2012-2026
             6.4.2. Mexico Market Size and Forecast (US$ Mn), 2012-2026
             6.4.3. Rest of Latin America Market Size and Forecast (US$ Mn), 2012-2026
      6.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      6.6. Revenue (US$ Mn) Comparison, By End User 
      6.7. Revenue (US$ Mn) Comparison, By End User 

7. Europe Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      7.1. Europe Outlook 
      7.2. Europe Parent Market Outlook 
      7.3. Europe Target Market Outlook 
      7.4. Revenue (US$ Mn) Comparison, By Country 
             7.4.1. Germany Market Size and Forecast (US$ Mn), 2012-2026
             7.4.2. UK Market Size and Forecast (US$ Mn), 2012-2026
             7.4.3. France Market Size and Forecast (US$ Mn), 2012-2026
             7.4.4. Spain Market Size and Forecast (US$ Mn), 2012-2026
             7.4.5. Italy Market Size and Forecast (US$ Mn), 2012-2026
             7.4.6. Rest of Europe Market Size and Forecast (US$ Mn), 2012-2026
      7.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      7.6. Revenue (US$ Mn) Comparison, By End User 
      7.7. Revenue (US$ Mn) Comparison, By End User 

8. Japan Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      8.1. Japan Outlook 
      8.2. Japan Parent Market Outlook 
      8.3. Japan Target Market Outlook 
      8.4. Revenue (US$ Mn) Comparison, By Country 
             8.4.1. Japan Market Size and Forecast (US$ Mn), 2012-2026
      8.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      8.6. Revenue (US$ Mn) Comparison, By End User 
      8.7. Revenue (US$ Mn) Comparison, By End User 

9. APEJ Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      9.1. APEJ Outlook 
      9.2. APEJ Parent Market Outlook 
      9.3. APEJ Target Market Outlook 
      9.4. Revenue (US$ Mn) Comparison, By Country 
             9.4.1. China Market Size and Forecast (US$ Mn), 2012-2026
             9.4.2. India Market Size and Forecast (US$ Mn), 2012-2026
             9.4.3. Taiwan Market Size and Forecast (US$ Mn), 2012-2026
             9.4.4. Singapore Market Size and Forecast (US$ Mn), 2012-2026
             9.4.5. South Korea Market Size and Forecast (US$ Mn), 2012-2026
             9.4.6. Rest of APEJ Market Size and Forecast (US$ Mn), 2012-2026
      9.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      9.6. Revenue (US$ Mn) Comparison, By End User 
      9.7. Revenue (US$ Mn) Comparison, By End User 

10. MEA Advanced Semiconductor Packaging Market Size and Forecast, 2012-2026
      10.1. MEA Outlook 
      10.2. MEA Parent Market Outlook 
      10.3. MEA Target Market Outlook 
      10.4. Revenue (US$ Mn) Comparison, By Country 
             10.4.1. GCC Countries Market Size and Forecast (US$ Mn), 2012-2026
             10.4.2. Israel Market Size and Forecast (US$ Mn), 2012-2026
             10.4.3. Turkey Market Size and Forecast (US$ Mn), 2012-2026
             10.4.4. Rest of MEA Market Size and Forecast (US$ Mn), 2012-2026
      10.5. Revenue (US$ Mn) Comparison, By Packaging Type 
      10.6. Revenue (US$ Mn) Comparison, By End User 
      10.7. Revenue (US$ Mn) Comparison, By End User 

11. Global Advanced Semiconductor Packaging Market Company Share, Competition Landscape and Company Profiles
      11.1. Company Share Analysis
      11.2. Competition Landscape
      11.3. Company Profiles
             11.3.1. Intel Corp
             11.3.2. AMD
             11.3.3. Amkor Technology
             11.3.4. Hitachi Chemical
             11.3.5. STMicroelectronics
             11.3.6. Infineon
             11.3.7. Sumitomo Chemical Co. Ltd.
             11.3.8. Avery Dennison
             11.3.9. Kyocera
             11.3.10. ASE Group

