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Embedded Die Packaging Market

Embedded Die Packaging Market (Platform: IC Package Substrate, Rigid PCB, and Flexible PCB; Application: Smartphone & Tablets, Medical Implants and Wearable Devices, Industrial Sensing Devices, Industrial Controlling Devices, Industrial Metering Devices, Military Communication & Power Devices, Aircraft, Security Devices, Automotive Modules, Communication & Computing Devices, and Others; and End-use Industry: Consumer Electronics, IT & Telecommunication, Healthcare, Aerospace & Defense, Automotive, Industrial, and Others) – Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2020-2030

Memory Market Creates Profitable Revenue Opportunities for Manufacturers amidst COVID-19 Crisis

The semiconductor industry is seeing huge potential during and post the COVID-19 (coronavirus) pandemic. Data centers and work-from-home policies have triggered the demand for huge storage capacities in laptops and smart devices. As such, many semicon foundries in France, Russia, Brazil, and India are still operating in partial capacities. This has severely disrupted supply chains in the global embedded die packaging market. China being the manufacturing hub for electronics is now scaling value-grab opportunities, since the pandemic has significantly subsided in the country.

Unemployment and salary holdbacks have created a limited demand for electronic devices. Since electronic devices do not fall under essential products and services industry, manufacturers are experiencing a demand shortage from customers. Hence, manufacturers in the embedded die packaging market are focusing on critical-mission projects for medical implants, military communication devices, and aircraft to build the global economy.

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EMIBs Deploy Computing Supremacy by Reducing Costs and Eliminate Complexity of Interposers

Market leaders in the embedded die packaging market are leaning hard in advanced chip packaging technologies in order to gain computing edge. For instance, Intel— a U.S. multinational corporation and technology company, is relying on EMIB (embedded multi-interconnect bridge) to enable die-to-die connections using tiny silicon bridges embedded in package substrates. As such, EMIB is emerging as an alternative to interposers in favor of tiny silicon bridges on substrates. This is eliminating inherent layers of complexity and cutting down on costs to manufacture miniaturized smart devices.

Companies in the embedded die packaging market are increasing the availability of EMIBs loaded with micro-bumps that facilitate die-to-die connections. EMIBs have made it possible to achieve a significantly high bump density, which deploys computing supremacy. Moreover, small silicon bridges are more cost-efficient as compared to interposers.

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Embedded Die Packaging Witnesses Stiff Competition from Fan-out and Lead-frame Packages

The embedded die packaging market is projected to advance at a striking CAGR of ~17% during the forecast period. However, the cost of embedded die is high and the market is evolving at a relatively slow pace. Hence, companies in the embedded die packaging market are increasing their innovations in the packaging landscape to compete with fan-out and lead-frame packages.

The integrated circuit (IC) technology is shifting away from monolithic chips and toward the use of chiplets tied together in advanced packaging technology. As such, EMIB and silicon interposers are growing popular in 2.5/3D packaging technologies. EMIB is being highly publicized for providing high bandwidth link between multiple die of different nodes and circuit types.

Supply Chain Management Crucial for Growth in SiP Business

The transition from single embedded die into multiple-embedded dies is a recurring trend for the system-in-package (SiP) industry. Companies in the embedded die packaging market are scaling future growth opportunities, since the complexity and size of IC substrates and boards are anticipated to increase in the upcoming years. This is emerging as a challenge for semicon companies but with increased R&D efforts, manufacturers can adapt to future developments in products.

The growth of telecom and automotive sectors is expected to create value-grab opportunities for companies in the embedded die packaging market. Manufacturers are focused on supply chain management to excel in the SiP business. Thus, manufacturers are bearing in mind key factors such as technological innovations, cost, and material requirements.

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Analysts’ Viewpoint

Online sales of electronic devices have helped semicon companies to keep economies running during the COVID-19 pandemic. Increase in the complexity and size of IC substrates and boards in the future will trigger the demand for embedded die packaging. Revenue opportunities in the system-in-package market are relatively small, but companies should scale business opportunities in this market landscape since the system-in-package sector is expected for exponential growth between 2020 and 2030. As such, semicon companies should attend trade events and conferences to gain important insights about recent developments in the embedded die packaging market. The proliferation of the 5G technology, along with sensors, wearables, and IoT (Internet of Things).

