Glass substrates are thin, flat glass boards on which a thin circuit is deposited with precision. Glass is mainly used in everyday life and found in large quantities in many industries, such as flat panel display applications. Over the past few years, glass has achieved major interest from the semiconductor industry due to its very good electrical, physical and chemical properties, as well as its prospects for an applicable and cost-efficient solution. The demand for glass is growing, and glass has already been adapted for various and unique wafers processing functionalities as well as platforms supporting a wide range of end-applications. Initially driven by CMOS Image Sensor and MEMS applications, this growing industry will be supported by relevant end-applications such as LED, memory and logic IC. Used either as a permanent or as a temporary material within the semiconductor manufacturing processes, glass plays an important role in the semiconductor industry. Due to its excellent chemical, mechanical, electrical, and optical properties, glass substrate based applications are constantly expanding. Glass substrate is making serious advancements in the semiconductor market, adopting various functionalities within IC semiconductor devices. Such substrates also plays a very important role to reproduce clear and beautiful screen images as one of the core components of LCDs. Most of the major players have developed a varied line of glass substrates precisely designed for semiconductor packaging applications.
Rising need for glass substrate in semiconductor industry, increasing use of LCDs in consumer durables, smart handheld devices and other applications, need for improved shock resistance as well as higher stability are some of the primary factors driving the growth of the global glass substrate in semiconductor market. However, the high manufacturing cost of glass substrates acts is one of the factors hampering the growth of glass substrate in semiconductor market. In recent times metallic glass is used as a substrate for semiconductor devices. The metallic glass substrate is morphologically amorphous as well as electrically conductive. The metallic glass substrate can also be used in other forms of semiconductor devices whose morphological nature does not hamper the device processing and the device performance. Efforts are being taken by many companies to upgrade their research and development activities to introduce innovations in this field.
The global glass substrate in semiconductor market is segmented on the basis of type, industry vertical, end-user application and region. On the basis of type, the market is segmented into borosilicate, silicon, ceramic, TFT-LCD glass substrate and fused silica/quartz based Glass substrates. Borosilicate-based glass substrates are quite reasonable as compared to other glass substrates. Unique properties of borosilicate-based glass substrates, such as low coefficient of thermal expansion, high chemical resistivity as well as high surface strength are contributing to the increased consumption of borosilicate-based glass substrates. Fused silica has high working and melting temperatures. The optical and thermal properties of fused quartz are better to those of other types of glass due to its purity. On the basis of industry vertical, the global glass substrate in semiconductor market is segmented into defense, automobile, renewable energy, electronics and medical. On the basis of end-user application the market is segmented into MEMS, CMOS Image Sensors, LED, Memory, logic IC, RF/Analog ICs, power, micro-batteries and optoelectronic components among others. Geographically, the glass substrate in semiconductor market can be segmented into North America, Europe, Middle East & Africa, Asia Pacific and Latin America.
Some of the key players operating in the global glass substrate in semiconductor market are Schott AG, Tecnisco Limited, Plan Optik AG, Asahi Glass Co., Ltd., LG Chem, HOYA Corporation, OHARA Inc., Nippon Sheet Glass Co., Ltd and Corning Inc. among others.
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