5G PCB Market

5G PCB Market (PCB Type: Single-sided, Double-sided, Multi-layered, High-density Interconnect [HDI], and Others; Substrate: Rigid, Flexible, and Rigid-flexible) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2022-2031

5G PCB Market Outlook 2031

  • The global industry was valued at US$ 16.9 Bn in 2022
  • It is estimated to advance at a CAGR of 14.4% from 2023 to 2031 to reach US$ 56.8 Bn by the end of 2031

Analysts’ Viewpoint

Commercialization of 5G is anticipated to fuel 5G PCB market growth in the next few years. Expansion in end-use industries such as automotive, telecommunication, consumer electronics, and industrial is driving the 5G PCB market share. Rise in demand for communication systems and connected devices such as smartphones and tablets, and advancements in automotive electronics are some of the key factors augmenting 5G PCB market statistics.

Increase in demand for advanced HDI PCBs and introduction of new substrate materials are prominent 5G PCB market trends. Growth in demand for high-speed and low-latency applications is also driving 5G PCB market dynamics. However, increase in component complexities is likely to hamper market development during the forecast period.

5g Pcb Market

Market Overview

Printed circuit board solutions are used for electrical connections between different components. They are also used for digital and analog signal transmission, power supply, and high-frequency data transmission.

5G systems work at higher frequencies than 4G and 3G technologies. Therefore, electronic equipment must support higher digital data rates and frequencies. The next generation of highly advanced printed circuit boards (PCBs) is used in the deployment of 5G technology across critical infrastructure building blocks such as carrier networks, servers, and base stations.

5G uses mmWave and Sub-6 Band frequencies. This creates new requirements and challenges for printed circuit boards. 5G requires much more advanced component integration, such as antennas. This explains the growth in demand for smaller component sizes to better support integration.

Commercialization of 5G to Fuel Demand for HDI PCBs

Advanced HDI (High-density Interconnect) PCBs with mSAP (modified Semi-Additive Process) technology are becoming increasingly important in the development of 5G technology. These PCBs provide high performance and reliability as well as the ability to handle high frequencies and high-speed data transmission.

mSAP technology allows for finer line and space widths and higher aspect ratios, thus enabling greater density and complexity of the PCB design. This is particularly important for 5G applications, which require more complex and high-speed circuitry.

Advanced HDI PCBs with mSAP technology also have better thermal management, which is important for handling the heat generated by high-speed data transmission. Other benefits of using advanced HDI PCBs with mSAP technology in 5G applications include improved signal integrity, reduced electromagnetic interference (EMI), and better power distribution.

Growth in Adoption of 5G Technology

Demand for 5G PCBs is likely to increase in the near future due to the growth in adoption of 5G technology across the globe. 5G end devices require specialized PCBs to support high-frequency, high-bandwidth, and low-latency requirements. PCBs are essential components of electronic devices.

5G technology operates at much higher frequencies than the previous generations of wireless technologies. Therefore, advanced PCB materials and manufacturing techniques are required to handle higher frequency signals and reduce signal loss.

Rise in Demand for 5G PCB in Antenna Arrays (5G PCB Antenna)

5G antenna array is a key technology used to enable high-speed data transfer and low latency in 5G networks. These antenna arrays use multiple antennas that are arranged in a specific pattern to enable simultaneous communication with multiple devices and increase network capacity.

5G antenna arrays use a technique called beamforming to improve network efficiency and reduce interference. With beamforming, the antenna array can focus its energy in a specific direction to provide stronger and more reliable signals to a specific device or group of devices. This enables more efficient use of the available network resources. It also improves network performance.

5G antenna arrays provide several benefits, including massive MIMO and active antenna systems (AAS), and hybrid beamforming. Massive MIMO (Multiple Input Multiple Output) is a type of 5G antenna array that uses a large number of antennas to enable simultaneous communication with multiple devices. Massive MIMO is used in both base stations and mobile devices to increase network capacity and improve network efficiency.

AAS is another type of 5G antenna array that uses active electronics to adjust the signal in real-time. It is used to improve network efficiency and reduce interference by adjusting the signal to match the specific requirements of each device.

Hybrid beamforming is a technique that combines the advantages of digital beamforming and analog beamforming. Hybrid beamforming is used in 5G networks to improve network efficiency and reduce interference by combining the flexibility of digital beamforming with the efficiency of analog beamforming.

