With the demand for semiconductors rising at an unprecedented rate, ancillary service sectors for the core semiconductor industry, including semiconductor testing and packaging, is witnessing a renaissance too. Innovations in semiconductor packaging and scope for the full-range back-end testing of semiconductors offered by some leading companies are prolific developments in the expanse of semiconductor assembly and test services market.
The emergence of 3D semiconductor assemblies is deemed revolutionary in the scope of semiconductor assembly methodologies. This has enabled the entire electronics industry to maximize the functionality of its products. The integration of multiple die elements within a single package framework has enabled product boards to be significantly smaller than their predecessors. Further, due to shorter interconnection, this has helped improve the electrical performance and functional capability of semiconductors. Resultantly, this translates into a plus for the uptake of 3D semiconductor assemblies.
For semiconductor assemblies, multiple die packaging commonly uses some substrate as a base. Precisely, a semiconductor assembly on a substrate is akin to the one used for standard integrated circuit (IC) packaging on lead frames. Nonetheless, serving to be an advantage, the range of materials for substrate-based IC packaging is wide, along with several alternatives for the assembly of IC packaging. This holds scope for the expanse of substrate materials and packaging assemblies for semiconductors.
In this space, companies that have already employed some form of 3D packaging technology have experienced success. On the downside, however, success of the 3D packaging methodology so far has been restricted to staked die and stacked package configurations.
3D packaging methodologies for semiconductors are, as yet, not ascertained for large-scale multiple function processors. This implies vast scope of innovation in the semiconductor assembly and testing services space. To gauge opportunities in this space, Transparency Market Research (TMR) has published a market intelligence study on the semiconductor assembly and test services market. According to TMR, the semiconductor assembly and test services market is predicted to register a notable ~6% CAGR over the 2019-2027 forecast period.
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Automation and Electrification of Automobiles Spawn Significant Demand
Design enhancements and innovations in automobiles have indirectly led to a spurt in the demand for semiconductor assemblies. Electrification and automation of automobiles have led to the increasing need for semiconductor assembly and testing equipment. For example, in the recent past, the incorporation of various technologies in the mass production of cars, including enhanced lidar sensors and matrix LED lights, is pertinent for the demand of semiconductor assembly and test services.
The development of electric vehicles has served to the impel semiconductor assembly and test services market tremendously. Electric vehicle (EV) batteries that are of utmost importance for electric vehicles require reliable testing before being installed, to ensure the optimum safety and best-on-road performance of vehicles.
Apart from this, the gamut of electronics and electrical components for automotive vehicles is vast. Sensors, alternators, actuators, batteries, generators, oxygen sensors, starter solenoids, and high-power electrical systems are a few, all of which require semiconductors extensively.
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Among a slew of end users, the foundries segment is anticipated to register a high CAGR in the semiconductor assembly and test services market, finds TMR. Predominantly, this is because foundries feature the provision for refining and production of silicon and other metals for semiconductor packaging.
From a geographical perspective, vis-à-vis revenue, Asia Pacific is predicted to hold a leading share in the semiconductor assembly and test services market over the forecast period. Vast expansion of the electronics industry in the region has influenced the demand for semiconductor assembly and test services enormously.
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Outsourcing Practices Open Vast Scope of Growth
Changing practices of outsourcing by OEMs and chipmakers of electronic components are setting new trends in the entire electronics industry ecosystem, including the packaging and testing of semiconductor assemblies. While the outsourcing of semiconductor assembly and test services is currently registered to be only 50%, substantial volume expansion of these practices is predicted. This serves to be an advantage for players in the semiconductor assembly and test services market.
The need for design innovation in semiconductor assemblies provides ample scope of growth for participants in the semiconductor assembly and test services market. The development of new classes of semiconductor products that demand greater interconnect densities renders scope for alternate materials for the substrate of semiconductor assemblies.
Following experiments, silicon and glass have evolved as suitable substrates for very high-density semiconductor assembly packaging applications.
The scope of adoption of new technologies is predicted to bolster the growth of the semiconductor assembly and test services market. While small players mostly rely on price-driven products, market leaders such as ASE, AMKOR, SPIL, and STATS are planning to make large investments for technology driven expensive packaging solutions.
