Heat Sinks Market

Heat Sinks Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2021-2031

Heat sink is component designed or placed in circuitry to remove the excess amount of heat generated during the operation by electronic components or chips. It is primarily utilized for thermal management in order to avoid the unexpected failure of a device, which increase its efficiency and reliability.
The heat sink operates under the Fourier’s law of heat transfer. Whenever temperature across the device increases, it tries to dissipate it through lower temperature areas around it. The heat sink acts as heat exchanger, acting on the principle of conduction and convection.
Metals with excellent thermal conductivity such as copper and aluminum make the most efficient heat sinks. However, aluminum is more commonly utilized due to its lower costs. The heat sink increases the conductive area around the heat dissipating device; it can be made of various materials and different shapes.

Ongoing trend in designing electronics systems to increase the functionality into smaller form factors. Therefore, the power dissipation from most IC devices continues to increase, which in turn fuels the demand for more efficient heat sinks and optimized designs.
Demand for electronics and power devices is increasing in diverse end-use industries; for instance, upcoming 5G implementation is likely to support the large influx of data and connectivity needs for industries such as autonomous vehicles, smart cities, robotics, augmented reality, virtual reality, and manufacturing automation. The number of cloud data center installations is increasing at a rapid pace due to the rapid rise in adoption of artificial intelligence and the Internet of Things (IoT) integrating smart functionality and connectivity across most industries.
Thermal management is becoming a very important part of any system design, which is increasing reliability, maximizing full system capabilities, and creating performance differentiation

Asia Pacific is projected to hold a prominent share of the global market during the forecast period, due to the expansion of the consumer electronics industry in the region. Increase in automotive production in the region also fuels the demand for heat sink. Expansion of chip manufacturing companies in China and South Korea is driving the thermal management market in Asia Pacific.
North America and Europe are also likely to gain share in the global heat sink market. Demand for servers and data centers has been increasing significantly for the last few years. These comprise numerous equipment that need more number of heat sink to manage the thermal activities for smooth and continuous operation of devices.

Several players operating in the global heat sink market are adopting new techniques and rapidly changing designs and requirements.

Key players include:

Global Heat Sinks Market, by Material

Global Heat Sinks Market, by Mounting Type

Global Heat Sinks Market, by Type

Global Heat Sinks Market, by End-use Application

Global Heat Sinks Market, by Manufacturing Process

Global Heat Sinks Market, by Region

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