Three-dimensional Integrated Circuit Market Introduction

A three-dimensional integrated circuit commonly referred as 3D IC, is a component in microelectronics which is manufactured by assembling silicon wafers or dies and connecting them vertically by using copper to copper connections or Through-Silicon Via (TSVs). It acts as a single device to reduce power consumption and improve performance than two-dimensional processes. The main objective to design three-dimensional integrated circuits is to achieve electrical performance benefits. The global three-dimensional integrated circuit market has shown commendable growth since last few decades and is expected to grow at a decent pace in the next coming future.    

Three-dimensional Integrated Circuit Market- Competitive Landscape

  • SK Hynix is planning to buy the part of MagnaChip Semiconductor Corp. According to the Maeil Business Newspaper in South Korea, the company is planning to buy MagnaChip’s factory in South Korea and its foundry business.
  • Samsung recently announced US$ 116 billion investment in the non-memory chip research and development and production infrastructure. The move by Samsung to sell the chip to other companies is to take its competitors like Intel, Qualcomm, and TSMC.

United Microelectronics Corporation

Established in 1980, United Microelectronics Corporation is located in Taiwan. The company manufactures integrated circuit wafers for the semiconductor companies. It also provides mask tooling, circuit design, testing and assembly services, and wafer fabrication. The company serves fabless design companies.


Founded in 1987, STMicroelectronics is located in Switzerland. The company provides energy-efficient and intelligent solutions and products for electronic devices. it also specializes in sensors, MEMS & amp, application processors, smart power, automotive, and Microcontrollers.   

Amkor Technology, Inc.

Established in 1968, Amkor Technology, Inc. is located in the US. The company provides test services and semiconductor product packaging. It also provides wafer probes, wafer bumps, wafer back-grinds, and packaging. The company offers wafer-level-fan-out packages used in integrated circuits.

Jiangsu Changjiang Electronics Technology Co

Founded in 1972, Jiangsu Changjiang Electronics Technology Co is located in China. The company provides packaging and testing integrated circuits. Some of the products offered by the company includes schottky, switching, TVS, pin, schottky rectifier diodes, regulator circuits, and zener. The company also provides laminate packaging products and materials. 

Three-dimensional Integrated Circuit Market Dynamics

Miniaturization of Consumer Electronics Driving Demand for Three-dimensional Integrated Circuit

With the growing demand for miniaturization of consumer electronics and communication technology, a three-dimensional integrated circuit is being considered as an ideal solution as it enables the development of high performing microchips with the low-power consumption capability and small form factor. High-speed data processing, transmission, smart and connected devices, enhanced storage capacity, and high brightness lighting are some of the key requirements of modern electronic devices and key driving factors behind the growth of three-dimensional integrated circuit market.

Moreover, the development of high performance networking devices with large storage capacity need huge bandwidth. To manage the bandwidth and memory challenges, companies are adopting three- dimensional integrated circuit technology owing to its chip density and high bandwidth benefits.

Manufacturers Designing Three-dimensional Integrated Circuit to Work with Numerous Applications

High propagation of Internet of Things (IoT) devices and smart connected products, manufacturers in the three-dimensional integrated circuit market are designing and manufacturing three-dimensional integrated circuits to employ with various application such as Micro-Electro-Mechanical Systems (MEMS) and sensors to capture the real-time data to improve productivity, streamline the processes, and reduce chances of sudden failure and prevent downtime. Use of sensors in devices and machines are influencing manufacturers in the three-dimensional integrated circuit market to design a new product that works efficiently with new and advanced devices and machines.

High Cost of 3D ICs to Hamper the Growth of Three-dimensional Integrated Circuit Market

High cost has been identified as the biggest challenge in the commercialization of three-dimensional integrated circuits in the mainstream consumer application. The cost of the manufacturing process is also high and cost drivers are identified by analyzing the activities that form the base of developing three-dimensional integrated circuits. In addition, labor, tooling cost, material cost, yield cost, and equipment cost also adds to the total cost of three-dimensional integrated circuits. However, manufacturers in the three-dimensional integrated circuit market are focusing on the areas where cost has the potential to be reduced.  

Other challenges facing the three-dimensional integrated circuit market are lack of standards, design complexity, heat building up with the stack, and heterogeneous integration supply chain.

Three-dimensional Integrated Circuit Market Segmentation

Based on the technology, the three-dimensional integrated circuit market is segmented into

  • Through-Silicon Via (TSV)
  • Silicon Interposer
  • Through-Glass Via
  • Others

Based on the application, the three-dimensional integrated circuit market is segmented into

  • Sensor
  • LED
  • Logic
  • MEMS
  • Memory
  • Others

Based on the end-use industry, the three-dimensional integrated circuit market is segmented into

  • Consumer Electronics
  • Industrial
  • IT and Telecommunication
  • Healthcare
  • Military and Defense
  • Automotive
  • Others

This study by TMR is all-encompassing framework of the dynamics of the market. It mainly comprises critical assessment of consumers' or customers' journeys, current and emerging avenues, and strategic framework to enable CXOs take effective decisions.

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The study strives to evaluate the current and future growth prospects, untapped avenues, factors shaping their revenue potential, and demand and consumption patterns in the global market by breaking it into region-wise assessment.

The following regional segments are covered comprehensively:

  • North America
  • Asia Pacific
  • Europe
  • Latin America
  • The Middle East and Africa

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The report sheds light on various aspects and answers pertinent questions on the market. Some of the important ones are:

1. What can be the best investment choices for venturing into new product and service lines?

2. What value propositions should businesses aim at while making new research and development funding?

3. Which regulations will be most helpful for stakeholders to boost their supply chain network?

4. Which regions might see the demand maturing in certain segments in near future?

5. What are the some of the best cost optimization strategies with vendors that some well-entrenched players have gained success with?

6. Which are the key perspectives that the C-suite are leveraging to move businesses to new growth trajectory?

7. Which government regulations might challenge the status of key regional markets?

8. How will the emerging political and economic scenario affect opportunities in key growth areas?

9. What are some of the value-grab opportunities in various segments?

10. What will be the barrier to entry for new players in the market?

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Three Dimensional Integrated Circuit Market

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