So much so, instances of the packaging of semiconductor assemblies being costlier and more complex than silicon technology itself is a reality. With the spawn of 3D packaging solutions, instances of packaging cost exceeding silicon itself are likely to be numerous. Such developments are indicative of the changing growth horizons of the semiconductor assembly and test services market.
The presence of a copious number of players renders a fragmented vendor landscape in the semiconductor assembly and test services market. Nonetheless, a considerably large share of the market is held by leading players in this market.
Huge investments for advanced packaging solutions are on the cards of leading players in semiconductor assembly and test services market. Previously, the introduction of outsourcing services has served to establish the position of leading players in the semiconductor assembly and test services market. Top players such as Amkor Technology provide outsourcing services to fabless semiconductor companies and contract foundries, for the latter to focus on the R&D and design of semiconductors.
Besides this, established players are entering into long-term alliances with top-notch computer hardware companies. For example, in May 2017, Amkor Technology entered into a high value strategic long-term partnership with computer hardware giant IBM for semiconductor assembly and test services. Mergers and acquisitions are also a key growth strategy of players in the semiconductor assembly and test services market. Such pursuits aid in leveraging the production capacities of partnering companies, thus enabling increased process efficiency with reduced manpower.
Increasing Demand for Consumer Electronic Products: A Key Driver
Rising Demand for High-end Electronic Systems in Automobiles: A Key Driver
Higher Costs Associated with Larger Wafer Fabrication: A Major Challenge for the SATS Market
Global Semiconductor Assembly and Test Services Market: Competition Landscape
Global Semiconductor Assembly and Test Services Market: Key Developments
Key manufacturers operating in the global semiconductor assembly and test services market, such as Oji Holdings Corporation, are strengthening their overseas sales structure by increasing their production capacity. Some other key developments in the market are as follows:
In the report on the global semiconductor assembly and test services market, we have discussed individual strategies, followed by company profiles of providers of semiconductor assembly and test services. The ‘Competitive Landscape’ section is included in the report to provide readers with a dashboard view and company market share analysis of key players operating in the global semiconductor assembly and test services market.
Semiconductor Assembly and Test Services Market – Segmentation
In order to understand the finer details of the market, the report segments the semiconductor assembly and test services market on the basis of service, end user, and region. This allows market stakeholders to assess incremental opportunities in this market landscape.
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1. Preface
1.1. Market Definition and Scope
1.2. Market Segmentation
1.3. Key Research Objectives
1.4. Research Highlights
2. Assumptions and Research Methodology
3. Executive Summary: Global Semiconductor Assembly and Test Services Market
4. Market Overview
4.1. Introduction
4.2. Market Dynamics
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.3. Regulations and Policies
