Chemical Mechanical Planarization of Silicon Enables Development of New Electronics

Chemical mechanical planarization (CMP) is a fundamental technology in the consumer and industrial electronics landscape. Companies in the chemical mechanical planarization market are increasing their production capabilities to meet increasing demands for high-precision electronic wafers. Thus, global planar uniformity is benefitting the semiconducting substrates value and supply chain.

Innovations in CMP have enabled the development of state-of-the-art consumer electronics. Companies in the chemical mechanical planarization market are using silicon to develop high-performance semiconductors. As such, compound semiconductors account for the third-highest revenue amongst all applications in the chemical mechanical planarization market, with an estimated value of ~US$ 700 million by the end of 2027. Thus, the semiconducting properties of silicon make it an ideal choice for the production of transistors, diodes, and microelectronics, amongst others.

Companies in the chemical mechanical planarization space are gauging the incremental opportunities available, as abundance of silicon on the Earth make it a cost-efficient material for the production of high-quality electronic devices. The cost-effectiveness of silicon is likely to lead innovation in electronic devices toward ultra-large-scale-integration and systems-on-chips.

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Advanced Polishing Pads Help Production of High-performance Devices

Chemical mechanical polishing pads play a crucial role in the overall performance of the polishing process. As such, pads are predicted to dominate the chemical mechanical planarization market, and record the second-highest revenue amongst all consumables, with an estimated value of ~US$ 1.3 billion by the end of 2027. Thus, companies are capitalizing on the sales of high-performance devices that have low cost and low power consumption, and are developed with the help of advanced polishing pads. Growing trends of IoT, longer battery life, and mobility are anticipated to contribute to the exponential growth of the chemical mechanical planarization market.

Manufacturers in the chemical mechanical planarization landscape are increasing their focus on device scaling. They are experimenting with advancements in lithography and vertical device integrations for 3D devices. Material innovations also play a dominant role with the implementation of metal gate and novel compound solutions in devices. CMP is becoming increasingly popular in non-IC (integrated circuit) applications, such as the fabrication of micro lens array for improved extraction of light from LED (light emitting diodes).

High-quality Slurries Meet Increasing Requirements in Complex CMP Processes

There is growing demand for high-quality CMP slurries in semiconductor applications. Likewise, the chemical mechanical planarization consumables market is consolidated, with only four major players accounting for ~60% of the market share. Hence, companies are competing to offer high-quality slurries for complex CMP processes. Companies in the chemical mechanical planarization market are increasing their production capacities to deliver higher volumes of dielectric and metal polishing solutions. They are increasing investments in advanced slurry technology with the help of well-funded R&D programs.

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Companies in the chemical mechanical planarization ecosystem are focusing on growing their product portfolios by increasing the availability of premium-quality nitride and polysilicon slurries that can increasingly meet defect reduction requirements. These requirements are complemented with the demand for tighter specifications, at a lower cost of manufacturing. Companies in the chemical mechanical planarization market are making widespread use of water-glass colloidal silica slurries in semiconductor devices.

Enhanced Open Innovation Methods Create Incremental Opportunities in ICAC5

Miniaturization of semiconductors is becoming increasingly prevalent in the chemical mechanical planarization market. However, technical challenges have always been a hurdle for manufacturers in the chemical mechanical planarization ecosystem. To win over these technical challenges, manufacturers are proposing new innovation strategies. These strategies are closed innovation (CI) and open innovation (OI) methods.

In the CI method, only a certain amount of variety and volume of research is pursued for technological development. Hence, companies in the chemical mechanical planarization market are increasingly following the OI method to avoid technological stagnation. With the help of OI, they are extensively pursuing research efforts outside the company with the help of mergers, acquisitions, and strategic collaborations.

The OI method acts as a catalyst for explosive market growth of the electronic devices sector, due to a shift in the single-driver technology involving computers and mobile phones, to the multi-driver technology. The multi-driver technology is anticipated to be increasingly adopted by manufacturers in ICAC5 (IoT, cloud, AI, cars, and 5G) applications. Another application driving incremental opportunities for manufacturers is the technique of wafer drying using the mechanical engineering (ME) technology.

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Analysts’ Viewpoint

High-quality slurries are generating incremental opportunities for manufacturers in the chemical mechanical planarization market. These slurries complement the production of complex front-end memory device integrations. Manufacturers should increase their production capabilities for the development of CMP pads that increasingly meet the requirements of high removal rate and reduced defectivity.

However, the rate of anticipated technology innovation does not match the rate of practical technological innovation. To avoid this issue of technology stagnation, manufacturers should adopt OI methods such as introducing innovations in brush cleaning mechanism using ME tribology. Companies should increase their research efforts to experiment with new technologies in semiconductor device fabrication.

Chemical Mechanical Planarization Market - Scope of the Report

The latest study collated and published by Transparency Market Research (TMR) analyzes the historical and present-day scenario of the global chemical mechanical planarization market, to accurately gauge its potential future development. The study presents detailed information about the important growth factors, restraints, and key trends that are creating the landscape for the future growth of the chemical mechanical planarization market, to identify the opportunistic avenues of the business potential for stakeholders. The report also provides insightful information about how the chemical mechanical planarization market will progress during the forecast period of 2019 to 2027.

The report offers intricate dynamics about different aspects of the chemical mechanical planarization market that aids companies operating in the market in making strategic development decisions. TMR’s study also elaborates on the significant changes that are highly anticipated to configure the growth of the chemical mechanical planarization market during the forecast period. It also includes a key indicator assessment to highlight the growth prospects of the chemical mechanical planarization market, and estimates statistics related to the market progress in terms of value (US$ Mn).

This study covers detailed segmentation of the chemical mechanical planarization market, along with key information and a competitive outlook. The report mentions the company profiles of key players that are currently dominating the chemical mechanical planarization market, wherein, various development, expansion, and winning strategies practiced and executed by leading players have been presented in detail.

Key Questions Answered in TMR’s Report on Chemical Mechanical Planarization Market

The report provides detailed information about the chemical mechanical planarization market on the basis of comprehensive research on various factors that are playing a key role in accelerating the growth potential of the market. Information mentioned in the report answers path-breaking questions for companies that are currently functioning in the market and are looking for innovative ways to create a unique benchmark in the chemical mechanical planarization industry, so as to help them make successful strategies and take target-driven decisions.

  • Which type of equipment will emerge as a major revenue generator for the market during the forecast period?
  • How are key market players successfully earning revenue out of the advantages of chemical mechanical planarization?
  • What will be the Y-o-Y growth of the chemical mechanical planarization market from 2019 and 2027?
  • What are the winning imperatives of market frontrunners in the CMP market?
  • Which consumable is expected to develop maximum application for chemical mechanical planarization during the foreseeing period?

Research Methodology – Chemical Mechanical Planarization Market

The research methodology adopted by analysts for combining the chemical mechanical planarization market report is based on detailed primary as well as secondary research. With the help of in-depth insights of the industry-affiliated information that is obtained and legitimated by market-admissible resources, analysts have offered riveting observations and authentic forecasts of the chemical mechanical planarization market.

During the primary research phase, analysts interviewed industry stakeholders, investors, brand managers, vice presidents, and sales and marketing managers. On the basis of data obtained through the interviews of genuine resources, analysts have emphasized the changing scenario of the chemical mechanical planarization market.

For secondary research, analysts scrutinized numerous annual report publications, white papers, industry association publications, and company websites to obtain the necessary understanding of the chemical mechanical planarization market.

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