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Published Date: 2017-03-03Number of Pages: 175

Thin Wafer Processing and Dicing Equipment Market (Application - Logic and Memory, Micro Electro Mechanical Systems (MEMS), Power Device, Radio Frequency Identification (RFID), and CMOS Image Sensor; Wafer Thickness - 750 micrometer, 120 micrometer, and 50 micrometer; Dicing Technology - Blade Dicing, Laser Dicing, and Plasma Dicing) - Global Industry Analysis, Trend, Size, Share and Forecast 2016 - 2024

Global Thin Wafer Processing and Dicing Equipment Market: Snapshot

The recent increase in the demand for portable communication devices, such as smartphones, memory cards, smart card, and various computing devices has boosted the global market for thin wafer processing and dicing equipment substantially. In 2015, the global market for thin wafer processing and dicing equipment garnered US$388.9 mn in revenues, which, with an expected CAGR of 6.80% between 2016 and 2024, is likely to increase to US$692.5 mn by the end of 2024.

The rising awareness about the attributes and benefits of thin wafer processing and dicing equipment, such as better electrical performance and reduced production cost of the device, is likely to support the growth of this market significantly over the next few years.

thin wafer processing dicing equipment market

Although Demand for Blade Dicing to Remain High, Laser Dicing to Emerge more Lucrative

Blade dicing, plasma dicing, and laser dicing are the three main dicing technologies utilized in wafer processing and dicing equipment. Among these, blade dicing, which is traditional dicing technology, has acquired the leading the global market and is predicted to remain dominant over the period of the forecast.

Laser dicing technology, however, is likely to prove to be more lucrative for manufacturers in the near future due to low operating cost and kerf loss, leading to an increased production of chips. Various attributes, such as high-speed dicing and superior breakage strength is also projected to add to the popularity of laser dicing, reflecting greatly on its demand over the next few years.

Asia Pacific to Retain Dominance Through 2024

North America, the Middle East and Africa, Europe, Latin America, Asia Pacific are the key regional markets for thin wafer processing and dicing equipment. Asia Pacific dominated the global market with a share of 64.2% in 2015 and is anticipated to remain leading over the forthcoming years, thanks to the increasing uptake of thin wafer processing and dicing equipment in small consumer electronics devices, specifically in mobile phones, and several other devices used for communication and computing.

Along with this, the growing usage of these instruments in semiconductors is also projected to boost this regional market in the years to come. China, Taiwan, and Japan have emerged as the main domestic markets for thin wafer and dicing equipment in this region on account of providing lucrative opportunities to the manufacturers of thin wafer processing and dicing equipment.

North America, which held the second position in 2015, is also expected to witness a healthy rise in the valuation of its market by the end of 2024. The swift technological advancements in consumer electronic devices, in a bid to develop state-of-art smart home devices and wearables, are anticipated to fuel the demand for small integrated circuits, which in turn, is expected to influence the uptake of thin wafers, consequently, boosting the demand for thin wafer processing and dicing equipment over the forthcoming years.

EV Group, Lam Research Corp, Plasma-Therm LLC, DISCO Corp., Tokyo Electron Ltd., Advanced Dicing Technologies, Suzhou Delphi Laser Co. Ltd., SPTS Technologies Ltd., Tokyo Seimitsu Co. Ltd., and Panasonic Corp. are some of the leading producers of thin wafer processing and dicing equipment across the world.

Chapter 01 Preface
1.1. Report Scope and Market Segmentation 
1.2. Research Highlights

Chapter 02 Assumptions and Research Methodology
2.1. Assumptions and Acronyms Used
2.2. Research Methodology

Chapter 03 Executive Summary
3.1. Executive Summary

Chapter 04 Market Dynamics
4.1. Overview
4.2. Drivers and Restraints Snapshot Analysis
       4.2.1. Drivers
       4.2.2. Restraints
       4.2.3. Opportunity Analysis
4.3. Thinning and Packaging Constraints
4.4. Advanced Packaging Trends Impacting Thinning and Dicing Needs
4.5. Porter’s Five Forces Analysis

Chapter 05 Thin Wafer Processing and Dicing Equipment Market Analysis, by Application
5.1. Introduction
5.2. Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
5.3. Global Thin Wafer Processing and Dicing Equipment Market Forecast, by Application
5.4. Global Thin Wafer Processing and Dicing Equipment Market Forecast, by Application
5.5. Global Thin Wafer Processing and Dicing Equipment Market: Attractiveness Analysis

