Embedded Die Packaging Technology Market: An Overview

Embedded die packaging technology embeds the components inside the substrate using a multi-step manufacturing process. A die, multiples dies or passive can be embedded in a side-by-side arrangement in the core of an organic substrate. The components are connected by copper-plated vias which reside in the board and free up space in the system. The less storage advantage is anticipated to boost the demand for embedded die packaging technology. Technological developments and advancements have led to the demand for embedded die packaging technology. Embedding technologies for various requirements such as chip dimensions, electrical performance and interconnection. Miniaturization leads to stacking of multiple layers containing embedded components which allow design flexibility and larger board layouts. This is likely to fuel the market growth of embedded die packaging technology.

Embedded Die Packaging Technology Market: Dynamics

Embedded die packaging technology has benefits such as improved electrical & thermal performance, heterogeneous integration, streamlined logistics for OEMs and opportunity for cost reduction. Passive components are routinely embedded in laminate substrates. This has led to suppress the switching noise of high-speed digital packages. Embedded die packaging technology has led to improved technology, higher yield and increased demand for heterogeneous integration in the semiconductor industry. This is expected to increase the market demand for embedded die packaging technology. Moreover, the growth in the electronics industry for products like portable handset, tablet and networking devices have been fuelled by consumer demand for increased mobility, utility and ease of use. This has led to an increase in demand for functional convergence and integration of integrated circuit devices which requires complex packaging techniques. This has led to the adaptability of embedded die packaging technology by manufacturers.

Embedded die packaging technology supports the trend of modularization with lower set-up costs compared to other packaging technologies. In addition, the hidden components in the embedded die packaging technology prevent the risk of reverse engineering and counterfeiting of electronical products. Wide application and usage in automotive, medical devices, telecommunication, wearable devices and mobile handsets are anticipated to fuel the demand for embedded die packaging technology in the years to come.

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Embedded Die Packaging Technology Market: Segmentation

Embedded Die Packaging Technology Market can be segmented on the basis of platform, application and end-use industry.

By Platform, Embedded Die Packaging Technology Market can be segmented as

  • Embedded Die in IC Package Substrate
  • Embedded Die in Flexible Board
  • Embedded Die in Rigid Board

By Application, Embedded Die Packaging Technology Market can be segmented as

  • Medical wearable devices
  • Medical implants
  • Sports/fitness devices
  • Military
  • Industrial sensing
  • Others

By End-User Industry, Embedded Die Packaging Technology Market can be segmented as

  • Consumer Electronics
  • IT & Telecommunications
  • Automotive
  • Healthcare
  • Others

Embedded Die Packaging Technology Market: Regional Outlook

Growth of Internet of Things (IoT) is expected to provide new opportunities for the players operating in the market across the world. North America region is expected to grow at a high CAGR owing to developed telecommunication infrastructure and rising adoption of IoT. Furthermore, Asia Pacific is likely to grow due to the large presence of the manufacturers in the countries such as China, Taiwan and Japan. In addition, the growing population and increasing disposable income are likely to boost the growth of embedded die packaging technology market.

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Embedded Die Packaging Technology Market: Impact of COVID 19

Consumer goods OEMs are facing serious disruption in the supply of raw and finished materials as well as critical components due to the impact of COVID 19 on China. Demand for electronics, hygiene products and essential goods is high and consumers are increasingly turning to online shopping for them. Impact of COVID 19 has resulted in lasting structural changes to the consumer goods industry. Moreover, Asia is the major supplier of electronics. A significant amount of uncertainty is expected to exist because of the changing scope as well as the reactions by governments and companies. Thus, it is anticipated that the growth for embedded die packaging technology is likely to witness a below-average growth rate for the year 2020. However, in the long run, the embedded die packaging technology market is likely to grow with the advent of digitalization and e-commerce.

Embedded Die Packaging Technology Market: Key Players

Key players in the Embedded Die Packaging Technology Market are as follows,

  • Amkor Technology
  • ASE Group, AT & S
  • MicroSemi
  • Schweizerare
  • STMICROELECTRONICS
  • Toshiba Corporation, Fujitsu Limited
  • Taiwan Semiconductor Manufacturing Company
  • General Electric
  • Infineon, Fujikura
  • TDK-Epcos

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Embedded Die Packaging Technology Market

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