4.4. Key Trends Analysis
4.5. Key Market Indicators
4.6. Global Semiconductor Assembly and Test Services Market Analysis and Forecast, 2017–2027
4.6.1. Market Revenue Projection (US$ Mn)
4.7. Porter’s Five Forces Analysis - Global Semiconductor Assembly and Test Services Market
4.8. Value Chain Analysis - Global Semiconductor Assembly and Test Services Market
4.9. Market Outlook
5. Global Semiconductor Assembly and Test Services Market Analysis and Forecast, by Service
5.1. Overview & Definitions
5.2. Key Trends
5.3. Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
5.3.1. Assembly & Packaging
5.3.1.1. Copper Wire and Gold Wire Bonding
5.3.1.2. Flip Chips
5.3.1.3. Wafer Level Packaging
5.3.1.4. TSV
5.3.1.5. Others
5.3.2. Testing
5.4. Service Comparison Matrix
5.5. Global Semiconductor Assembly and Test Services Market Attractiveness, by Service
6. Global Semiconductor Assembly and Test Services Market Analysis and Forecast, by End User
6.1. Overview & Definitions
6.2. Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
6.2.1. Foundries
6.2.2. Semiconductor Electronic Manufacturers
6.2.3. Testing Homes
6.3. End User Comparison Matrix
6.4. Global Semiconductor Assembly and Test Services Market Attractiveness, by End User
7. Global Semiconductor Assembly and Test Services Market Analysis and Forecast, by Region
7.1. Key Findings
7.2. Regulations and Policies
7.3. Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Region, 2017–2027
7.3.1. North America
7.3.2. Europe
7.3.3. Asia Pacific
7.3.4. Middle East & Africa
7.3.5. South America
7.4. Global Semiconductor Assembly and Test Services Market Attractiveness, by Region
8. North America Semiconductor Assembly and Test Services Market Analysis and Forecast
8.1. Key Findings
8.2. Key Trends
8.3. North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
8.3.1. Assembly & Packaging
8.3.1.1. Copper Wire and Gold Wire Bonding
8.3.1.2. Flip Chips
8.3.1.3. Wafer Level Packaging
8.3.1.4. TSV
8.3.1.5. Others
8.3.2. Testing
8.4. North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
8.4.1. Foundries
8.4.2. Semiconductor Electronic Manufacturers
8.4.3. Testing Homes
8.5. North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-region, 2017–2027
8.5.1. U.S.
8.5.2. Canada
8.5.3. Rest of North America
8.6. North America Semiconductor Assembly and Test Services Market Attractiveness Analysis
8.6.1. By Service
8.6.2. By End User
8.6.3. By Country/Sub-region
9. Europe Semiconductor Assembly and Test Services Market Analysis and Forecast
9.1. Key Findings
9.2. Key Trends
9.3. Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
9.3.1. Assembly & Packaging
9.3.1.1. Copper Wire and Gold Wire Bonding
9.3.1.2. Flip Chips
9.3.1.3. Wafer Level Packaging
9.3.1.4. TSV
9.3.1.5. Others
9.3.2. Testing
9.4. Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
9.4.1. Foundries
9.4.2. Semiconductor Electronic Manufacturers
9.4.3. Testing Homes
9.5. Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-region, 2017–2027
9.5.1. Germany
9.5.2. U.K.
9.5.3. France
9.5.4. Rest of Europe
9.6. Europe Semiconductor Assembly and Test Services Market Attractiveness Analysis
9.6.1. By Service
9.6.2. By End User
9.6.3. By Country/Sub-region
10. Asia Pacific Semiconductor Assembly and Test Services Market Analysis and Forecast
10.1. Key Findings
10.2. Key Trends
10.3. Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
10.3.1. Assembly & Packaging
10.3.1.1. Copper Wire and Gold Wire Bonding
10.3.1.2. Flip Chips
10.3.1.3. Wafer Level Packaging
10.3.1.4. TSV
10.3.1.5. Others
10.3.2. Testing
10.4. Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
10.4.1. Foundries
10.4.2. Semiconductor Electronic Manufacturers
10.4.3. Testing Homes
10.5. Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-region, 2017–2027
10.5.1. China
10.5.2. India
10.5.3. Japan
10.5.4. Rest of Asia Pacific
10.6. Asia Pacific Semiconductor Assembly and Test Services Market Attractiveness Analysis
10.6.1. By Service
10.6.2. By End User
10.6.3. By Country/Sub-region
11. Middle East & Africa Semiconductor Assembly and Test Services Market Analysis and Forecast
11.1. Key Findings
11.2. Key Trends
11.3. Middle East & Africa Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
11.3.1. Assembly & Packaging
11.3.1.1. Copper Wire and Gold Wire Bonding
11.3.1.2. Flip Chips
11.3.1.3. Wafer Level Packaging
11.3.1.4. TSV
11.3.1.5. Others
11.3.2. Testing
11.4. Middle East & Africa Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
11.4.1. Foundries
11.4.2. Semiconductor Electronic Manufacturers
11.4.3. Testing Homes
11.5. Middle East & Africa Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-region, 2017–2027
11.5.1. UAE
11.5.2. Saudi Arabia
11.5.3. Israel
11.5.4. Rest of Middle East & Africa
11.6. Middle East & Africa Semiconductor Assembly and Test Services Market Attractiveness Analysis
11.6.1. By Service
11.6.2. By End User
11.6.3. By Country/Sub-region
12. South America Semiconductor Assembly and Test Services Market Analysis and Forecast
12.1. Key Findings
12.2. Key Trends
12.3. South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017–2027
12.3.1. Assembly & Packaging
12.3.1.1. Copper Wire and Gold Wire Bonding
12.3.1.2. Flip Chips
12.3.1.3. Wafer Level Packaging