Chapter 06 Thin Wafer Processing and Dicing Equipment Market Analysis, by Technology
6.1. Introduction
6.2. Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Dicing Technology
6.3. Global Thin Wafer Processing and Dicing Equipment Market Forecast, by Dicing Technology
6.4. Global Thin Wafer Processing and Dicing Equipment Market Forecast, by Dicing Technology
6.5. Global Thin Wafer Processing and Dicing Equipment Market: Attractiveness Analysis

Chapter 07 Thin Wafer Processing and Dicing Equipment Market Analysis, by Wafer Thickness
7.1. Introduction
7.2. Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Wafer Thickness
7.3. Global Thin Wafer Processing and Dicing Equipment Market Forecast, by Wafer Thickness
7.4. Global Thin Wafer Processing and Dicing Equipment Market: Attractiveness Analysis

Chapter 08 Thin Wafer Processing and Dicing Equipment Market Analysis, by Region
8.1. Geographical Scenario
8.2. Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Region
8.3. Global Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Region
8.4. Global Thin Wafer Processing and Dicing Equipment Market: Attractiveness Analysis

Chapter 09 North America Thin Wafer Processing and Dicing Equipment Market Analysis
9.1. Key Trends Analysis
9.2. North America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
9.3. North America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Application
9.4. North America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness
9.5. North America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Wafer Thickness
9.6. North America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology
9.7. North America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Dicing Technology
9.8. North America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Country
9.9. North America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Country

Chapter 10 Europe Thin Wafer Processing and Dicing Equipment Market Analysis
10.1. Key Trends Analysis
10.2. Europe Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
10.3. Europe Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Application
10.4. Europe Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness
10.5. Europe Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Wafer Thickness
10.6. Europe Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology
10.7. Europe Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Dicing Technology
10.8. Europe Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Country
10.9. Europe Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Country

Chapter 11 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Analysis
11.1. Key Trends Analysis
11.2. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
11.3. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Application
11.4. Asia Pacific Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness
11.5. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Wafer Thickness
11.6. Asia Pacific Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology
11.7. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Dicing Technology
11.8. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Country
11.9. Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Country

Chapter 12 Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Analysis
12.1. Key Trends Analysis
12.2. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
12.3. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Application
12.4. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness
12.5. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Wafer Thickness
12.6. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology
12.7. Middle- East and Africa (MEA)Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Dicing Technology
12.8. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Country
12.9. Middle- East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Country

Chapter 13 Latin America Thin Wafer Processing and Dicing Equipment Market Analysis
13.1. Key Trends Analysis
13.2. Latin America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Application
13.3. Latin America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Application
13.4. Latin America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness
13.5. Latin America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Wafer Thickness
13.6. Latin America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology
13.7. Latin America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Dicing Technology
13.8. Latin America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Country
13.9. Latin America Thin Wafer Processing and Dicing Equipment Market Revenue Analysis, by Country

Chapter 14 Company Profiles
14.1 Competitive Land Scape
14.2. EV Group  
       14.2.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.2.2. Market Presence, By Segment and Geography
       14.2.3. Strategic Overview
       14.2.4. SWOT analysis
       14.2.5. Strategic Overview
14.3. Lam Research Corporation 
       14.3.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.3.2. Market Presence, By Segment and Geography
       14.3.3. Strategic Overview
       14.3.4. SWOT analysis
       14.3.5. Strategic Overview
14.4. DISCO Corporation
       14.4.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.4.2. Market Presence, By Segment and Geography
       14.4.3. Strategic Overview
       14.4.4. SWOT analysis
       14.4.5. Strategic Overview
14.5. Plasma-Therm, LLC 
       14.5.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.5.2. Market Presence, By Segment and Geography
       14.5.3. Strategic Overview
       14.5.4. SWOT analysis
       14.5.5. Strategic Overview
14.6. Tokyo Electron Ltd.
       14.6.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.6.2. Market Presence, By Segment and Geography
       14.6.3. Strategic Overview
       14.6.4. SWOT analysis
       14.6.5. Strategic Overview
14.7. Advanced Dicing Technologies 
       14.7.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.7.2. Market Presence, By Segment and Geography
       14.7.3. Strategic Overview
       14.7.4. SWOT analysis
       14.7.5. Strategic Overview
14.8. SPTS Technologies Ltd.
       14.8.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.8.2. Market Presence, By Segment and Geography
       14.8.3. Strategic Overview
       14.8.4. SWOT analysis
       14.8.5. Strategic Overview
14.9.  Suzhou Delphi Laser Co. Ltd.
       14.9.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.9.2. Market Presence, By Segment and Geography
       14.9.3. Strategic Overview
       14.9.4. SWOT analysis
       14.9.5. Strategic Overview
14.10. Panasonic Corporation
       14.10.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.10.2. Market Presence, By Segment and Geography
       14.10.3. Strategic Overview
       14.10.4. SWOT analysis
       14.10.5. Strategic Overview
14.11. Tokyo Seimitsu Co. Ltd.
       14.11.1. Company Details (HQ, Foundation Year, Employee Strength)
       14.11.2. Market Presence, By Segment and Geography
       14.11.3. Strategic Overview
       14.11.4. SWOT analysis
       14.11.5. Strategic Overview