Expansion in Communication Infrastructure

The communications market currently accounts for about one-fifth of the world's production of electronic goods, which includes mobile and fixed devices as well as their infrastructure. Demand for rigid, flexible, and rigid-flexible substrates has been driven by growth in the mobile devices sector.

In the communication sector, PCBs are primarily used in electrical devices for data communication, transmission networks, and wireless networks. Millimeter waves with higher frequencies and broader bandwidths must be used due to the high frequency and speed of the 5G base station. Demand for PCBs has risen significantly as a result of the increase in adoption of 5G base stations and 5G electronic devices.

Regional Outlook of Global 5G PCB Market

According to the latest 5G PCB (printed circuit board) market analysis, Asia Pacific is the largest region of the global 5G PCB sector, led by growth in consumer electronics and automotive industries. However, rapid expansion in data center and cloud businesses in North America is fueling market progress in the region.

China, Korea, Taiwan, and the U.S. are the leading countries of the global 5G PCB market. According to the latest 5G PCB market research analysis, the PCB industry is likely to expand in Asia Pacific during the forecast period, owing to the rise in adoption of futuristic technologies, including 5G, HPC, AIoT, and big data, in the region.

Analysis of Key Players

Prominent entities operating in the global market are updating their manufacturing technologies, materials, and 5G circuit board design patterns to meet the rising global demand. Thus, presence of a strong raw material supply system and corresponding equipment upgrades are likely to create lucrative 5G PCB market opportunities for companies.

Leading players operating in the market are Panasonic Industry Co., Ltd., Xinfeng Huihe Circuits Co., Ltd., Chin Poon Industrial Co., Ltd., Tripod Technology, Shennan Circuits Co., Ltd., WUS Printed Circuit Co., Ltd., Kinsus, Zhen Ding Technology Holding Limited, Hannstar Board Co., Ltd., Compeq Manufacturing Co., Ltd., NIPPON MEKTRON, LTD., Unimicron, TTM Technologies Inc., Sierra Circuits, Inc., Lexington Europe GmbH, and Winonics.

Key Developments in Global 5G PCB Industry

  • In September 2022, Chin-Poon Industrial Co. Ltd. increased its stake in Draco PCB Public Company Limited to 89.4% from 75.6%
  • In April 2020, Shin-Etsu Chemical developed three new product lines for 5G communications: SQX Series, SLK Series, and SAHF Series
  • In April 2020, Hitachi Chemical launched MCL-HS200, a 5G-compatible printed wiring board material. MCL-HS200 is an advanced functional laminate material for printed wiring boards, with low transmission loss and low warpage properties. The material is used in semiconductor packaging substrates in 5G mobile communications systems, ADAS, and AI.

Key players have been profiled in the 5G PCB market report based on parameters such as company overview, business strategies, product portfolio, financial overview, business segments, and recent developments.

Market Snapshot

Attribute

Detail

Market Size Value in 2021

US$ 16.9 Bn

Market Forecast Value in 2031

US$ 56.8 Bn

Growth Rate (CAGR)

14.4%

Forecast Period

2023–2031

Historical Data Available for

2017–2022

Quantitative Units

US$ Bn for Value and Million Units for Volume

Market Analysis

It includes cross segment analysis at global as well as regional level. Furthermore, qualitative analysis includes drivers, restraints, opportunities, key trends, Porter’s Five Forces analysis, value chain analysis, and key trend analysis.

Competition Landscape

  • Market share analysis by company (2021)
  • Company profiles section includes overview, product portfolio, sales footprint, key subsidiaries or distributors, strategy & recent developments, and key financials

Format

Electronic (PDF) + Excel

Market Segmentation

  • PCB Type
    • Single-sided
    • Double-sided
    • Multi-layered
    • High-density Interconnect (HDI)
    • Others
  • Substrate
    • Rigid
    • Flexible
    • Rigid-flexible
  • End-use Industry
    • Automotive
    • Telecommunication
    • Consumer Electronics
    • Industrial
    • Others

Regions Covered

  • North America
  • South America
  • Europe
  • Asia Pacific
  • Middle East & Africa

Countries Covered

  • U.S.
  • Canada
  • The U.K.
  • Germany
  • France
  • China
  • India
  • Japan
  • South Korea
  • ASEAN
  • GCC
  • South Africa
  • Brazil