Embedded Die Packaging Market: Overview

  • According to the latest research report of Transparency Market Research on the global embedded die packaging market for the historical period 2018–2019 and the forecast period 2020–2030, demand for IC package substrate platforms is on the rise around the globe due to its important characteristics of preventing the encapsulated semiconductor material from physical damage and corrosion, owing to which, they are used in various applications such as smartphones & tablets, medical implants and wearable devices, automotive modules, and communication & computing devices. This is expected to boost the global embedded die packaging market during the forecast period.
  • Moreover, demand for embedded die packaging is increasing in the aerospace & defense field around the globe, as it is increasingly being used in military communication applications, which is anticipated to drive the growth of the global embedded die packaging market
  • In terms of revenue, the global embedded die packaging market is estimated to reach a value of ~US$ 142 Mn by 2030, expanding at a CAGR of ~17% throughout the forecast period

Growing Demand for Consumer Electronics: A Key Driver of Embedded Die Packaging Market

  • The embedded die packaging market is expected to expand significantly due to the demand for consumer electronic products such as smartphones, tablets, set-top boxes, televisions, monitors, displays, speakers, computers, refrigerators, and many other products that require semiconductor assembly
  • From electronic components and semiconductor designs, to consumer electronics, semiconductor and electronics manufacturing sectors are moving up the value chain
  • Moreover, advancement in technology and higher competition in consumer electronics semiconductors, memory chips, and wafers used in consumer electronics and wireless handsets/mobile technologies are anticipated to be an important semiconductor revenue driver, owing to the development of low-power chips, which prolong battery life, especially of portable devices. Thus, technological advancement in consumer electronics industry is anticipated to boost the growth of the embedded die packaging market during the forecast period.

Rise in Adoption of Embedded Die Packaging in Consumer Electronics Applications: Latest Market Trend

  • Embedded die packaging has different applications and used in smartphone & tablets, medical implants and wearable devices, industrial sensing devices, industrial controlling devices, industrial metering devices, military communication & power devices, aircraft, security devices, automotive, communication & computing devices, and others (security cameras, access, control, etc.)
  • Embedded die technologies have been in existence for several years. Passive components, such as decoupling capacitors, are routinely embedded in laminate substrates. Embedded decoupling takes advantage of the capacitance between power and ground planes in a printed circuit board to suppress the switching noise of high speed digital packages.
  • Thus, rise in use of technologically advanced embedded die packaging in consumer electronics applications is expected to bolster the growth of the embedded die packaging market during the forecast period

High Cost Associated With Die Packaging: A Major Challenge of Embedded Die Packaging Market

  • Die packaging undergoes complex processes, and entails advanced equipment and high cost. The packaging of wafers is costly despite silicon being the second most abundant element on earth. Fabricating semiconductor wafers and chips, silicon has to be refined to purity, which is a complex process and ultimately increases the cost.
  • Extensive capital is needed to offer superior end packaging solutions, and in recent years, consumer electronics steel mills, space programs, and automobile manufacturing sectors have been characterized by rapid technological developments and shortening product cycles. These advancements come at a huge cost and require vast investments in developing R&D capabilities for semiconductor assembly and testing services.
  • Thus, high cost associated with die packaging is anticipated to hamper the growth of the embedded die packaging market in the upcoming years

Embedded Die Packaging Market: Competition Landscape

  • Detailed profiles of providers of embedded die packaging have been provided in the report to evaluate their financials, key product offerings, recent developments, and strategies
  • Key players operating in the global embedded die packaging market are
  • ASE Group,
  • AT&S,
  • Fujitsu Limited,
  • General Electric,
  • Infineon Technologies AG,
  • Microsemi Corporation,
  • STMicroelectronics,
  • TDK Corporation,
  • Texas Instruments Incorporation
  • Toshiba Corporation

Embedded Die Packaging Market: Key Developments

  • Key providers of embedded die packaging, such as Infineon Technologies AG, STMicroelectronics, Toshiba Corporation, and General Electric are focusing on the development of innovative and reliable embedded die packaging. Some other key developments in the global embedded die packaging market are as follows:
  • In April 2020, Infineon Technologies AG announced that all necessary regulatory approvals have been received for its acquisition of Cypress Semiconductor Corporation
  • In September 2019, STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will exhibit at Electronica India and SmartCards Expo
  • In January 2019, Toshiba Corporation’s electronic devices and storage division expanded its lineup of automotive Ethernet Bridge ICs with the new TC9562 series. This series offers more interfaces than the existing TC9560 series of bridge ICs.
  • In 2018, General Electric proposed a full featured, smart grid meter that offers consumers new technologies. These meters have the ability to customize advanced metering options to suit customer needs and configure load profile, time of use, and demand metering capabilities.
  • In the report on the global embedded die packaging market, we have discussed individual strategies, followed by company profiles of providers of embedded die packaging. The ‘Competition Landscape’ section has been included in the report to provide readers with a dashboard view and company market share analysis of key players operating in the global embedded die packaging market.