List of Figures 

Figure 1 Market Segmentation 
Figure 2 Research Methodology
Figure 3 Market Snapshot
Figure 4 Drivers and Restraints Snapshot Analysis
Figure 5 Opportunity Analysis
Figure 6 Porter’s Five Forces Analysis
Figure 7 Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Product Type, 2015 and 2024
Figure 8 Global Logic and Memory Market Revenue (USD Mn), 2015 – 2024
Figure 9 Global MEMS Market Revenue (USD Mn), 2015 – 2024
Figure 10 Global Power Device Market Revenue (USD Mn), 2015 – 2024
Figure 11 Global RFID Market Revenue (USD Mn), 2015 – 2024
Figure 12 Global CMOS Image Sensor Market Revenue (USD Mn), 2015 – 2024
Figure 13 Market Attractiveness Analysis, by Application, 2015
Figure 14 Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 15 Global Blade Dicing Technology Market Revenue (USD Mn), 2015 – 2024
Figure 16 Global Laser Dicing Technology Market Revenue (USD Mn), 2015 – 2024
Figure 17 Global Plasma Dicing Technology Market Revenue (USD Mn), 2015 – 2024
Figure 18 Market Attractiveness Analysis, by Dicing Technology, 2015
Figure 19 Global Wafer Processing and Dicing Equipment Market Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 20 Global 750 μm Thick Wafer Market Revenue (USD Mn), 2015 – 2024
Figure 21 Global 120 μm Thick Wafer Market Revenue (USD Mn), 2015 – 2024
Figure 22 Global 50 μm Thick Wafer Market Revenue (USD Mn), 2015 – 2024
Figure 23 Market Attractiveness Analysis, by Wafer Thickness, 2015
Figure 24 Geographical Scenario
Figure 25 Global Thin Wafer Processing and Dicing Equipment Market Value Share Analysis, by Region, 2015 and 2024
Figure 26 Market Attractiveness Analysis, by Region, 2015
Figure 27 North America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Application, 2015 and 2024
Figure 28 North America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 29 North America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 30 North America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Country, 2015 and 2024
Figure 31 Europe Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Application, 2015 and 2024
Figure 32 Europe Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 33 Europe Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 34 Europe Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Country, 2015 and 2024
Figure 35 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Application, 2015 and 2024
Figure 36 Asia Pacific Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 37 Asia Pacific Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 38 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Country, 2015 and 2024
Figure 39 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Application, 2015 and 2024
Figure 40 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 41 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 42 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Country, 2015 and 2024
Figure 43 Latin America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Application, 2015 and 2024
Figure 44 Latin America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Wafer Thickness, 2015 and 2024
Figure 45 Latin America Thin Wafer Processing and Dicing Equipment Market, Value Share Analysis, by Dicing Technology, 2015 and 2024
Figure 46 Latin America Thin Wafer Processing and Dicing Equipment Market Value Share Analysis by Country, 2015 and 2024

List of Tables

Table 1 Global Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 2 Global Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 3 Global Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 4 Global Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Region, 2015 – 2024
Table 5 North America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 6 North America Wafer Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 7 North America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 8 North America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Country, 2015 – 2024
Table 9 Europe Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 10 Europe Wafer Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 11 Europe Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 12 Europe Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Country, 2015 – 2024
Table 13 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 14 Asia Pacific Wafer Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 15 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 16 Asia Pacific Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Country, 2015 – 2024
Table 17 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 18 Middle-East and Africa (MEA) Wafer Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 19 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 20 Middle-East and Africa (MEA) Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Country, 2015 – 2024
Table 21 Latin America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Application, 2015 – 2024
Table 22 Latin America Wafer Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Wafer Thickness, 2015 – 2024
Table 23 Latin America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Dicing Technology, 2015 – 2024
Table 24 Latin America Thin Wafer Processing and Dicing Equipment Market Revenue (USD Mn) and Forecast, by Country, 2015 – 2024

Global Thin Wafer Processing and Dicing Equipment Market: Overview

Rising demand for three dimensional integrated circuit used extensively across various miniature semiconductor devices is one of the important factor anticipated to boost the demand for thin wafer processing and dicing equipment in the coming years. Three dimensional integrated circuit are increasingly adopted across various space constrained applications including portable consumer electronic devices, sensors, MEMS and industrial products as it increases the overall performance of the products in terms of speed, durability, low power consumption, light weight and memory.

