A combo chip is an integrated circuit that includes two or more subsystems that are originally contained on separate chips. For example, the communication chips that support multiple radio technology such as Bluetooth and Wi-Fi, GPS and FM. A CPU Chip that includes a GPU on the same die is also known as a combo chip set. It also supports an extensive suite of advanced WiFi connectivity options with multiple WiFi standards, as well as Bluetooth 3.0 and Bluetooth 4.0 and the worldwide FM radio frequency band. The combochip is intended to provide the solution for in car Wi-Fi, Bluetooth 5 and 802. If we talk technically the chips are the piece of silicon with an electronic circuit embedded in it. The manufacturers in the technologically advanced electronics and semiconductor domain are now focusing on the manufacturing of the combo chips. Such as MediaTek (Taiwanese fabless semiconductor company) recently announced its newest intelligent connectivity chipset to support the next generation of Wi-Fi technology - Wi-Fi 6 (802.11ax) - for home and enterprise wireless network services. It has been designed by them such that it supports a range of products including wireless access points, routers, gateways and repeaters, which brings faster and more reliable connectivity throughout the smart home. There are several different combo chips made by the other major players to that supports solution integrating WiFi, Bluetooth and FM with a GPS receiver for mobile applications, orthogonal frequency division multiple access (OFDMA), multi-user MIMO (MU-MIMO), target wake time (TWT)  and spatial reuse.

There are several factors for the growth of the combo chip market such as network compatibility with multiple radio technology such as Bluetooth, Wi-Fi etc. These chips are usually manufactured with the low cost, which is proving great success for IoT solution providers as they can now create a new generation of applications that combines the strengths of both protocols. There are many companies that are introducing new and technologically advanced products. Combo-chips have become a vital component for wireless connectivity devices such as tablets and smartphones. The increasing need among consumers to communicate and access data has increased the demand for combo-chips in tablets.

The global combo chip market is segmented on the basis of component, application, end-use industry and region. On the basis of component, the combo chip market has been segmented into hardware and software. On the basis of application, the combo chip market can be segmented in automotive infotainment, consumer electronics and IoT applications. The largest and the fastest growing segment for the combo chip market is  expected to be the IoT application segment, since the combo chip has an integrated dual-band power amplifier, transmit antenna switch and on-chip matching circuit, which allows it to meet the most stringent carrier requirements while minimizing solution size and power consumption.

In the region wise study, the global combo chip market has been segmented into North America, Europe, Asia Pacific, Middle East & Africa, and South America. North America which comprises the United States, Canada and Mexico captured significant market share followed by Asia Pacific in 2018. Asia Pacific region showed the fastest growth rate during the forecast period due to the emerging economies. China, Taiwan and South Korea represents huge potential for the combo chip with the low cost of raw materials and huge production facilities in the country. However, the U.S is expected to exhibit high market growth over the forecast period owing to its early technological advancement and high capital expenditure.

The global combo chip market is highly fragmented with number of companies operating in the segment. Leading players are currently focusing on providing cost competitive products and add-on features to gain market share in the market. Some of the companies operating in this combo chip market are Broadcom Corporation, Grid Connect, Inc., RDA Microelectronics, Microsoft, NXP Semiconductors, AMD, IBM, Intel, Postscapes, Texas Instruments Inc., Marvell Technology Group Ltd. and others.

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