Embedded Die Packaging Market – Segmentation

TMR’s study of the global embedded die packaging market segments the market based on platform, application, end-use industry, and region. Changing market trends and other crucial market dynamics associated with segments of the global embedded die packaging market have been discussed in detail in TMR’s study.

Platform
  • IC Package Substrate
  • Rigid PCB
  • Flexible PCB

Application
  • Smartphone & Tablets
  • Medical Implants and Wearable Devices
  • Industrial Sensing Devices
  • Industrial Controlling Devices
  • Industrial Metering Devices
  • Military Communication & Power Devices
  • Aircraft
  • Security Devices
  • Automotive Modules
  • Communication & Computing Devices
  • Others (Security Cameras, Access Control, etc.)

End-use Industry
  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Aerospace & Defense
  • Automotive
  • Industrial
  • Others

Region
  • North America
  • South America
  • Europe
  • Asia Pacific
  • Middle East & Africa

    1. Preface

        1.1. Market Definition and Scope

        1.2. Market Segmentation

        1.3. Key Research Objectives

        1.4. Research Highlights

    2. Assumptions and Research Methodology

    3. Executive Summary: Global Embedded Die Packaging Market

    4. Market Overview

        4.1. Introduction

        4.2. Market Dynamics

            4.2.1. Drivers

            4.2.2. Restraints

            4.2.3. Opportunities

        4.3. Key Trends Analysis

        4.4. Regulations and Policies

        4.5. Global Pacific Embedded Die Packaging Market Analysis and Forecast, 2018 - 2030

            4.5.1. Market Revenue Projections (US$ Mn)

        4.6. Porter’s Five Forces Analysis - Global Embedded Die Packaging Market

        4.7. Value Chain Analysis - Global Embedded Die Packaging Market

        4.8. Market Outlook

    5. Global Embedded Package Substrate Market Analysis and Forecast, 2018 - 2030

        5.1. Overview & Definitions of Embedded Substrate

        5.2. Technical Requirement for Embedded Package by Application

        5.3. Embedded Package Substrate Market Size (US$ Mn) Forecast, 2018 - 2030

        5.4. Key Players in Embedded Package - Strategy Adopted, Technology Innovation, Recent Developments, Product Details

        5.5. Penetration of Global Embedded Package in Total Packaged Substrate (2018-2030)

    6. Global Embedded Die Packaging Market Analysis and Forecast, By Platform

        6.1. Overview & Definitions

        6.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            6.2.1. IC Package Substrate

            6.2.2. Rigid PCB

            6.2.3. Flexible PCB

        6.3. Platform Comparison Matrix

        6.4. Market Attractiveness By Platform

    7. Global Embedded Die Packaging Market Analysis and Forecast, By Application

        7.1. Overview & Definition

        7.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            7.2.1. Smartphone & Tablets

            7.2.2. Medical Implants and Wearable Devices

            7.2.3. Industrial Sensing Devices

            7.2.4. Industrial Controlling Devices

            7.2.5. Industrial Metering Devices

            7.2.6. Military Communication & Power Devices

            7.2.7. Aircrafts

            7.2.8. Security Devices

            7.2.9. Automotive Modules

            7.2.10. Communication & Computing Devices

            7.2.11. Others (Security Cameras, Access Control, Etc.)

        7.3. Application Comparison Matrix

        7.4. Market Attractiveness By Application

    8. Global Embedded Die Packaging Market Analysis and Forecast, By End-use  Industry

        8.1. Overview & Definition

        8.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use  Industry, 2018 - 2030

