Global failure analysis equipment market was valued at USD 4.08 billion in 2012, growing at a CAGR of 8.8% from 2013 to 2019. Rapid growth in nanotechnology coupled with growth in medical applications in the Asia Pacific region has fueled the growth of failure analysis equipment market. In addition, increased investments in research and education infrastructure are also propelling the growth of failure analysis equipment market. However, high cost of failure analysis equipment leads to low adoption rate of these, especially in the cost sensitive countries of Asia Pacific region. Thereby, hinders the growth of failure analysis equipment to an extent. On the other hand, growing innovative techniques such as super-resolution microscopy and correlative light and electron microscopy (CLEM) are excellent opportunities for the market which are expected to bolster the failure analysis equipment market in the years to come.
In 2012, Asia Pacific was the largest revenue generator for the failure analysis equipment market. The dominance by Asia Pacific is due to large number of countries such as China, India, Japan, Taiwan and Australia among others investing heavily in research and development infrastructure, nanotechnology as well as medical technologies. Similarly, North America and Europe collectively accounted for over one-third of the market share, as these have been continually focusing on research and development and have been using failure analysis equipment for R&D purpose.
Focused Ion Beam system (FIB) and Transmission Electron Microscope (TEM) accounted for majority market share in 2012, owing to rapid usage of these equipments. However, Dual Beams systems (FIB/SEM) are expected to grow at the fastest pace in the years to come owing to the several advantages over a single-beam FIB system, especially for sample preparation and microscopy applications. Thus, Dual Beam systems (FIB/SEM) are expected to grow over the forecast period.
Secondary ion mass spectroscopy (SIMS) accounted for majority market share in the year 2012 owing to several advantages such as the ability to identify elements present in very low concentration levels and the ability to identify all elements such as helium and hydrogen. Focused Ion Beam (FIB) techniques are used in applications such as die surface milling or cross-sectioning, high magnification microscopy and even material deposition. Thus, the usage in wide array of applications is expected to drive the FIB technology over the forecasted period from 2013 to 2019.
The global failure analysis equipment market has been segmented by equipment into Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam Systems (FIB) and Dual Beam (FIB/SEM) Systems. The key industry participants include FEI Company, Hitachi High-Technologies Europe GmbH, Carl Zeiss SMT GmbH and JEOL, Ltd. among others.
Failure analysis is an engineering approach to determining how and why component or equipment has failed. The goal of a failure analysis is to understand the root cause of the failure to prevent similar failures in the future. Common causes of failure include misuse or abuse, manufacturing defects, assembly errors, improper maintenance, design errors, improper material, fastener failure, improper heat treatments, inadequate quality assurance, inadequate environmental protection/control, unforeseen operating conditions and casting discontinuities.
This market research study analyzes the failure analysis equipment market on a global level, and provides estimates in terms of revenue (USD Billion) from 2013 to 2019. It recognizes the drivers and restraints affecting the industry and analyzes their impact over the forecasted period. Moreover, it identifies the significant opportunities for market growth in the years to come.
The report segments the market on the basis of geography into North America, Asia Pacific (APAC), Europe, and Rest of the World (RoW), and estimated in terms of revenue (USD Billion). In addition, the report segments the market based on equipments which includes Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam Systems (FIB) and Dual Beam (FIB/SEM) Systems.
Furthermore, the report has also been segmented on the basis of end-use which includes Semiconductors Manufacturing, Fiber Optics, Bio medical and life sciences, Metallurgy, Nanotechnology and nanomaterials and Polymers. Moreover, the report segments the market based on technology which includes Focused Ion Beam (FIB), Broad Ion Milling (BIM), Secondary ion mass spectroscopy (SIMS), Energy dispersive X-ray spectroscopy (EDX), Reactive ion etching (RIE) and Chemical mechanical planarization (CMP). All these segments have also been estimated on the basis of geography in terms of revenue (USD Billion).
For better understanding of the failure analysis equipment market, we have given a detailed analysis of the value chain. Moreover, a detailed Porter’s five forces analysis has been given for a better understanding of the intensity of competition present in the market. Furthermore, the study comprises of a market attractiveness analysis, where the equipment are benchmarked based on their market scope, growth rate and general attractiveness.
The report provides company market share analysis of the various industry participants. Key players have also been profiled on the basis of company overview, financial overview, business strategies, SWOT analysis, and recent developments in the field of failure analysis equipment. Major market participants profiled in this report include FEI Company, Hitachi High-Technologies Europe GmbH, Carl Zeiss SMT GmbH and JEOL, Ltd. among others.
Failure analysis equipment Market: By geography
- North America
- Asia Pacific
- Rest of the World
Failure analysis equipment Market: By equipment
- Scanning electron microscope (SEM)
- Transmission electron microscope (TEM)
- Focused Ion Beam system (FIB)
- Dual - Beam (FIB/SEM) systems
Failure analysis equipment Market: By technology
- Focused ion beam (FIB)
- Broad ion milling (BIM)
- Secondary ion mass spectroscopy (SIMS)
- Energy dispersive X-ray spectroscopy (EDX)
- Reactive ion etching (RIE)
- Chemical mechanical planarization (CMP)
Failure analysis equipment Market: By end-use
- Semiconductors manufacturing
- Fiber optics
- Bio-medical and life sciences
- Nanotechnology and nanomaterials
The report provides a cross-sectional analysis of all the above segments with respect to the following regions:
- North America
- Asia Pacific
- Rest of the World (RoW)