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Published Date: 2016-11-18Number of Pages: 150

Underfill Material Market (Product - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), and Molded Underfill Material (MUF); Application - Flip Chips, Ball Grid Array (BGA), and Chip Scale Packaging (CSP)) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

Global Underfill Material Market: Snapshot

Underfill materials are essentially composite formulations made out of inorganic fillers and organic polymers. These materials are used in semiconductor packaging for improving the thermo-mechanical performance. Underfill materials are being extensively used in semiconductor packaging due to their remarkable thermal stability and reworkability. According to the research report by Transparency Market Research, the global underfill material market is expected to be worth US$448.3 mn by the end of 2024 as compared to US$220.4 mn in 2015. Analysts predict that the global market will expand at a CAGR of 8.3% during the forecast period of 2016 and 2024.

Booming Electronic Industry Fuels Uptake of Underfill Materials

The market for underfill materials is expected to witness remarkable surge due to the growing demand of mobile electronic products. The soaring demand for lighter, smaller, and faster electronic products is expected to increase the uptake of underfill materials in the near future as they offer the right amount of mechanical strength to solder joints of PCB and improve impact resistance. The key advantage of underfill material is their ability to enhance the thermal cycling resistance, which also improves its overall reliability. The growing demand for flip chip technology and rising popularity of copper pillars are projected to have a positive influence on the robust growth of the underfill material market during the forecast period. The factors holding the market back are the intensifying pressure of downward pricing and expensive cost of materials.

underfill material market

 

CUF Segment to Progress at 9.5% CAGR 2016–2024

The types of products available in the global underfill material market are capillary underfill material (CUF), molded underfill material (MUF), and no flow underfill material (NUF). Analysts anticipate that the CUF segment will lead the global market during the forecast years. During the forecast years of 2016 and 2024, the capillary underfill material is projected to expand at a CAGR of 9.5%. On the basis of application, the underfill material is segmented into flip chips, ball grid array, and chip scale packaging. Of these, the flip chip segment is likely to garner a share of 52.6 % in the global market. The research report shows that that flip chip segment is likely to dominate the global market in the coming years as well.

Asia Pacific to Assume Lead as China Exhibits High Demand for Underfill Materials

In terms of geography, the global underfill material market is segmented into Asia Pacific, Latin America, North America, Europe, and the Middle East and Africa. Over the forecast years, Asia Pacific is projected to show remarkable progress in the global market as it is likely to register a CAGR of 9.7% in terms of market revenue. The growth of Asia Pacific underfill material market will be dictated by the high uptake of these materials in China-based industries. The booming electronic sector of China and the persistent manufacturing industry of the country are expected to make a significant contribution to the market. Furthermore, Europe and North America will also show a huge demand for underfill materials in the near future. On the other hand, the Middle East and Africa and Latin America are projected to experience relatively moderate growth rate of underfill market during the forecast period.

The important players leading the global underfill material market are Epoxy Technology Inc., Henkel AG & Co. KgaA, H.B. Fuller, Yincae Advanced Material, LLC, NAMICS Corporation, Master Bond Inc., Zymet Inc., Won Chemicals Co. Ltd., and AIM Metals & Alloys LP.

Global Underfill Material Market: Snapshot

The “Underfill Material Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2016–2024,” report provides forecast and analysis of the underfill material market on the global and regional level. The primary objective of the report is to identify opportunities in the market and present updates as well as insights pertaining to various segments of the global underfill material market. The study provides historic data of 2015 along with forecast from 2016 to 2024 based on volume (kg) and revenue (US$ Mn). It includes drivers, restraints and the ongoing trend of the underfill material market along with their impact on demand during the forecast period. The underfill material report also comprises the study of opportunities available in the market for underfill material on the global and regional level. It includes value chain analysis with list of underfill material suppliers and end users.

In order to provide the users of this report with comprehensive view of underfill materail market, we have included detailed competitiveness analysis and company players of the industry. The competitive dashboard provides detailed comparison of underfill material producer on parameters such as company’s revenue, employee strength, unique selling propositions and key strategic developments. The study of underfill material market encompasses market attractiveness analysis, by product type, application type and by geographic region.

Global Underfill Material Market: Scope

Market statistics have been estimated based on average consumption and weighted average pricing of product type in underfill material market and the revenue is derived through regional pricing trends. Market size and forecast for each segment have been provided in the context of global and regional markets. The underfill material market has been analyzed based on expected demand. Prices considered for the calculation of revenue are average regional prices obtained through primary quotes from numerous underfill material producers, suppliers, and distributors.

Global Underfill Material Market: Segmentation

All key end users have been considered and potential applications have been estimated on the basis of secondary sources and feedback from primary respondents. Regional demand patterns have been considered while estimating the market for various end users of underfill material in different regions. Top-down approach has been used to estimate the underfill material market by regions. Market numbers for global product type and application segments have been derived using the bottom-up approach, which is cumulative of each regions demand. The market of underfill material has been forecast based on constant currency rates.

A number of primary and secondary sources were consulted during the course of the study of underfill material market. Secondary sources include Factiva, World Bank, SEMI, The Semiconductor Industry Association, World Semiconductor Trade Statistics, Hoover’s, and company’s annual report and publications.

The report begins with an overview of the global underfill material market, evaluating market performance in terms of revenue, key trends, drivers, and restraints witnessed in the global market. Impact analysis of the key growth drivers and restraints based on the weighted average model is also included in the report.

Key Players Mentioned in this Report are:

The report provides detailed competitive outlook including company profiles of key participants operating in the global market. Some of the key players in the global underfill material market are Henkel AG & Co. KgaA, H.B. Fuller, NAMICS Corporation, Epoxy Technology Inc, Yincae Advanced Material, LLC, Master Bond Inc, Zymet Inc, AIM Metals & Alloys LP, Won Chemicals Co. Ltd.

The global Underfill material market is segmented below:

By Product Type

  • Capillary Underfill Material (CUF)
  • No Flow Underfill Material (NUF)
  • Molded Underfill Material (MUF)

By Application

  • Flip Chips
  • Ball Grid Array (BGA)
  • Chip Scale Packaging (CSP)

By Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East and Africa (MEA)


 
 
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