            8.2.1. Consumer Electronics

            8.2.2. IT & Telecommunication

            8.2.3. Healthcare

            8.2.4. Aerospace & Defense

            8.2.5. Automotive

            8.2.6. Industrial

            8.2.7. Others

        8.3. End-use  Industry Comparison Matrix

        8.4. Market Attractiveness By End-use  Industry

    9. Global Embedded Die Packaging Market Analysis and Forecast, by Region

        9.1. Key Findings

        9.2. Embedded Die Packaging Market Size (US$ Mn) Forecast, by Region, 2018 - 2030

            9.2.1. North America

            9.2.2. Europe

            9.2.3. Asia Pacific

            9.2.4. Middle East & Africa

            9.2.5. South America

        9.3. Market Attractiveness by Region

    10. North America Embedded Die Packaging Market Analysis and Forecast

        10.1. Key Findings

        10.2. Key Trends

        10.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            10.3.1. IC Package Substrate

            10.3.2. Rigid PCB

            10.3.3. Flexible PCB

        10.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            10.4.1. Smartphone & Tablets

            10.4.2. Medical Implants and Wearable Devices

            10.4.3. Industrial Sensing Devices

            10.4.4. Industrial Controlling Devices

            10.4.5. Industrial Metering Devices

            10.4.6. Military Communication & Power Devices

            10.4.7. Aircrafts

            10.4.8. Security Devices

            10.4.9. Automotive Modules

            10.4.10. Communication & Computing Devices

            10.4.11. Others (Security Cameras, Access Control, Etc.)

        10.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use Industry, 2018 - 2030

            10.5.1. Consumer Electronics

            10.5.2. IT & Telecommunication

            10.5.3. Healthcare

            10.5.4. Aerospace & Defense

            10.5.5. Automotive

            10.5.6. Industrial

            10.5.7. Others

        10.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030

            10.6.1. U.S.

            10.6.2. Canada

            10.6.3. Rest of North America

        10.7. Market Attractiveness Analysis

            10.7.1. By Platform

            10.7.2. By Application

            10.7.3. By End-use  Industry

            10.7.4. By Country

    11. Europe Embedded Die Packaging Market Analysis and Forecast

        11.1. Key Findings

        11.2. Key Trends

        11.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            11.3.1. IC Package Substrate

            11.3.2. Rigid PCB

            11.3.3. Flexible PCB

        11.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            11.4.1. Smartphone & Tablets

            11.4.2. Medical Implants and Wearable Devices

            11.4.3. Industrial Sensing Devices

            11.4.4. Industrial Controlling Devices

            11.4.5. Industrial Metering Devices

            11.4.6. Military Communication & Power Devices

            11.4.7. Aircrafts

            11.4.8. Security Devices

            11.4.9. Automotive Modules

            11.4.10. Communication & Computing Devices

            11.4.11. Others (Security Cameras, Access Control, Etc.)

        11.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use  Industry, 2018 - 2030

            11.5.1. Consumer Electronics

            11.5.2. IT & Telecommunication

            11.5.3. Healthcare

            11.5.4. Aerospace & Defense

            11.5.5. Automotive

            11.5.6. Industrial

            11.5.7. Others

        11.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030

            11.6.1. Germany

            11.6.2. U.K.

            11.6.3. France

            11.6.4. Rest of Europe

        11.7. Market Attractiveness Analysis

            11.7.1. By Platform

            11.7.2. By End-use  Industry

            11.7.3. By Application

            11.7.4. By Country

    12. Asia Pacific Embedded Die Packaging Market Analysis and Forecast

        12.1. Key Findings

        12.2. Key Trends

        12.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            12.3.1. IC Package Substrate

            12.3.2. Rigid PCB

            12.3.3. Flexible PCB

        12.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            12.4.1. Smartphone & Tablets

            12.4.2. Medical Implants and Wearable Devices

            12.4.3. Industrial Sensing Devices

            12.4.4. Industrial Controlling Devices

            12.4.5. Industrial Metering Devices

            12.4.6. Military Communication & Power Devices

            12.4.7. Aircrafts

            12.4.8. Security Devices

            12.4.9. Automotive Modules

            12.4.10. Communication & Computing Devices

            12.4.11. Others (Security Cameras, Access Control, Etc.)

        12.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use  Industry, 2018 - 2030

            12.5.1. Consumer Electronics

            12.5.2. IT & Telecommunication

            12.5.3. Healthcare

            12.5.4. Aerospace & Defense

            12.5.5. Automotive

            12.5.6. Industrial

            12.5.7. Others

        12.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030

            12.6.1. China

            12.6.2. Japan

            12.6.3. India

            12.6.4. Australia

            12.6.5. Rest of Asia Pacific

        12.7. Market Attractiveness Analysis

            12.7.1. By Platform

            12.7.2. By Application

            12.7.3. By End-use  Industry

            12.7.4. By Country

    13. Middle East & Africa Embedded Die Packaging Market Analysis and Forecast

        13.1. Key Findings

        13.2. Key Trends

        13.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            13.3.1. IC Package Substrate