12.3.1.4. TSV
12.3.1.5. Others
12.3.2. Testing
12.4. South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017–2027
12.4.1. Foundries
12.4.2. Semiconductor Electronic Manufacturers
12.4.3. Testing Homes
12.5. South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-region, 2017–2027
12.5.1. Brazil
12.5.2. Rest of South America
12.6. South America Semiconductor Assembly and Test Services Market Attractiveness Analysis
12.6.1. By Service
12.6.2. By End User
12.6.3. By Country/Sub-region
13. Competition Landscape
13.1. Market Players - Competition Matrix
13.2. Global Semiconductor Assembly and Test Services Market Share Analysis, by Company (2017)
13.3. Company Profiles (Details - Overview, Financials, SWOT Analysis, Recent Developments, Strategy)
13.3.1. ASE Technology Holding Co., Ltd.
13.3.1.1. Overview
13.3.1.2. Financials
13.3.1.3. SWOT Analysis
13.3.1.4. Recent Developments
13.3.1.5. Strategy
13.3.2. Amkor Technology
13.3.2.1. Overview
13.3.2.2. Financials
13.3.2.3. SWOT Analysis
13.3.2.4. Recent Developments
13.3.2.5. Strategy
13.3.3. Powertech Technology Inc.Ch
13.3.3.1. Overview
13.3.3.2. Financials
13.3.3.3. SWOT Analysis
13.3.3.4. Recent Developments
13.3.3.5. Strategy
13.3.4. ipbond Technology Corporation
13.3.4.1. Overview
13.3.4.2. Financials
13.3.4.3. SWOT Analysis
13.3.4.4. Recent Developments
13.3.4.5. Strategy
13.3.5. Integrated Micro-Electronics, Inc.
13.3.5.1. Overview
13.3.5.2. Financials
13.3.5.3. SWOT Analysis
13.3.5.4. Recent Developments
13.3.5.5. Strategy
13.3.6. GlobalFoundries
13.3.6.1. Overview
13.3.6.2. Financials
13.3.6.3. SWOT Analysis
13.3.6.4. Recent Developments
13.3.6.5. Strategy
13.3.7. UTAC Group
13.3.7.1. Overview
13.3.7.2. Financials
13.3.7.3. SWOT Analysis
13.3.7.4. Recent Developments
13.3.7.5. Strategy
13.3.8. TongFu Microelectronics Co., Ltd.
13.3.8.1. Overview
13.3.8.2. Financials
13.3.8.3. SWOT Analysis
13.3.8.4. Recent Developments
13.3.8.5. Strategy
13.3.9. King Yuan ELECTRONICS CO., LTD.
13.3.9.1. Overview
13.3.9.2. Financials
13.3.9.3. SWOT Analysis
13.3.9.4. Recent Developments
13.3.9.5. Strategy
13.3.10. ChipMOS TECHNOLOGIES INC.
13.3.10.1. Overview
13.3.10.2. Financials
13.3.10.3. SWOT Analysis
13.3.10.4. Recent Developments
13.3.10.5. Strategy
14. Key Takeaways
List of Tables:
Table 01: Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 02: Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 03: Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Region, 2017 - 2027
Table 04: North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 05: North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 06: North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-Region, 2017 - 2027
Table 07: Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 08: Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 09: Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-Region, 2017 - 2027
Table 10: Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 11: Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 12: Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-Region, 2017 - 2027
Table 13: MEA Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 14: MEA Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 15: MEA Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-Region, 2017 - 2027
Table 16: South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Service, 2017 - 2027
Table 17: South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by End User, 2017 - 2027
Table 18: South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn) Forecast, by Country/Sub-Region, 2017 - 2027
List of Figures:
Figure 01: Global Semiconductor Assembly and Test Services Market Size, Historical and Forecast, 2017 - 2027
Figure 02: Global Semiconductor Assembly and Test Services Market CAGR, 2019–2027
Figure 03: Global Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 04: Global Semiconductor Assembly and Test Services Market, Porter’s Five Force Analysis
Figure 05: Global Semiconductor Assembly and Test Services Market, Value Chain Analysis
Figure 06: Semiconductor Assembly and Test Services Market Value Share (Revenue), by Service (2018)
Figure 07: Semiconductor Assembly and Test Services Market Value Share (Revenue), by End User (2018)
Figure 08: Semiconductor Assembly and Test Services Market Value Share (Revenue), by Region (2018)
Figure 09: Global Semiconductor Assembly and Test Services Market, by Service, Assembly & Packaging
Figure 10: Global Semiconductor Assembly and Test Services Market, by Service, Testing
Figure 11: Global Semiconductor Assembly and Test Services Comparison Matrix, by Service
Figure 12: Global Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 13: Global Semiconductor Assembly and Test Services Market, by End User, Foundries
Figure 14: Global Semiconductor Assembly and Test Services Market, by End User, Semiconductor Electronic Manufacturers
Figure 15: Global Semiconductor Assembly and Test Services Market, by End User, Testing Homes
Figure 16: Global Semiconductor Assembly and Test Services Comparison Matrix, by End User
Figure 17: Global Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 18: North America Semiconductor Assembly and Test Services Market