Companies Profiled

  • Panasonic Industry Co., Ltd.
  • Xinfeng Huihe Circuits Co., Ltd.
  • Chin Poon Industrial Co., Ltd.
  • Tripod Technology
  • Shennan Circuits Co., Ltd.
  • WUS Printed Circuit Co., Ltd.,
  • Kinsus
  • Zhen Ding Technology Holding Limited
  • Hannstar Board Co., Ltd.
  • Compeq Manufacturing Co., Ltd.
  • NIPPON MEKTRON, LTD.
  • Unimicron
  • TTM Technologies Inc.
  • Sierra Circuits, Inc.
  • Lexington Europe GmbH
  • Winonics

Customization Scope

Available upon request

Pricing

Available upon request

Frequently Asked Questions

How big was the global 5G PCB market in 2022?

It was valued at US$ 16.9 Bn in 2022.

How is it expected to grow by 2031?

It is likely to grow at a CAGR of 14.4% by 2031.

How much worth would the industry be in 2031?

It would be worth US$ 56.8 Bn in 2031.

How big was the U.S. in 2022?

The U.S. held approximately 18.0% share in 2022.

What are the prominent trends in the business?

Rise in demand for advanced HDI PCB.

Which region is more lucrative for vendors?

Asia Pacific is a more lucrative region for vendors.

Who are the prominent players in the sector?

Panasonic Industry Co., Ltd., Xinfeng Huihe Circuits Co., Ltd., Chin Poon Industrial Co., Ltd., Tripod Technology, Shennan Circuits Co., Ltd., WUS Printed Circuit Co., Ltd., Kinsus, Zhen Ding Technology Holding Limited, Hannstar Board Co., Ltd., Compeq Manufacturing Co., Ltd., NIPPON MEKTRON, LTD., Unimicron, TTM Technologies Inc., Sierra Circuits, Inc., Lexington Europe GmbH, and Winonics.

1. Preface

    1.1. Market Introduction

    1.2. Market and Segments Definition

    1.3. Market Taxonomy

    1.4. Research Methodology

    1.5. Assumption and Acronyms

2. Executive Summary

    2.1. Global 5G PCB Market Overview

    2.2. Regional Outline

    2.3. Industry Outline

    2.4. Market Dynamics Snapshot

    2.5. Competition Blueprint

3. Market Dynamics

    3.1. Macro-economic Factors

    3.2. Drivers

    3.3. Restraints

    3.4. Opportunities

    3.5. Key Trends

    3.6. Regulatory Framework

4. Associated Industry and Key Indicator Assessment

    4.1. Parent Industry Overview – Global PCB Industry Overview

    4.2. Supply Chain Analysis

    4.3. Pricing Analysis

    4.4. Technology Roadmap

    4.5. Industry SWOT Analysis

    4.6. Porter Five Forces Analysis

    4.7. COVID-19 Impact and Recovery Analysis

5. Global 5G PCB Market Analysis, by PCB Type

    5.1. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        5.1.1. Single-sided

        5.1.2. Double-sided

        5.1.3. Multi-layered

        5.1.4. High-density Interconnect (HDI)

        5.1.5. Others

    5.2. Market Attractiveness Analysis, By PCB Type

6. Global 5G PCB Market Analysis, by Substrate

    6.1. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        6.1.1. Rigid

        6.1.2. Flexible

        6.1.3. Rigid-flexible

    6.2. Market Attractiveness Analysis, By Substrate

7. Global 5G PCB Market Analysis, by End-use Industry

    7.1. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        7.1.1. Automotive

        7.1.2. Telecommunication

        7.1.3. Consumer Electronics

        7.1.4. Industrial

        7.1.5. Others

    7.2. Market Attractiveness Analysis, By End-use Industry

8. Global 5G PCB Market Analysis and Forecast by Region

    8.1. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Region, 2017–2031

        8.1.1. North America

        8.1.2. Europe

        8.1.3. Asia Pacific

        8.1.4. Middle East & Africa

        8.1.5. South America

    8.2. Market Attractiveness Analysis, By Region

9. North America 5G PCB Market Analysis and Forecast

    9.1. Market Snapshot

    9.2. Drivers and Restraints: Impact Analysis

    9.3. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        9.3.1. Single-sided