            13.3.2. Rigid PCB

            13.3.3. Flexible PCB

        13.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            13.4.1. Smartphone & Tablets

            13.4.2. Medical Implants and Wearable Devices

            13.4.3. Industrial Sensing Devices

            13.4.4. Industrial Controlling Devices

            13.4.5. Industrial Metering Devices

            13.4.6. Military Communication & Power Devices

            13.4.7. Aircrafts

            13.4.8. Security Devices

            13.4.9. Automotive Modules

            13.4.10. Communication & Computing Devices

            13.4.11. Others (Security Cameras, Access Control, Etc.)

        13.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use  Industry, 2018 - 2030

            13.5.1. Consumer Electronics

            13.5.2. IT & Telecommunication

            13.5.3. Healthcare

            13.5.4. Aerospace & Defense

            13.5.5. Automotive

            13.5.6. Industrial

            13.5.7. Others

        13.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030

            13.6.1. GCC

            13.6.2. South Africa

            13.6.3. Rest of Middle East & Africa

        13.7. Market Attractiveness Analysis

            13.7.1. By Platform

            13.7.2. By Application

            13.7.3. By End-use  Industry

            13.7.4. By Country

    14. South America Embedded Die Packaging Market Analysis and Forecast

        14.1. Key Findings

        14.2. Key Trends

        14.3. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Platform, 2018 - 2030

            14.3.1. IC Package Substrate

            14.3.2. Rigid PCB

            14.3.3. Flexible PCB

        14.4. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Application, 2018 - 2030

