Memory Market Creates Profitable Revenue Opportunities for Manufacturers amidst COVID-19 Crisis

The semiconductor industry is seeing huge potential during and post the COVID-19 (coronavirus) pandemic. Data centers and work-from-home policies have triggered the demand for huge storage capacities in laptops and smart devices. As such, many semicon foundries in France, Russia, Brazil, and India are still operating in partial capacities. This has severely disrupted supply chains in the global embedded die packaging market. China being the manufacturing hub for electronics is now scaling value-grab opportunities, since the pandemic has significantly subsided in the country.

Unemployment and salary holdbacks have created a limited demand for electronic devices. Since electronic devices do not fall under essential products and services industry, manufacturers are experiencing a demand shortage from customers. Hence, manufacturers in the embedded die packaging market are focusing on critical-mission projects for medical implants, military communication devices, and aircraft to build the global economy.

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EMIBs Deploy Computing Supremacy by Reducing Costs and Eliminate Complexity of Interposers

Market leaders in the embedded die packaging market are leaning hard in advanced chip packaging technologies in order to gain computing edge. For instance, Intel— a U.S. multinational corporation and technology company, is relying on EMIB (embedded multi-interconnect bridge) to enable die-to-die connections using tiny silicon bridges embedded in package substrates. As such, EMIB is emerging as an alternative to interposers in favor of tiny silicon bridges on substrates. This is eliminating inherent layers of complexity and cutting down on costs to manufacture miniaturized smart devices.

Companies in the embedded die packaging market are increasing the availability of EMIBs loaded with micro-bumps that facilitate die-to-die connections. EMIBs have made it possible to achieve a significantly high bump density, which deploys computing supremacy. Moreover, small silicon bridges are more cost-efficient as compared to interposers.

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Embedded Die Packaging Witnesses Stiff Competition from Fan-out and Lead-frame Packages

The embedded die packaging market is projected to advance at a striking CAGR of ~17% during the forecast period. However, the cost of embedded die is high and the market is evolving at a relatively slow pace. Hence, companies in the embedded die packaging market are increasing their innovations in the packaging landscape to compete with fan-out and lead-frame packages.

The integrated circuit (IC) technology is shifting away from monolithic chips and toward the use of chiplets tied together in advanced packaging technology. As such, EMIB and silicon interposers are growing popular in 2.5/3D packaging technologies. EMIB is being highly publicized for providing high bandwidth link between multiple die of different nodes and circuit types.

Supply Chain Management Crucial for Growth in SiP Business

The transition from single embedded die into multiple-embedded dies is a recurring trend for the system-in-package (SiP) industry. Companies in the embedded die packaging market are scaling future growth opportunities, since the complexity and size of IC substrates and boards are anticipated to increase in the upcoming years. This is emerging as a challenge for semicon companies but with increased R&D efforts, manufacturers can adapt to future developments in products.

The growth of telecom and automotive sectors is expected to create value-grab opportunities for companies in the embedded die packaging market. Manufacturers are focused on supply chain management to excel in the SiP business. Thus, manufacturers are bearing in mind key factors such as technological innovations, cost, and material requirements.

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Analysts’ Viewpoint

Online sales of electronic devices have helped semicon companies to keep economies running during the COVID-19 pandemic. Increase in the complexity and size of IC substrates and boards in the future will trigger the demand for embedded die packaging. Revenue opportunities in the system-in-package market are relatively small, but companies should scale business opportunities in this market landscape since the system-in-package sector is expected for exponential growth between 2020 and 2030. As such, semicon companies should attend trade events and conferences to gain important insights about recent developments in the embedded die packaging market. The proliferation of the 5G technology, along with sensors, wearables, and IoT (Internet of Things).