        9.3.2. Double-sided

        9.3.3. Multi-layered

        9.3.4. High-density Interconnect (HDI)

        9.3.5. Others

    9.4. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        9.4.1. Rigid

        9.4.2. Flexible

        9.4.3. Rigid-flexible

    9.5. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        9.5.1. Automotive

        9.5.2. Telecommunication

        9.5.3. Consumer Electronics

        9.5.4. Industrial

        9.5.5. Others

    9.6. 5G PCB Market Size (US$ Mn) And Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031

        9.6.1. U.S.

        9.6.2. Canada

        9.6.3. Rest of North America

    9.7. Market Attractiveness Analysis

        9.7.1. By PCB Type

        9.7.2. By Substrate

        9.7.3. By End-use Industry

        9.7.4. By Country/Sub-region

10. Europe 5G PCB Market Analysis and Forecast

    10.1. Market Snapshot

    10.2. Drivers and Restraints: Impact Analysis

    10.3. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        10.3.1. Single-sided

        10.3.2. Double-sided

        10.3.3. Multi-layered

        10.3.4. High-density Interconnect (HDI)

        10.3.5. Others

    10.4. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        10.4.1. Rigid

        10.4.2. Flexible

        10.4.3. Rigid-flexible

    10.5. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        10.5.1. Automotive

        10.5.2. Telecommunication

        10.5.3. Consumer Electronics

        10.5.4. Industrial

        10.5.5. Others

    10.6. 5G PCB Market Size (US$ Mn) And Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031

        10.6.1. U.K.

        10.6.2. Germany

        10.6.3. France

        10.6.4. Rest of Europe

    10.7. Market Attractiveness Analysis

        10.7.1. By PCB Type

        10.7.2. By Substrate

        10.7.3. By End-use Industry

        10.7.4. By Country/Sub-region

11. Asia Pacific 5G PCB Market Analysis and Forecast

    11.1. Market Snapshot

    11.2. Drivers and Restraints: Impact Analysis

    11.3. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        11.3.1. Single-sided

        11.3.2. Double-sided

        11.3.3. Multi-layered

        11.3.4. High-density Interconnect (HDI)

        11.3.5. Others

    11.4. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        11.4.1. Rigid

        11.4.2. Flexible

        11.4.3. Rigid-flexible

    11.5. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        11.5.1. Automotive

        11.5.2. Telecommunication

        11.5.3. Consumer Electronics

        11.5.4. Industrial

        11.5.5. Others

    11.6. 5G PCB Market Size (US$ Mn) And Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031

        11.6.1. China

        11.6.2. Japan

        11.6.3. India

        11.6.4. South Korea

        11.6.5. ASEAN

        11.6.6. Rest of Asia Pacific

    11.7. Market Attractiveness Analysis

        11.7.1. By PCB Type

        11.7.2. By Substrate

        11.7.3. By End-use Industry

        11.7.4. By Country/Sub-region

12. Middle East & Africa 5G PCB Market Analysis and Forecast

    12.1. Market Snapshot

    12.2. Drivers and Restraints: Impact Analysis

    12.3. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        12.3.1. Single-sided

        12.3.2. Double-sided

        12.3.3. Multi-layered

        12.3.4. High-density Interconnect (HDI)

        12.3.5. Others

    12.4. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        12.4.1. Rigid

        12.4.2. Flexible

        12.4.3. Rigid-flexible

    12.5. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        12.5.1. Automotive

        12.5.2. Telecommunication

        12.5.3. Consumer Electronics

        12.5.4. Industrial

        12.5.5. Others

    12.6. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031

        12.6.1. GCC

        12.6.2. South Africa

        12.6.3. Rest of Middle East & Africa

    12.7. Market Attractiveness Analysis

        12.7.1. By PCB Type

        12.7.2. By Substrate

        12.7.3. By End-use Industry

        12.7.4. By Country/Sub-region

13. South America 5G PCB Market Analysis and Forecast

    13.1. Market Snapshot

    13.2. Drivers and Restraints: Impact Analysis

    13.3. 5G PCB Market Size (US$ Mn) and Volume (Million Units) Analysis & Forecast, By PCB Type, 2017–2031

        13.3.1. Single-sided

        13.3.2. Double-sided

        13.3.3. Multi-layered

        13.3.4. High-density Interconnect (HDI)

        13.3.5. Others

    13.4. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By Substrate, 2017–2031