            14.4.1. Smartphone & Tablets

            14.4.2. Medical Implants and Wearable Devices

            14.4.3. Industrial Sensing Devices

            14.4.4. Industrial Controlling Devices

            14.4.5. Industrial Metering Devices

            14.4.6. Military Communication & Power Devices

            14.4.7. Aircrafts

            14.4.8. Security Devices

            14.4.9. Automotive Modules

            14.4.10. Communication & Computing Devices

            14.4.11. Others (Security Cameras, Access Control, Etc.)

        14.5. Embedded Die Packaging Market Size (US$ Mn) Forecast, By End-use  Industry, 2018 - 2030

            14.5.1. Consumer Electronics

            14.5.2. IT & Telecommunication

            14.5.3. Healthcare

            14.5.4. Aerospace & Defense

            14.5.5. Automotive

            14.5.6. Industrial

            14.5.7. Others

        14.6. Embedded Die Packaging Market Size (US$ Mn) Forecast, By Country & Sub-region, 2018 - 2030

            14.6.1. GCC

            14.6.2. South Africa

            14.6.3. Rest of Middle East & Africa

        14.7. Market Attractiveness Analysis

            14.7.1. By Platform

            14.7.2. By Application

            14.7.3. By End-use  Industry

            14.7.4. By Country

    15. Competition Landscape

        15.1. Market Player – Competition Matrix

        15.2. Market Revenue Share Analysis (%), By Company (2019)

    16. Company Profiles (Details – Overview, Financials, SWOT Analysis, Strategy)

        16.1. ASE Group

            16.1.1. Overview

            16.1.2. Financials

            16.1.3. SWOT Analysis

            16.1.4. Strategy

        16.2. AT&S

            16.2.1. Overview

            16.2.2. Financials

            16.2.3. SWOT Analysis

            16.2.4. Strategy

        16.3. Fujitsu Limited

            16.3.1. Overview

            16.3.2. Financials

            16.3.3. SWOT Analysis

            16.3.4. Strategy

        16.4. General Electric

            16.4.1. Overview

            16.4.2. Financials

            16.4.3. SWOT Analysis

            16.4.4. Strategy

        16.5. Infineon Technologies

            16.5.1. Overview

            16.5.2. Financials

            16.5.3. SWOT Analysis

            16.5.4. Strategy

        16.6. Microsemi Corporation

            16.6.1. Overview

            16.6.2. Financials

            16.6.3. SWOT Analysis

            16.6.4. Strategy

        16.7. STMicroelectronics

            16.7.1. Overview

            16.7.2. Financials

            16.7.3. SWOT Analysis

            16.7.4. Strategy

        16.8. TDK Corporation

            16.8.1. Overview

            16.8.2. Financials

            16.8.3. SWOT Analysis

            16.8.4. Strategy

        16.9. Texas Instruments

            16.9.1. Overview

            16.9.2. Financials

            16.9.3. SWOT Analysis

            16.9.4. Strategy

        16.10. Toshiba Corporation

            16.10.1. Overview

            16.10.2. Financials

            16.10.3. SWOT Analysis

            16.10.4. Strategy

        17. Key Takeaways

    List of Tables

    Table 01: Global Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 02: Global Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 03: Global Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 04: Global Embedded Die Packaging Market Revenue (US$ Mn), by Region, 2018–2030

    Table 05: North America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 06: North America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 07: North America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 08: North America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030

    Table 09: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 10: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 11: Europe Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 12: Europe Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030

    Table 13: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 14: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 15: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 16: Asia Pacific Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030

    Table 17: Middle East & Africa  (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 18: Middle East & Africa  (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 19: Middle East & Africa  (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 20: Middle East & Africa  (MEA) Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030

    Table 21: South America Embedded Die Packaging Market Revenue (US$ Mn), by Platform, 2018–2030

    Table 22: South America Embedded Die Packaging Market Revenue (US$ Mn), by Application, 2018–2030

    Table 23: South America Embedded Die Packaging Market Revenue (US$ Mn), by End-use Industry, 2018–2030

    Table 24: South America Embedded Die Packaging Market Revenue (US$ Mn), by Country, 2018–2030

    List of Figures

    Figure 01: Global Embedded Die Packaging Market Revenue (US$ Mn) Forecast, 2018–2030

    Figure 02: Global Embedded Die Packaging Market Revenue (US$ Mn) and Y-o-Y Forecast, 2018 – 2030

    Figure 03: Embedded Package Substrate Market Size (US$ Mn) Forecast, 2018 - 2030

    Figure 04: Global Embedded Die Packaging Market, by IC Package Substrate

    Figure 05: Global Embedded Die Packaging Market, by Rigid PCB

    Figure 06: Global Embedded Die Packaging Market, by Flexible PCB

    Figure 07: Global Embedded Die Packaging Market Comparison Matrix, by Platform

    Figure 08: Global Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 09: Global Embedded Die Packaging Market, by Smartphone & Tablets

    Figure 10: Global Embedded Die Packaging Market, by Medical Implants and Wearable Devices

    Figure 11: Global Embedded Die Packaging Market, by Industrial Sensing Devices

    Figure 12: Global Embedded Die Packaging Market, by Industrial Controlling Devices

    Figure 13: Global Embedded Die Packaging Market, by Industrial Metering Devices

    Figure 14: Global Embedded Die Packaging Market, by Military Communication & Power Devices

    Figure 15: Global Embedded Die Packaging Market, by Aircrafts

    Figure 16: Global Embedded Die Packaging Market, by Security Devices

    Figure 17: Global Embedded Die Packaging Market, by Automotive Modules

    Figure 18: Global Embedded Die Packaging Market, by Communication & Computing Devices

    Figure 19: Global Embedded Die Packaging Market, by Others (Security Cameras, Access Control, Etc.)

    Figure 20: Global Embedded Die Packaging Market Comparison Matrix, by Application

    Figure 21: Global Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 22: Global Embedded Die Packaging Market, by Consumer Electronics

    Figure 23: Global Embedded Die Packaging Market, by IT & Telecommunication

    Figure 24: Global Embedded Die Packaging Market, by Healthcare

    Figure 25: Global Embedded Die Packaging Market, by Aerospace & Defense

    Figure 26: Global Embedded Die Packaging Market, by Automotive

    Figure 27: Global Embedded Die Packaging Market, by Industrial

    Figure 28: Global Embedded Die Packaging Market, by Others

    Figure 29: Global Embedded Die Packaging Market Comparison Matrix, by End-use Industry

    Figure 30: Global Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 31: Global Embedded Die Packaging Market Value Share Analysis, by Region (2020E)

    Figure 32: Global Embedded Die Packaging Market Value Share Analysis, by Region (2030F)

    Figure 33: Global Embedded Die Packaging Market Attractiveness Analysis, by Region

    Figure 34: North America Embedded Die Packaging Market Size (US$ Mn), 2018 – 2030