Embedded Die Packaging Market: Overview

  • According to the latest research report of Transparency Market Research on the global embedded die packaging market for the historical period 2018–2019 and the forecast period 2020–2030, demand for IC package substrate platforms is on the rise around the globe due to its important characteristics of preventing the encapsulated semiconductor material from physical damage and corrosion, owing to which, they are used in various applications such as smartphones & tablets, medical implants and wearable devices, automotive modules, and communication & computing devices. This is expected to boost the global embedded die packaging market during the forecast period.
  • Moreover, demand for embedded die packaging is increasing in the aerospace & defense field around the globe, as it is increasingly being used in military communication applications, which is anticipated to drive the growth of the global embedded die packaging market
  • In terms of revenue, the global embedded die packaging market is estimated to reach a value of ~US$ 142 Mn by 2030, expanding at a CAGR of ~17% throughout the forecast period

Growing Demand for Consumer Electronics: A Key Driver of Embedded Die Packaging Market

  • The embedded die packaging market is expected to expand significantly due to the demand for consumer electronic products such as smartphones, tablets, set-top boxes, televisions, monitors, displays, speakers, computers, refrigerators, and many other products that require semiconductor assembly
  • From electronic components and semiconductor designs, to consumer electronics, semiconductor and electronics manufacturing sectors are moving up the value chain
  • Moreover, advancement in technology and higher competition in consumer electronics semiconductors, memory chips, and wafers used in consumer electronics and wireless handsets/mobile technologies are anticipated to be an important semiconductor revenue driver, owing to the development of low-power chips, which prolong battery life, especially of portable devices. Thus, technological advancement in consumer electronics industry is anticipated to boost the growth of the embedded die packaging market during the forecast period.

Rise in Adoption of Embedded Die Packaging in Consumer Electronics Applications: Latest Market Trend

  • Embedded die packaging has different applications and used in smartphone & tablets, medical implants and wearable devices, industrial sensing devices, industrial controlling devices, industrial metering devices, military communication & power devices, aircraft, security devices, automotive, communication & computing devices, and others (security cameras, access, control, etc.)
  • Embedded die technologies have been in existence for several years. Passive components, such as decoupling capacitors, are routinely embedded in laminate substrates. Embedded decoupling takes advantage of the capacitance between power and ground planes in a printed circuit board to suppress the switching noise of high speed digital packages.
  • Thus, rise in use of technologically advanced embedded die packaging in consumer electronics applications is expected to bolster the growth of the embedded die packaging market during the forecast period

High Cost Associated With Die Packaging: A Major Challenge of Embedded Die Packaging Market

  • Die packaging undergoes complex processes, and entails advanced equipment and high cost. The packaging of wafers is costly despite silicon being the second most abundant element on earth. Fabricating semiconductor wafers and chips, silicon has to be refined to purity, which is a complex process and ultimately increases the cost.
  • Extensive capital is needed to offer superior end packaging solutions, and in recent years, consumer electronics steel mills, space programs, and automobile manufacturing sectors have been characterized by rapid technological developments and shortening product cycles. These advancements come at a huge cost and require vast investments in developing R&D capabilities for semiconductor assembly and testing services.
  • Thus, high cost associated with die packaging is anticipated to hamper the growth of the embedded die packaging market in the upcoming years

Embedded Die Packaging Market: Competition Landscape

  • Detailed profiles of providers of embedded die packaging have been provided in the report to evaluate their financials, key product offerings, recent developments, and strategies
  • Key players operating in the global embedded die packaging market are
  • ASE Group,
  • AT&S,
  • Fujitsu Limited,
  • General Electric,
  • Infineon Technologies AG,
  • Microsemi Corporation,
  • STMicroelectronics,
  • TDK Corporation,
  • Texas Instruments Incorporation
  • Toshiba Corporation

Embedded Die Packaging Market: Key Developments

  • Key providers of embedded die packaging, such as Infineon Technologies AG, STMicroelectronics, Toshiba Corporation, and General Electric are focusing on the development of innovative and reliable embedded die packaging. Some other key developments in the global embedded die packaging market are as follows:
  • In April 2020, Infineon Technologies AG announced that all necessary regulatory approvals have been received for its acquisition of Cypress Semiconductor Corporation
  • In September 2019, STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will exhibit at Electronica India and SmartCards Expo
  • In January 2019, Toshiba Corporation’s electronic devices and storage division expanded its lineup of automotive Ethernet Bridge ICs with the new TC9562 series. This series offers more interfaces than the existing TC9560 series of bridge ICs.
  • In 2018, General Electric proposed a full featured, smart grid meter that offers consumers new technologies. These meters have the ability to customize advanced metering options to suit customer needs and configure load profile, time of use, and demand metering capabilities.
  • In the report on the global embedded die packaging market, we have discussed individual strategies, followed by company profiles of providers of embedded die packaging. The ‘Competition Landscape’ section has been included in the report to provide readers with a dashboard view and company market share analysis of key players operating in the global embedded die packaging market.