        13.4.1. Rigid

        13.4.2. Flexible

        13.4.3. Rigid-flexible

    13.5. 5G PCB Market Size (US$ Mn) Analysis & Forecast, By End-use Industry, 2017–2031

        13.5.1. Automotive

        13.5.2. Telecommunication

        13.5.3. Consumer Electronics

        13.5.4. Industrial

        13.5.5. Others

    13.6. 5G PCB Market Size (US$ Mn) And Volume (Million Units) Analysis & Forecast, By Country and Sub-region, 2017–2031

        13.6.1. Brazil

        13.6.2. Rest of South America

    13.7. Market Attractiveness Analysis

        13.7.1. By PCB Type

        13.7.2. By Substrate

        13.7.3. By End-use Industry

        13.7.4. By Country/Sub-region

14. Competition Assessment

    14.1. Global 5G PCB Market Competition Matrix - a Dashboard View

        14.1.1. Global 5G PCB Market Company Share Analysis, by Value (2021)

        14.1.2. Technological Differentiator

15. Company Profiles (Global Manufacturers/Suppliers)

    15.1. Chin Poon Industrial Co., Ltd.

        15.1.1. Overview

        15.1.2. Product Portfolio

        15.1.3. Sales Footprint

        15.1.4. Key Subsidiaries or Distributors

        15.1.5. Strategy and Recent Developments

        15.1.6. Key Financials

    15.2. Compeq Manufacturing Co., Ltd.

        15.2.1. Overview

        15.2.2. Product Portfolio

        15.2.3. Sales Footprint

        15.2.4. Key Subsidiaries or Distributors

        15.2.5. Strategy and Recent Developments

        15.2.6. Key Financials

    15.3. Hannstar Board Co., Ltd.

        15.3.1. Overview

        15.3.2. Product Portfolio

        15.3.3. Sales Footprint

        15.3.4. Key Subsidiaries or Distributors

        15.3.5. Strategy and Recent Developments

        15.3.6. Key Financials

    15.4. Kinsus

        15.4.1. Overview

        15.4.2. Product Portfolio

        15.4.3. Sales Footprint

        15.4.4. Key Subsidiaries or Distributors

        15.4.5. Strategy and Recent Developments

        15.4.6. Key Financials

    15.5. Lexington Europe GmbH

        15.5.1. Overview

        15.5.2. Product Portfolio

        15.5.3. Sales Footprint

        15.5.4. Key Subsidiaries or Distributors

        15.5.5. Strategy and Recent Developments

        15.5.6. Key Financials

    15.6. NIPPON MEKTRON, LTD.

        15.6.1. Overview

        15.6.2. Product Portfolio

        15.6.3. Sales Footprint

        15.6.4. Key Subsidiaries or Distributors

        15.6.5. Strategy and Recent Developments

        15.6.6. Key Financials

    15.7. Panasonic Industry Co., Ltd.

        15.7.1. Overview

        15.7.2. Product Portfolio

        15.7.3. Sales Footprint

        15.7.4. Key Subsidiaries or Distributors

        15.7.5. Strategy and Recent Developments

        15.7.6. Key Financials

    15.8. Shennan Circuits Co., Ltd.

        15.8.1. Overview

        15.8.2. Product Portfolio

        15.8.3. Sales Footprint

        15.8.4. Key Subsidiaries or Distributors

        15.8.5. Strategy and Recent Developments

        15.8.6. Key Financials

    15.9. Sierra Circuits, Inc.

        15.9.1. Overview

        15.9.2. Product Portfolio

        15.9.3. Sales Footprint

        15.9.4. Key Subsidiaries or Distributors

        15.9.5. Strategy and Recent Developments

        15.9.6. Key Financials

    15.10. Tripod Technology

        15.10.1. Overview

        15.10.2. Product Portfolio

        15.10.3. Sales Footprint

        15.10.4. Key Subsidiaries or Distributors

        15.10.5. Strategy and Recent Developments

        15.10.6. Key Financials

    15.11. TTM Technologies Inc.

        15.11.1. Overview

        15.11.2. Product Portfolio

        15.11.3. Sales Footprint

        15.11.4. Key Subsidiaries or Distributors

        15.11.5. Strategy and Recent Developments

        15.11.6. Key Financials

    15.12. Unimicron

        15.12.1. Overview

        15.12.2. Product Portfolio

        15.12.3. Sales Footprint

        15.12.4. Key Subsidiaries or Distributors

        15.12.5. Strategy and Recent Developments

        15.12.6. Key Financials

    15.13. Winonics

        15.13.1. Overview

        15.13.2. Product Portfolio

        15.13.3. Sales Footprint

        15.13.4. Key Subsidiaries or Distributors

        15.13.5. Strategy and Recent Developments

        15.13.6. Key Financials

    15.14. WUS Printed Circuit Co., Ltd.,

        15.14.1. Overview

        15.14.2. Product Portfolio

        15.14.3. Sales Footprint

        15.14.4. Key Subsidiaries or Distributors

        15.14.5. Strategy and Recent Developments

        15.14.6. Key Financials

    15.15. Xinfeng Huihe Circuits Co., Ltd.

        15.15.1. Overview

        15.15.2. Product Portfolio

        15.15.3. Sales Footprint

        15.15.4. Key Subsidiaries or Distributors

        15.15.5. Strategy and Recent Developments

        15.15.6. Key Financials

    15.16. Zhen Ding Technology Holding Limited

        15.16.1. Overview

        15.16.2. Product Portfolio

        15.16.3. Sales Footprint

        15.16.4. Key Subsidiaries or Distributors

        15.16.5. Strategy and Recent Developments

        15.16.6. Key Financials

16. Recommendation

    16.1. Opportunity Assessment