Moreover, three dimensional integrated circuit also helps to reduce the area of consumption in a printed circuit board and in turn enables extensive cost reduction. Thin wafer of thickness 20 um – 50 um is an integral part of the three dimensional integrated circuit technology. Thus, anticipated increasing demand for three dimensional integrated circuit in turn is predicted to boost the demand for thin wafer processing equipment during the forecast period from 2016 to 2024.

Global Thin Wafer Processing and Dicing Equipment Market: Segmentation

For the purpose of providing an exhaustive analysis of the thin wafer processing and dicing equipment market across the globe, the market has been segmented on the basis of application, dicing technology, wafer size and geography. Thin wafer finds are used extensively across various application sectors including logic and memory, MEMS (Micro Electro Mechanical Systems), power device, RFID (Radio Frequency Identification) and CMOS image sensor. Moreover, different technology used in the process of dicing thin wafer including blade dicing, laser dicing and plasma dicing is also covered within our scope of research.

Different laser dicing procedure such as laser ablation and stealth dicing has also been considered to track the market estimate of laser dicing technology. In addition, different application and dicing technology segment has been further classified on the basis of wafer thickness such as 750 μm, 120 μm and 50 μm. Furthermore, information relating to the current market trend and future expected market growth of the application, technology and wafer thickness segment across different regions including Asia Pacific, North America, Europe, Middle-East and Africa (MEA) and Latin America is also provided within the report.

Global Thin Wafer Processing and Dicing Equipment Market: Scope of the Study

The report provides assessment of different drivers that is impacting the global market, along with the restraints and opportunities that are anticipated to affect the demand of thin wafer processing and dicing equipment in the coming years. For each segment (such as application, dicing technology and wafer size), market dynamics analysis has also been provided in this report. All these factors helps in determining different trends that has been impacting the overall market growth. Moreover, after taking into consideration all this factors, an extensive analysis of the region wise growth parameters of thin wafer processing and dicing equipment market along with the overall assessment during the forecast period of 2016-2024 has been also been furnished within this report.

Furthermore, the report includes porter’s five forces analysis in order to understand the level of competition exist within the industry. Moreover, various wafer thinning and packaging constraints coupled with advanced packaging trend that are anticipated to affect the demand of the thin wafer processing and dicing equipment is also covered within our scope of research. The market attractiveness analysis in respect of application, dicing technology, wafer thickness and geography is also provided in this report in order to provide deep insight regarding the market.

Companies Mentioned in the Report

The major players in the thin wafer processing and dicing equipment market have been profiled competitively across the different broad geographical regions. In addition, the report also provides competitive analysis of the market players in which the leading strategies adopted by the key players to maintain their leading position in the market and the market share of the leading players in terms of percentage has also been highlighted in this report. Some of the major players operating the thin wafer processing and dicing equipment market includes Disco Corporation (Japan), Plasma Therm  LLC (USA), Tokyo Electron Ltd (Japan)and EV Group (Austria)among others.

The global thin wafer processing and dicing equipment market has been segmented as follows:

By Application

  • Logic and Memory
  • MEMS (Micro Electro Mechanical Systems)
  • Power Device
  • RFID (Radio Frequency Identification)
  • CMOS Image Sensor

By Dicing Technology

  • Blade Dicing
  • Laser Dicing
  • Plasma Dicing

By Wafer Thickness

  • 750 μm
  • 120 μm
  • 50 μm

By Geography

  • North America
    • The U.S.
    • Canada
    • Mexico
  • Europe
    • U.K
    • Germany
    • Eastern Europe including Russia
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Taiwan
    • Korea
    • Rest of Asia Pacific
  • Middle East and Africa
    • United Arab Emirates
    • Israel
    • Rest of Middle East and Africa
  • Latin America
    • Brazil
    • Argentina
    • Rest of Latin America


 
 
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