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Published Date: 2016-11-18Number of Pages: 150

Underfill Material Market (Product - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), and Molded Underfill Material (MUF); Application - Flip Chips, Ball Grid Array (BGA), and Chip Scale Packaging (CSP)) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

Global Underfill Material Market: Snapshot

Underfill materials are essentially composite formulations made out of inorganic fillers and organic polymers. These materials are used in semiconductor packaging for improving the thermo-mechanical performance. Underfill materials are being extensively used in semiconductor packaging due to their remarkable thermal stability and reworkability. According to the research report by Transparency Market Research, the global underfill material market is expected to be worth US$448.3 mn by the end of 2024 as compared to US$220.4 mn in 2015. Analysts predict that the global market will expand at a CAGR of 8.3% during the forecast period of 2016 and 2024.

Booming Electronic Industry Fuels Uptake of Underfill Materials

The market for underfill materials is expected to witness remarkable surge due to the growing demand of mobile electronic products. The soaring demand for lighter, smaller, and faster electronic products is expected to increase the uptake of underfill materials in the near future as they offer the right amount of mechanical strength to solder joints of PCB and improve impact resistance. The key advantage of underfill material is their ability to enhance the thermal cycling resistance, which also improves its overall reliability. The growing demand for flip chip technology and rising popularity of copper pillars are projected to have a positive influence on the robust growth of the underfill material market during the forecast period. The factors holding the market back are the intensifying pressure of downward pricing and expensive cost of materials.

underfill material market


CUF Segment to Progress at 9.5% CAGR 2016–2024

The types of products available in the global underfill material market are capillary underfill material (CUF), molded underfill material (MUF), and no flow underfill material (NUF). Analysts anticipate that the CUF segment will lead the global market during the forecast years. During the forecast years of 2016 and 2024, the capillary underfill material is projected to expand at a CAGR of 9.5%. On the basis of application, the underfill material is segmented into flip chips, ball grid array, and chip scale packaging. Of these, the flip chip segment is likely to garner a share of 52.6 % in the global market. The research report shows that that flip chip segment is likely to dominate the global market in the coming years as well.

Asia Pacific to Assume Lead as China Exhibits High Demand for Underfill Materials

In terms of geography, the global underfill material market is segmented into Asia Pacific, Latin America, North America, Europe, and the Middle East and Africa. Over the forecast years, Asia Pacific is projected to show remarkable progress in the global market as it is likely to register a CAGR of 9.7% in terms of market revenue. The growth of Asia Pacific underfill material market will be dictated by the high uptake of these materials in China-based industries. The booming electronic sector of China and the persistent manufacturing industry of the country are expected to make a significant contribution to the market. Furthermore, Europe and North America will also show a huge demand for underfill materials in the near future. On the other hand, the Middle East and Africa and Latin America are projected to experience relatively moderate growth rate of underfill market during the forecast period.

The important players leading the global underfill material market are Epoxy Technology Inc., Henkel AG & Co. KgaA, H.B. Fuller, Yincae Advanced Material, LLC, NAMICS Corporation, Master Bond Inc., Zymet Inc., Won Chemicals Co. Ltd., and AIM Metals & Alloys LP.

Global Underfill Material Market: Snapshot

Underfill materials are necessary composite formulations made of organic polymers and inorganic fillers. These materials find their application in packaging of semiconductor for enhancing their thermochemical performance. Underfill materials are being excessively used in the packaging of semiconductor packaging because of their outstanding rework ability and thermal stability.

The global market for underfill market could be segmented in terms of the different product types, application, and region. Such in depth and decisive market segmentation of the global underfill material market provided by the report aids in understating the overall growth prospects and the future outlook of the different segments of the market and thus, helping the potential buyers to make informed decisions while investing in the market.

The report on underfill material market offers the analysis and forecast on regional as well as global level. It offers historical data of the year 2015 along with the anticipated data of 2016, and a forecast data up to year 2024 in terms of volume and revenue. The report also offers key driving and restraining factors for the growth of the global underfill materials market and their effect on every region over the course of the given forecast period. The research report on the global market for underfill materials offers crucial growth prospects and prominent trends and opportunities that may come up in the market over the course of the given forecast period. The research report is the result of in-depth and extensive primary as well as secondary research methodologies backed by crucial market insights offered by the industry professionals. The report on the global underfill material market also gives valuable information of end users and suppliers.

Global Underfills Materials Market: Trends and Opportunities

The need for underfill materials is chiefly determined by the need for the shrinking of electronic devices, lifted electrical performance, small sizes of products, and enhanced interconnect densities. The need for improving the reliability of packages of flip chip over numerous industries. The use of underfill materials has shown evidence of providing a few benefits to packaging of electronics. For instance, improved resistance with respect to thermal cycling, stress on solder bumps, and better designs of chips, thus optimizing the dependability of numerous flip chip products. This is expected to be an important factor driving the overall development of the global underfill materials market. Similarly, the push for smaller and more stable printed circuit boards to be used as a part of the high tech integrated systems customer mobile devices has also helped in driving the global market.

Global Underfills Materials Market: Geographical Segmentation

In terms of geographical segmentation, the global underfill materials market can be segmented into key regions such as Latin America, Asia Pacific, the Middle East and Africa, Europe, and North America. Over the course of the forecast period, the Asia Pacific market for underfill materials market is expected to show most promising growth rate and estimated to develop at an impressive CAGR of 9.7% in terms of revenue generated in the market. The development of Asia Pacific market for underfill material is expected to be driven chiefly due to the high adoption of these materials in industries based out in China. Other regions such as North America and Europe are expected to show great demand for underfill materials over the coming years.

Global Underfill Material Market: Key Market Players

Some of the key players in the global underfills materials market include names such as Yincae Advanced Material LLC, AIM Metals & Alloys LP, Won Chemicals Co. Ltd., and Epoxy Technology among others.

Market Segmentation


  • Capillary Underfill Material (CUF)
  • No Flow Underfill Material (NUF)
  • Molded Underfill Material (MUF)


  • Flip Chips
  • Ball Grid Array (BGA)
  • Chip Scale Packaging (CSP)


  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa (MEA)

This report gives access to decisive data, such as:

  • Market growth drivers
  • Factors limiting market growth
  • Current market trends
  • Market structure
  • Market projections for the coming years

Key highlights of this report include:

  • Overview of key market forces propelling and restraining market growth
  • Up-to-date analyses of market trends and technological improvements
  • Pin-point analyses of market competition dynamics to offer you a competitive edge
  • An analysis of strategies of major competitors
  • An array of graphics and SWOT analysis of major industry segments
  • Detailed analyses of industry trends
  • A well-defined technological growth map with an impact-analysis
  • Offers a clear understanding of the competitive landscape and key product segments

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