        16.1.1. By PCB Type

        16.1.2. By Substrate

        16.1.3. By End-use Industry

        16.1.4. By Region/Country/Sub-region

List of Tables

Table 1: Global 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 2: Global 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 3: Global 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 4: Global 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 5: Global 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 6: Global 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

Table 7: North America 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 8: North America 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 9: North America 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 10: North America 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 11: North America 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 12: North America 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

Table 13: Europe 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 14: Europe 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 15: Europe 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 16: Europe 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 17: Europe 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 18: Europe 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

Table 19: Asia Pacific 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 20: Asia Pacific 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 21: Asia Pacific 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 22: Asia Pacific 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 23: Asia Pacific 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 24: Asia Pacific 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

Table 25: Middle East & Africa 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 26: Middle East & Africa 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 27: Middle East & Africa 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 28: Middle East & Africa 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 29: Middle East & Africa 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 30: Middle East & Africa 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

Table 31: South America 5G PCB Market Value (US$ Mn) & Forecast, by PCB Type, 2017‒2031

Table 32: South America 5G PCB Market Volume (Million Units) & Forecast, by PCB Type, 2017‒2031

Table 33: South America 5G PCB Market Value (US$ Mn) & Forecast, by Substrate, 2017‒2031

Table 34: South America 5G PCB Market Value (US$ Mn) & Forecast, by End-use Industry, 2017‒2033

Table 35: South America 5G PCB Market Value (US$ Mn) & Forecast, by Region, 2017‒2031

Table 36: South America 5G PCB Market Volume (Million Units) & Forecast, by Region, 2017‒2031

List of Figures

Figure 01: Supply Chain Analysis - Global 5G PCB

Figure 02: Global 5G PCB Price Trend Analysis (Average Price, US$)

Figure 03: Porter Five Forces Analysis - Global 5G PCB

Figure 04: Technology Road Map - Global 5G PCB

Figure 05: Global 5G PCB Market Size & Forecast, and Value (US$ Mn), 2017‒2031

Figure 06: Global 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 07: Global 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 08: Global 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 09: Global 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 10: Global 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 11: Global 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 12: Global 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 13: Global 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 14: Global 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 15: Global 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 16: Global 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 17: Global 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 18: Global 5G PCB Market Projections by Region, and Value (US$ Mn), 2017‒2031

Figure 19: Global 5G PCB Market Share Analysis, by Region 2021 and 2031

Figure 20: Global 5G PCB Market, Incremental Opportunity, by Region, 2021‒2031

Figure 21: North America 5G PCB Market Size & Forecast, and Value (US$ Mn), 2017‒2031

Figure 22: North America 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 23: North America 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 24: North America 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 25: North America 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 26: North America 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 27: North America 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 28: North America 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 29: North America 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 30: North America 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 31: North America 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 32: North America 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 33: North America 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 34: North America 5G PCB Market Projections by Country and Value (US$ Mn), 2017‒2031