Embedded Die Packaging Market – Scope of the Report

A new study on the global embedded die packaging market is published by Transparency Market Research (TMR). It presents detailed information on key market dynamics, including drivers, trends, and challenges for the global embedded die packaging market as well as its structure. TMR’s study offers valuable information on the global embedded die packaging market in order to illustrate how the market is expected to expand during the forecast period i.e. 2020–2030.

Key indicators of market growth, which include value chain analysis and compound annual growth rate (CAGR), have been elucidated in TMR’s study in a comprehensive manner. This data can help readers interpret the quantitative growth aspects of the global embedded die packaging market.

An extensive analysis of business strategies adopted by leading market players has also been featured in TMR’s study on the global embedded die packaging market. This can help readers understand key factors responsible for growth of the global embedded die packaging market. In this study, readers can also find specific data on avenues for qualitative and quantitative growth of the global embedded die packaging market. This data would guide market players in making apt decisions in the near future.

Embedded Die Packaging Market – Segmentation

TMR’s study of the global embedded die packaging market segments the market based on platform, application, end-use industry, and region. Changing market trends and other crucial market dynamics associated with segments of the global embedded die packaging market have been discussed in detail in TMR’s study.

Key Questions Answered in TMR’s Study on Embedded Die Packaging Market

  • What would be the Y-o-Y growth trend of the global embedded die packaging market between 2020 and 2030?
  • What is the influence of changing trends in the platform segment on the global embedded die packaging market?
  • Would Asia Pacific continue to be the most dominant regional market for providers of embedded die packaging over the next few years?
  • Which factors would hinder the global embedded die packaging market during the forecast period?
  • Which are the leading companies operating in the global embedded die packaging market?

Research Methodology

A unique research methodology has been utilized by TMR to conduct comprehensive research on the global embedded die packaging market and arrive at conclusions on future growth prospects for the market. This research methodology is a combination of primary and secondary research, which helps analysts warrant the accuracy and reliability of the conclusions drawn.

Secondary research sources referred to by analysts during production of the report on the global embedded die packaging market include statistics from company annual reports, SEC filings, company websites, World Bank database, investor presentations, regulatory databases, government publications, and market white papers. Analysts have also interviewed senior managers, product portfolio managers, CEOs, VPs, and market intelligence managers, who have contributed to production of TMR’s study on the global embedded die packaging market as a primary research source.

These primary and secondary sources provided exclusive information during interviews, which served as a validation from leading players operating in the global embedded die packaging market. Access to an extensive internal repository as well as external proprietary databases allowed this report to address specific details and questions about the global embedded die packaging market with accuracy. The study also uses a top-down approach to assess the numbers for each segment and a bottom-up approach to counter-validate them. This has helped in making TMR’s estimates on future prospects for the global embedded die packaging market more reliable and accurate.

Embedded Die Packaging Market – Segmentation

TMR’s study of the global embedded die packaging market segments the market based on platform, application, end-use industry, and region. Changing market trends and other crucial market dynamics associated with segments of the global embedded die packaging market have been discussed in detail in TMR’s study.

Platform

  • IC Package Substrate
  • Rigid PCB
  • Flexible PCB

Application

  • Smartphone & Tablets
  • Medical Implants and Wearable Devices
  • Industrial Sensing Devices
  • Industrial Controlling Devices
  • Industrial Metering Devices
  • Military Communication & Power Devices
  • Aircraft
  • Security Devices
  • Automotive Modules
  • Communication & Computing Devices
  • Others (Security Cameras, Access Control, etc.)

End-use Industry

  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Aerospace & Defense
  • Automotive
  • Industrial
  • Others

Region

  • North America
  • South America
  • Europe
  • Asia Pacific
  • Middle East & Africa

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