12. Research Methodology

13. Disclaimer

List of Table

TABLE 1 Global Advanced Semiconductor Packaging Market Value (US$ Mn), 2012-2017
TABLE 2 Global Advanced Semiconductor Packaging Market Value (US$ Mn), 2018-2026
TABLE 3 Global Advanced Semiconductor Packaging Market Value (US$ Mn) and Y-o-Y, 2017-2026
TABLE 4 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Value (US$ Mn), By Region 2012-2017
TABLE 5 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Value (US$ Mn), By Region 2018-2026
TABLE 6 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Market Share, By Region 2012-2017
TABLE 7 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Market Share, By Region 2018-2026
TABLE 8 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Y-o-Y, By Region 2017-2026
TABLE 9 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Value (US$ Mn), By Region 2012-2017
TABLE 10 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Value (US$ Mn), By Region 2018-2026
TABLE 11 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Market Share, By Region 2012-2017
TABLE 12 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Market Share, By Region 2018-2026
TABLE 13 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Y-o-Y, By Region 2017-2026
TABLE 14 Global Flip Chip (FC) Segment Value (US$ Mn), By Region 2012-2017
TABLE 15 Global Flip Chip (FC) Segment Value (US$ Mn), By Region 2018-2026
TABLE 16 Global Flip Chip (FC) Segment Market Share, By Region 2012-2017
TABLE 17 Global Flip Chip (FC) Segment Market Share, By Region 2018-2026
TABLE 18 Global Flip Chip (FC) Segment Y-o-Y, By Region 2017-2026
TABLE 19 Global 2.5D/3D Segment Value (US$ Mn), By Region 2012-2017
TABLE 20 Global 2.5D/3D Segment Value (US$ Mn), By Region 2018-2026
TABLE 21 Global 2.5D/3D Segment Market Share, By Region 2012-2017
TABLE 22 Global 2.5D/3D Segment Market Share, By Region 2018-2026
TABLE 23 Global 2.5D/3D Segment Y-o-Y, By Region 2017-2026
TABLE 24 Global Application Processor/ Baseband Segment Value (US$ Mn), By Region 2012-2017
TABLE 25 Global Application Processor/ Baseband Segment Value (US$ Mn), By Region 2018-2026
TABLE 26 Global Application Processor/ Baseband Segment Market Share, By Region 2012-2017
TABLE 27 Global Application Processor/ Baseband Segment Market Share, By Region 2018-2026
TABLE 28 Global Application Processor/ Baseband Segment Y-o-Y, By Region 2017-2026
TABLE 29 Global Central Processing Units/Graphical Processing Units Segment Value (US$ Mn), By Region 2012-2017
TABLE 30 Global Central Processing Units/Graphical Processing Units Segment Value (US$ Mn), By Region 2018-2026
TABLE 31 Global Central Processing Units/Graphical Processing Units Segment Market Share, By Region 2012-2017
TABLE 32 Global Central Processing Units/Graphical Processing Units Segment Market Share, By Region 2018-2026
TABLE 33 Global Central Processing Units/Graphical Processing Units Segment Y-o-Y, By Region 2017-2026
TABLE 34 Global Dynamic Random Access Memory Segment Value (US$ Mn), By Region 2012-2017
TABLE 35 Global Dynamic Random Access Memory Segment Value (US$ Mn), By Region 2018-2026
TABLE 36 Global Dynamic Random Access Memory Segment Market Share, By Region 2012-2017
TABLE 37 Global Dynamic Random Access Memory Segment Market Share, By Region 2018-2026
TABLE 38 Global Dynamic Random Access Memory Segment Y-o-Y, By Region 2017-2026
TABLE 39 Global NAND Segment Value (US$ Mn), By Region 2012-2017
TABLE 40 Global NAND Segment Value (US$ Mn), By Region 2018-2026
TABLE 41 Global NAND Segment Market Share, By Region 2012-2017
TABLE 42 Global NAND Segment Market Share, By Region 2018-2026
TABLE 43 Global NAND Segment Y-o-Y, By Region 2017-2026
TABLE 44 Global Image Sensor Segment Value (US$ Mn), By Region 2012-2017
TABLE 45 Global Image Sensor Segment Value (US$ Mn), By Region 2018-2026
TABLE 46 Global Image Sensor Segment Market Share, By Region 2012-2017
TABLE 47 Global Image Sensor Segment Market Share, By Region 2018-2026
TABLE 48 Global Image Sensor Segment Y-o-Y, By Region 2017-2026
TABLE 49 Global Other Applications Segment Value (US$ Mn), By Region 2012-2017
TABLE 50 Global Other Applications Segment Value (US$ Mn), By Region 2018-2026
TABLE 51 Global Other Applications Segment Market Share, By Region 2012-2017
TABLE 52 Global Other Applications Segment Market Share, By Region 2018-2026
TABLE 53 Global Other Applications Segment Y-o-Y, By Region 2017-2026
TABLE 54 Global Telecommunications Segment Value (US$ Mn), By Region 2012-2017
TABLE 55 Global Telecommunications Segment Value (US$ Mn), By Region 2018-2026
TABLE 56 Global Telecommunications Segment Market Share, By Region 2012-2017
TABLE 57 Global Telecommunications Segment Market Share, By Region 2018-2026