Figure 19: Europe Semiconductor Assembly and Test Services Market
Figure 20: Asia Pacific Semiconductor Assembly and Test Services Market
Figure 21: Middle East & Africa Semiconductor Assembly and Test Services Market
Figure 22: South America Semiconductor Assembly and Test Services Market
Figure 23: Global Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Region
Figure 24: North America Trend Impact Analysis
Figure 25: North America Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 26: North America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 27: North America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Service
Figure 28: North America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 29: North America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by End User
Figure 30: North America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Country/Sub-Region
Figure 31: North America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Country/Sub-region
Figure 32: Europe Trend Impact Analysis
Figure 33: Europe Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 34: Europe Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 35: Europe Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Service
Figure 36: Europe Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 37: Europe Semiconductor Assembly and Test Services Market Revenue Share Analysis, by End User
Figure 38: Europe Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Country/Sub-Region
Figure 39: Europe Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Country/Sub-region
Figure 40: Asia Pacific Trend Impact Analysis
Figure 41: Asia Pacific Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 42: Asia Pacific Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 43: Asia Pacific Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Service
Figure 44: Asia Pacific Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 45: Asia Pacific Semiconductor Assembly and Test Services Market Revenue Share Analysis, by End User
Figure 46: Asia Pacific Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Country/Sub-Region
Figure 47: Asia Pacific Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Country/Sub-region
Figure 48: MEA Trend Impact Analysis
Figure 49: MEA Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 50: MEA Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 51: MEA Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Service
Figure 52: MEA Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 53: MEA Semiconductor Assembly and Test Services Market Revenue Share Analysis, by End User
Figure 54: MEA Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Country/Sub-Region
Figure 55: MEA Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Country/Sub-region
Figure 56: South America Trend Impact Analysis
Figure 57: South America Semiconductor Assembly and Test Services Market Revenue (US$ Mn), 2017 - 2027
Figure 58: South America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Service
Figure 59: South America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Service
Figure 60: South America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by End User
Figure 61: South America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by End User
Figure 62: South America Semiconductor Assembly and Test Services Market Attractiveness Analysis, by Country/Sub-Region
Figure 63: South America Semiconductor Assembly and Test Services Market Revenue Share Analysis, by Country/Sub-region
Figure 64: Semiconductor Assembly and Test Services Market, Competition Matrix
Figure 65: Global Semiconductor Assembly and Test Services Market Share Analysis, by Company (2018)
Figure 66: Breakdown of Revenue, by Geography (2017), ASE Technology Holding Co., Ltd.
Figure 67: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, ASE Technology Holding Co., Ltd.
Figure 68: Breakdown of Revenue, by Geography (2018), Amkor Technology
Figure 69: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, Amkor Technology
Figure 70: Breakdown of Revenue, by Segment (2018), Powertech Technology Inc.
Figure 71: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, Powertech Technology Inc.
Figure 72: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, Chipbond Technology Corporation
Figure 73: Breakdown of Revenue, by Segment (2018), Integrated Micro-Electronics, Inc.
Figure 74: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018
Figure 75: Breakdown of Revenue, by Geography (2018), GlobalFoundries
Figure 76: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, GlobalFoundries
Figure 77: Breakdown of Revenue, by Geography (2018), UTAC Group
Figure 78: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, UTAC Group
Figure 79: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, TongFu Microelectronics Co., Ltd.
Figure 80: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, King Yuan ELECTRONICS CO., LTD.
Figure 81: Revenue, by Geography (2018), ChipMOS TECHNOLOGIES INC.
Figure 82: Revenue (US$ Mn) & Y-o-Y Growth (%), 2016 - 2018, ChipMOS TECHNOLOGIES INC.
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Semiconductor Assembly and Test Services Market
*86 figures and 60 tables includes