Figure 35: North America 5G PCB Market Share Analysis, by Country, 2021 and 2031

Figure 36: North America 5G PCB Market, Incremental Opportunity, by Country, 2021‒2031

Figure 37: Europe 5G PCB Market Size & Forecast, and Value (US$ Mn), 2017‒2031

Figure 38: Europe 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 39: Europe 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 40: Europe 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 41: Europe 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 42: Europe 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 43: Europe 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 44: Europe 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 45: Europe 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 46: Europe 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 47: Europe 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 48: Europe 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 49: Europe 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 50: Europe 5G PCB Market Projections by Country and Value (US$ Mn), 2017‒2031

Figure 51: Europe 5G PCB Market Share Analysis, by Country, 2021 and 2031

Figure 52: Europe 5G PCB Market, Incremental Opportunity, by Country, 2021‒2031

Figure 53: Asia Pacific 5G PCB Market Size & Forecast, and Value (US$ Mn), 2017‒2031

Figure 54: Asia Pacific 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 55: Asia Pacific 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 56: Asia Pacific 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 57: Asia Pacific 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 58: Asia Pacific 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 59: Asia Pacific 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 60: Asia Pacific 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 61: Asia Pacific 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 62: Asia Pacific 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 63: Asia Pacific 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 64: Asia Pacific 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 65: Asia Pacific 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 66: Asia Pacific 5G PCB Market Projections by Country and Value (US$ Mn), 2017‒2031

Figure 67: Asia Pacific 5G PCB Market Share Analysis, by Country, 2021 and 2031

Figure 68: Asia Pacific 5G PCB Market, Incremental Opportunity, by Country, 2021‒2031

Figure 69: Middle East & Africa 5G PCB Market Size & Forecast, and Value (US$ Mn), 2017‒2031

Figure 70: Middle East & Africa 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 71: Middle East & Africa 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 72: Middle East & Africa 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 73: Middle East & Africa 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 74: Middle East & Africa 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 75: Middle East & Africa 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 76: Middle East & Africa 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 77: Middle East & Africa 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 78: Middle East & Africa 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 79: Middle East & Africa 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 80: Middle East & Africa 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 81: Middle East & Africa 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 82: Middle East & Africa 5G PCB Market Projections by Country and Value (US$ Mn), 2017‒2031

Figure 83: Middle East & Africa 5G PCB Market Share Analysis, by Country, 2021 and 2031

Figure 84: Middle East & Africa 5G PCB Market, Incremental Opportunity, by Country, 2021‒2031

Figure 85: South America 5G PCB Market Size & Forecast, Y-o-Y, and Value (US$ Mn), 2017‒2031

Figure 86: South America 5G PCB Market Size & Forecast, Volume (Million Units), 2017‒2031

Figure 87: South America 5G PCB Market Size & Forecast, Y-o-Y, and Volume (Million Units), 2017‒2031

Figure 88: South America 5G PCB Market Projections by PCB Type, and Value (US$ Mn), 2017‒2031

Figure 89: South America 5G PCB Market Share Analysis, by PCB Type, 2021 and 2031

Figure 90: South America 5G PCB Market, Incremental Opportunity, by PCB Type, 2021‒2031

Figure 91: South America 5G PCB Market Projections by Substrate, and Value (US$ Mn), 2017‒2031

Figure 92: South America 5G PCB Market Share Analysis, by Substrate, 2021 and 2031

Figure 93: South America 5G PCB Market, Incremental Opportunity, by Substrate, 2021‒2031

Figure 94: South America 5G PCB Market Projections by End-use Industry, and Value (US$ Mn), 2017‒2031

Figure 95: South America 5G PCB Market Share Analysis, by End-use Industry, 2021 and 2031

Figure 96: South America 5G PCB Market, Incremental Opportunity, by End-use Industry, 2021‒2031

Figure 97: South America 5G PCB Market Projections by Country and Value (US$ Mn), 2017‒2031

Figure 98: South America 5G PCB Market Share Analysis, by Country, 2021 and 2031

Figure 99: South America 5G PCB Market, Incremental Opportunity, by Country, 2021‒2031

Figure 100: Company Share Analysis 2021

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