TABLE 58 Global Telecommunications Segment Y-o-Y, By Region 2017-2026
TABLE 59 Global Automotive Segment Value (US$ Mn), By Region 2012-2017
TABLE 60 Global Automotive Segment Value (US$ Mn), By Region 2018-2026
TABLE 61 Global Automotive Segment Market Share, By Region 2012-2017
TABLE 62 Global Automotive Segment Market Share, By Region 2018-2026
TABLE 63 Global Automotive Segment Y-o-Y, By Region 2017-2026
TABLE 64 Global Aerospace and Defense Segment Value (US$ Mn), By Region 2012-2017
TABLE 65 Global Aerospace and Defense Segment Value (US$ Mn), By Region 2018-2026
TABLE 66 Global Aerospace and Defense Segment Market Share, By Region 2012-2017
TABLE 67 Global Aerospace and Defense Segment Market Share, By Region 2018-2026
TABLE 68 Global Aerospace and Defense Segment Y-o-Y, By Region 2017-2026
TABLE 69 Global Medical Devices Segment Value (US$ Mn), By Region 2012-2017
TABLE 70 Global Medical Devices Segment Value (US$ Mn), By Region 2018-2026
TABLE 71 Global Medical Devices Segment Market Share, By Region 2012-2017
TABLE 72 Global Medical Devices Segment Market Share, By Region 2018-2026
TABLE 73 Global Medical Devices Segment Y-o-Y, By Region 2017-2026
TABLE 74 Global Consumer Electronics Segment Value (US$ Mn), By Region 2012-2017
TABLE 75 Global Consumer Electronics Segment Value (US$ Mn), By Region 2018-2026
TABLE 76 Global Consumer Electronics Segment Market Share, By Region 2012-2017
TABLE 77 Global Consumer Electronics Segment Market Share, By Region 2018-2026
TABLE 78 Global Consumer Electronics Segment Y-o-Y, By Region 2017-2026
TABLE 79 Global Other Industrial Segment Value (US$ Mn), By Region 2012-2017
TABLE 80 Global Other Industrial Segment Value (US$ Mn), By Region 2018-2026
TABLE 81 Global Other Industrial Segment Market Share, By Region 2012-2017
TABLE 82 Global Other Industrial Segment Market Share, By Region 2018-2026
TABLE 83 Global Other Industrial Segment Y-o-Y, By Region 2017-2026
TABLE 84 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 85 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 86 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 87 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 88 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 89 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 90 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 91 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
TABLE 92 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 93 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 94 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 95 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 96 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 97 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 98 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 99 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
TABLE 100 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 101 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 102 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 103 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 104 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 105 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 106 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 107 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
TABLE 108 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 109 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 110 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 111 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 112 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 113 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 114 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 115 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
TABLE 116 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 117 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 118 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 119 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 120 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 121 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 122 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 123 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
TABLE 124 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
TABLE 125 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
TABLE 126 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
TABLE 127 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
TABLE 128 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
TABLE 129 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
TABLE 130 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
TABLE 131 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026