    Figure 35: North America Embedded Die Packaging Market Value Share Analysis, by Platform (2020)

    Figure 36: North America Embedded Die Packaging Market Value Share Analysis, by Platform (2030)

    Figure 37: North America Embedded Die Packaging Market Value Share Analysis, by Application (2020)

    Figure 38: North America Embedded Die Packaging Market Value Share Analysis, by Application (2030)

    Figure 39: North America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)

    Figure 40: North America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)

    Figure 41: North America Embedded Die Packaging Market Value Share Analysis, by Country (2020)

    Figure 42: North America Embedded Die Packaging Market Value Share Analysis, by Country (2030)

    Figure 43: North America Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 44: North America Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 45: North America Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 46: North America Embedded Die Packaging Market Attractiveness Analysis, by Country

    Figure 47: Europe Embedded Die Packaging Market Size (US$ Mn), 2018 – 2030

    Figure 48: Europe Embedded Die Packaging Market Value Share Analysis, by Platform (2020)

    Figure 49: Europe Embedded Die Packaging Market Value Share Analysis, by Platform (2030)

    Figure 50: Europe Embedded Die Packaging Market Value Share Analysis, by Application (2020)

    Figure 51: Europe Embedded Die Packaging Market Value Share Analysis, by Application (2030)

    Figure 52: Europe Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)

    Figure 53: Europe Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)

    Figure 54: Europe Embedded Die Packaging Market Value Share Analysis, by Country (2020)

    Figure 55: Europe Embedded Die Packaging Market Value Share Analysis, by Country (2030)

    Figure 56: Europe Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 57: Europe Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 58: Europe Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 59: Europe Embedded Die Packaging Market Attractiveness Analysis, by Country

    Figure 60: Asia Pacific Embedded Die Packaging Market Size (US$ Mn), 2018 – 2030

    Figure 61: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Platform (2020)

    Figure 62: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Platform (2030)

    Figure 63: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Application (2020)

    Figure 64: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Application (2030)

    Figure 65: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)

    Figure 66: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)

    Figure 67: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Country (2020)

    Figure 68: Asia Pacific Embedded Die Packaging Market Value Share Analysis, by Country (2030)

    Figure 69: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 70: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 71: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 72: Asia Pacific Embedded Die Packaging Market Attractiveness Analysis, by Country

    Figure 73: Middle East & Africa  (MEA) Embedded Die Packaging Market Size (US$ Mn), 2018 – 2030

    Figure 74: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Platform (2020)

    Figure 75: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Platform (2030)

    Figure 76: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Application (2020)

    Figure 77: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Application (2030)

    Figure 78: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)

    Figure 79: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)

    Figure 80: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Country (2020)

    Figure 81: Middle East & Africa  (MEA) Embedded Die Packaging Market Value Share Analysis, by Country (2030)

    Figure 82: Middle East & Africa  (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 83: Middle East & Africa  (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 84: Middle East & Africa  (MEA) Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 85: Middle East & Africa  (MEA) Embedded Die Packaging Market Attractiveness Analysis, by Country

    Figure 86: South America Embedded Die Packaging Market Size (US$ Mn), 2018 – 2030

    Figure 87: South America Embedded Die Packaging Market Value Share Analysis, by Platform (2020)

    Figure 88: South America Embedded Die Packaging Market Value Share Analysis, by Platform (2030)

    Figure 89: South America Embedded Die Packaging Market Value Share Analysis, by Application (2020)

    Figure 90: South America Embedded Die Packaging Market Value Share Analysis, by Application (2030)

    Figure 91: South America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2020)

    Figure 92: South America Embedded Die Packaging Market Value Share Analysis, by End-use Industry (2030)

    Figure 93: South America Embedded Die Packaging Market Value Share Analysis, by Country (2020)

    Figure 94: South America Embedded Die Packaging Market Value Share Analysis, by Country (2030)

    Figure 95: South America Embedded Die Packaging Market Attractiveness Analysis, by Platform

    Figure 96: South America Embedded Die Packaging Market Attractiveness Analysis, by Application

    Figure 97: South America Embedded Die Packaging Market Attractiveness Analysis, by End-use Industry

    Figure 98: South America Embedded Die Packaging Market Attractiveness Analysis, by Country

    Figure 99: Global Embedded Die Packaging Market Share Analysis, by Company

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Embedded Die Packaging Market

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