Three-dimensional Integrated Circuit Market Introduction
A three-dimensional integrated circuit commonly referred as 3D IC, is a component in microelectronics which is manufactured by assembling silicon wafers or dies and connecting them vertically by using copper to copper connections or Through-Silicon Via (TSVs). It acts as a single device to reduce power consumption and improve performance than two-dimensional processes. The main objective to design three-dimensional integrated circuits is to achieve electrical performance benefits. The global three-dimensional integrated circuit market has shown commendable growth since last few decades and is expected to grow at a decent pace in the next coming future.
Three-dimensional Integrated Circuit Market- Competitive Landscape
- SK Hynix is planning to buy the part of MagnaChip Semiconductor Corp. According to the Maeil Business Newspaper in South Korea, the company is planning to buy MagnaChip’s factory in South Korea and its foundry business.
- Samsung recently announced US$ 116 billion investment in the non-memory chip research and development and production infrastructure. The move by Samsung to sell the chip to other companies is to take its competitors like Intel, Qualcomm, and TSMC.
United Microelectronics Corporation
Established in 1980, United Microelectronics Corporation is located in Taiwan. The company manufactures integrated circuit wafers for the semiconductor companies. It also provides mask tooling, circuit design, testing and assembly services, and wafer fabrication. The company serves fabless design companies.
Founded in 1987, STMicroelectronics is located in Switzerland. The company provides energy-efficient and intelligent solutions and products for electronic devices. it also specializes in sensors, MEMS & amp, application processors, smart power, automotive, and Microcontrollers.
Amkor Technology, Inc.
Established in 1968, Amkor Technology, Inc. is located in the US. The company provides test services and semiconductor product packaging. It also provides wafer probes, wafer bumps, wafer back-grinds, and packaging. The company offers wafer-level-fan-out packages used in integrated circuits.
Jiangsu Changjiang Electronics Technology Co
Founded in 1972, Jiangsu Changjiang Electronics Technology Co is located in China. The company provides packaging and testing integrated circuits. Some of the products offered by the company includes schottky, switching, TVS, pin, schottky rectifier diodes, regulator circuits, and zener. The company also provides laminate packaging products and materials.
Three-dimensional Integrated Circuit Market Dynamics
Miniaturization of Consumer Electronics Driving Demand for Three-dimensional Integrated Circuit
With the growing demand for miniaturization of consumer electronics and communication technology, a three-dimensional integrated circuit is being considered as an ideal solution as it enables the development of high performing microchips with the low-power consumption capability and small form factor. High-speed data processing, transmission, smart and connected devices, enhanced storage capacity, and high brightness lighting are some of the key requirements of modern electronic devices and key driving factors behind the growth of three-dimensional integrated circuit market.
Moreover, the development of high performance networking devices with large storage capacity need huge bandwidth. To manage the bandwidth and memory challenges, companies are adopting three- dimensional integrated circuit technology owing to its chip density and high bandwidth benefits.
Manufacturers Designing Three-dimensional Integrated Circuit to Work with Numerous Applications
High propagation of Internet of Things (IoT) devices and smart connected products, manufacturers in the three-dimensional integrated circuit market are designing and manufacturing three-dimensional integrated circuits to employ with various application such as Micro-Electro-Mechanical Systems (MEMS) and sensors to capture the real-time data to improve productivity, streamline the processes, and reduce chances of sudden failure and prevent downtime. Use of sensors in devices and machines are influencing manufacturers in the three-dimensional integrated circuit market to design a new product that works efficiently with new and advanced devices and machines.
High Cost of 3D ICs to Hamper the Growth of Three-dimensional Integrated Circuit Market
High cost has been identified as the biggest challenge in the commercialization of three-dimensional integrated circuits in the mainstream consumer application. The cost of the manufacturing process is also high and cost drivers are identified by analyzing the activities that form the base of developing three-dimensional integrated circuits. In addition, labor, tooling cost, material cost, yield cost, and equipment cost also adds to the total cost of three-dimensional integrated circuits. However, manufacturers in the three-dimensional integrated circuit market are focusing on the areas where cost has the potential to be reduced.
Other challenges facing the three-dimensional integrated circuit market are lack of standards, design complexity, heat building up with the stack, and heterogeneous integration supply chain.
Three-dimensional Integrated Circuit Market Segmentation
Based on the technology, the three-dimensional integrated circuit market is segmented into
- Through-Silicon Via (TSV)
- Silicon Interposer
- Through-Glass Via
Based on the application, the three-dimensional integrated circuit market is segmented into
Based on the end-use industry, the three-dimensional integrated circuit market is segmented into
- Consumer Electronics
- IT and Telecommunication
- Military and Defense
The report on three-dimensional integrated circuit market is a compilation of first-hand information, qualitative and quantitative assessment by industry analysts, inputs from industry experts and industry participants across the value chain. The three-dimensional integrated circuit market report provides in-depth analysis of parent market trends, macroeconomic indicators and governing factors along with market attractiveness as per segments. The three-dimensional integrated circuit market report also maps the qualitative impact of various market factors on market segments and geographies.
Regional analysis for three-dimensional integrated circuit market includes:
- North America
- Latin America
- Western Europe
- Eastern Europe
- Asia Pacific excluding Japan (APEJ)
- Middle East & Africa (MEA)
The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.
The study is a source of reliable data on:
- Market segments and sub-segments
- Market trends and dynamics
- Supply and demand
- Market size
- Current trends/opportunities/challenges
- Competitive landscape
- Technological breakthroughs
- Value chain and stakeholder analysis
The regional analysis covers:
- North America (U.S. and Canada)
- Latin America (Mexico, Brazil, Peru, Chile, and others)
- Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
- Eastern Europe (Poland and Russia)
- Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
- Middle East and Africa (GCC, Southern Africa, and North Africa)
The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.
A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.
Highlights of the report:
- A complete backdrop analysis, which includes an assessment of the parent market
- Important changes in market dynamics
- Market segmentation up to the second or third level
- Historical, current, and projected size of the market from the standpoint of both value and volume
- Reporting and evaluation of recent industry developments
- Market shares and strategies of key players
- Emerging niche segments and regional markets
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