List of Figures

FIG. 1 Global Advanced Semiconductor Packaging Market Value (US$ Mn), 2012-2017
FIG. 2 Global Advanced Semiconductor Packaging Market Value (US$ Mn) Forecast, 2018-2026
FIG. 3 Global Advanced Semiconductor Packaging Market Value (US$ Mn) and Y-o-Y, 2017-2026
FIG. 4 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 5 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 6 Global Fan-Out Wafer-Level Packaging (FO WLP) Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 7 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 8 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 9 Global Fan-In Wafer-Level Packaging (FI WLP) Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 10 Global Flip Chip (FC) Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 11 Global Flip Chip (FC) Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 12 Global Flip Chip (FC) Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 13 Global 2.5D/3D Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 14 Global 2.5D/3D Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 15 Global 2.5D/3D Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 16 Global Application Processor/ Baseband Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 17 Global Application Processor/ Baseband Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 18 Global Application Processor/ Baseband Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 19 Global Central Processing Units/Graphical Processing Units Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 20 Global Central Processing Units/Graphical Processing Units Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 21 Global Central Processing Units/Graphical Processing Units Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 22 Global Dynamic Random Access Memory Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 23 Global Dynamic Random Access Memory Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 24 Global Dynamic Random Access Memory Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 25 Global NAND Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 26 Global NAND Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 27 Global NAND Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 28 Global Image Sensor Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 29 Global Image Sensor Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 30 Global Image Sensor Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 31 Global Other Applications Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 32 Global Other Applications Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 33 Global Other Applications Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 34 Global Telecommunications Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 35 Global Telecommunications Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 36 Global Telecommunications Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 37 Global Automotive Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 38 Global Automotive Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 39 Global Automotive Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 40 Global Aerospace and Defense Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 41 Global Aerospace and Defense Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 42 Global Aerospace and Defense Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 43 Global Medical Devices Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 44 Global Medical Devices Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 45 Global Medical Devices Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 46 Global Consumer Electronics Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 47 Global Consumer Electronics Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 48 Global Consumer Electronics Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 49 Global Other Industrial Segment Market Value (US$ Mn) By Region, 2012-2017
FIG. 50 Global Other Industrial Segment Market Value (US$ Mn) By Region, 2018-2026
FIG. 51 Global Other Industrial Segment Y-o-Y Growth Rate, By Region, 2017-2026
FIG. 52 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 53 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 54 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 55 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 56 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
FIG. 57 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 58 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 59 North America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
FIG. 60 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 61 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 62 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 63 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 64 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
FIG. 65 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 66 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 67 Latin America Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
FIG. 68 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 69 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 70 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 71 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 72 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
FIG. 73 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 74 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 75 Europe Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
FIG. 76 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 77 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 78 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 79 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 80 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 81 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 82 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 83 Japan Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
FIG. 84 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 85 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 86 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 87 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 88 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
FIG. 89 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 90 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 91 APEJ Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026
FIG. 92 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2012-2017
FIG. 93 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Country 2018-2026
FIG. 94 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2012-2017
FIG. 95 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Packaging Type 2018-2026
FIG. 96 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2012-2017
FIG. 97 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By Application 2018-2026
FIG. 98 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2012-2017
FIG. 99 MEA Advanced Semiconductor Packaging Market Value (US$ Mn), By End User 2018-2026

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Advanced Semiconductor Packaging Market