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Embedded Die Packaging Technology Market: An Overview

Embedded die packaging technology embeds the components inside the substrate using a multi-step manufacturing process. A die, multiples dies or passive can be embedded in a side-by-side arrangement in the core of an organic substrate. The components are connected by copper-plated vias which reside in the board and free up space in the system. The less storage advantage is anticipated to boost the demand for embedded die packaging technology. Technological developments and advancements have led to the demand for embedded die packaging technology. Embedding technologies for various requirements such as chip dimensions, electrical performance and interconnection. Miniaturization leads to stacking of multiple layers containing embedded components which allow design flexibility and larger board layouts. This is likely to fuel the market growth of embedded die packaging technology.

Embedded Die Packaging Technology Market: Dynamics

Embedded die packaging technology has benefits such as improved electrical & thermal performance, heterogeneous integration, streamlined logistics for OEMs and opportunity for cost reduction. Passive components are routinely embedded in laminate substrates. This has led to suppress the switching noise of high-speed digital packages. Embedded die packaging technology has led to improved technology, higher yield and increased demand for heterogeneous integration in the semiconductor industry. This is expected to increase the market demand for embedded die packaging technology. Moreover, the growth in the electronics industry for products like portable handset, tablet and networking devices have been fuelled by consumer demand for increased mobility, utility and ease of use. This has led to an increase in demand for functional convergence and integration of integrated circuit devices which requires complex packaging techniques. This has led to the adaptability of embedded die packaging technology by manufacturers.

Embedded die packaging technology supports the trend of modularization with lower set-up costs compared to other packaging technologies. In addition, the hidden components in the embedded die packaging technology prevent the risk of reverse engineering and counterfeiting of electronical products. Wide application and usage in automotive, medical devices, telecommunication, wearable devices and mobile handsets are anticipated to fuel the demand for embedded die packaging technology in the years to come.

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Embedded Die Packaging Technology Market: Segmentation

Embedded Die Packaging Technology Market can be segmented on the basis of platform, application and end-use industry.

By Platform, Embedded Die Packaging Technology Market can be segmented as

  • Embedded Die in IC Package Substrate
  • Embedded Die in Flexible Board
  • Embedded Die in Rigid Board

By Application, Embedded Die Packaging Technology Market can be segmented as

  • Medical wearable devices
  • Medical implants
  • Sports/fitness devices
  • Military
  • Industrial sensing
  • Others

By End-User Industry, Embedded Die Packaging Technology Market can be segmented as

  • Consumer Electronics
  • IT & Telecommunications
  • Automotive
  • Healthcare
  • Others

Embedded Die Packaging Technology Market: Regional Outlook

Growth of Internet of Things (IoT) is expected to provide new opportunities for the players operating in the market across the world. North America region is expected to grow at a high CAGR owing to developed telecommunication infrastructure and rising adoption of IoT. Furthermore, Asia Pacific is likely to grow due to the large presence of the manufacturers in the countries such as China, Taiwan and Japan. In addition, the growing population and increasing disposable income are likely to boost the growth of embedded die packaging technology market.

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Embedded Die Packaging Technology Market: Impact of COVID 19

Consumer goods OEMs are facing serious disruption in the supply of raw and finished materials as well as critical components due to the impact of COVID 19 on China. Demand for electronics, hygiene products and essential goods is high and consumers are increasingly turning to online shopping for them. Impact of COVID 19 has resulted in lasting structural changes to the consumer goods industry. Moreover, Asia is the major supplier of electronics. A significant amount of uncertainty is expected to exist because of the changing scope as well as the reactions by governments and companies. Thus, it is anticipated that the growth for embedded die packaging technology is likely to witness a below-average growth rate for the year 2020. However, in the long run, the embedded die packaging technology market is likely to grow with the advent of digitalization and e-commerce.

Embedded Die Packaging Technology Market: Key Players

Key players in the Embedded Die Packaging Technology Market are as follows,

  • Amkor Technology
  • ASE Group, AT & S
  • MicroSemi
  • Schweizerare
  • Toshiba Corporation, Fujitsu Limited
  • Taiwan Semiconductor Manufacturing Company
  • General Electric
  • Infineon, Fujikura
  • TDK-Epcos

This study by TMR is all-encompassing framework of the dynamics of the market. It mainly comprises critical assessment of consumers' or customers' journeys, current and emerging avenues, and strategic framework to enable CXOs take effective decisions.

Our key underpinning is the 4-Quadrant Framework EIRS that offers detailed visualization of four elements:

  • Customer Experience Maps
  • Insights and Tools based on data-driven research
  • Actionable Results to meet all the business priorities
  • Strategic Frameworks to boost the growth journey

The study strives to evaluate the current and future growth prospects, untapped avenues, factors shaping their revenue potential, and demand and consumption patterns in the global market by breaking it into region-wise assessment.

The following regional segments are covered comprehensively:

  • North America
  • Asia Pacific
  • Europe
  • Latin America
  • The Middle East and Africa

The EIRS quadrant framework in the report sums up our wide spectrum of data-driven research and advisory for CXOs to help them make better decisions for their businesses and stay as leaders.

Below is a snapshot of these quadrants.

1. Customer Experience Map

The study offers an in-depth assessment of various customers’ journeys pertinent to the market and its segments. It offers various customer impressions about the products and service use. The analysis takes a closer look at their pain points and fears across various customer touchpoints. The consultation and business intelligence solutions will help interested stakeholders, including CXOs, define customer experience maps tailored to their needs. This will help them aim at boosting customer engagement with their brands.

2. Insights and Tools

The various insights in the study are based on elaborate cycles of primary and secondary research the analysts engage with during the course of research. The analysts and expert advisors at TMR adopt industry-wide, quantitative customer insights tools and market projection methodologies to arrive at results, which makes them reliable. The study not just offers estimations and projections, but also an uncluttered evaluation of these figures on the market dynamics. These insights merge data-driven research framework with qualitative consultations for business owners, CXOs, policy makers, and investors. The insights will also help their customers overcome their fears.

3. Actionable Results

The findings presented in this study by TMR are an indispensable guide for meeting all business priorities, including mission-critical ones. The results when implemented have shown tangible benefits to business stakeholders and industry entities to boost their performance. The results are tailored to fit the individual strategic framework. The study also illustrates some of the recent case studies on solving various problems by companies they faced in their consolidation journey.

4. Strategic Frameworks

The study equips businesses and anyone interested in the market to frame broad strategic frameworks. This has become more important than ever, given the current uncertainty due to COVID-19. The study deliberates on consultations to overcome various such past disruptions and foresees new ones to boost the preparedness. The frameworks help businesses plan their strategic alignments for recovery from such disruptive trends. Further, analysts at TMR helps you break down the complex scenario and bring resiliency in uncertain times.

The report sheds light on various aspects and answers pertinent questions on the market. Some of the important ones are:

1. What can be the best investment choices for venturing into new product and service lines?

2. What value propositions should businesses aim at while making new research and development funding?

3. Which regulations will be most helpful for stakeholders to boost their supply chain network?

4. Which regions might see the demand maturing in certain segments in near future?

5. What are the some of the best cost optimization strategies with vendors that some well-entrenched players have gained success with?

6. Which are the key perspectives that the C-suite are leveraging to move businesses to new growth trajectory?

7. Which government regulations might challenge the status of key regional markets?

8. How will the emerging political and economic scenario affect opportunities in key growth areas?

9. What are some of the value-grab opportunities in various segments?

10. What will be the barrier to entry for new players in the market?

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

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Embedded Die Packaging Technology Market