Consumer electronics market requires higher performing, lower cost device setups for various applications, thus resulting in the reduction of chip thickness from the traditional 500ì thickness to about 40 ìm. Main applications which essentially require temporary bonding are Advanced Packaging applications (TSV, interposers and Fan out WLP), Power Devices (IG BTs), and RF Devices & LED s. To avoid difficulties during the production of such chips various techniques and developments are being introduced in the traditional process, thus temporary bonding technology is expected to witness the growth of more than 500% during the period of 2012-2018.
This research report analyzes the Thin Wafer market depending on various segments and major geographies. This detailed study includes trend analysis, market numbers, industry growth drivers and restraints along with the future market projections. This market research report includes analysis of current developments, Porter’s five force analysis and detailed profiles of top industry players. Report also discusses the importance of macro and minor factors important for existing market players and new entrants.
The Thin Wafer market is generally segmented as follows:
- Wafer Thinning
- Dry Polishing
- Thin Wafer Handling: the different solutions
- Wafer Dicing
- CMOS Image Sensors
- Memory & Logic
- Power Devices
- RF Devices (GaAs)
- Advanced Packaging: 3D TSV/Interposers
These segments will provide you with market tables, drivers, restraints and opportunities along with the information of key players and competitive landscape.
The major geographies analyzed under this research study are North America, Asia-Pacific, Europe and Rest of the World.
The major players in Thin Wafer industry are 3M, ABB, Accretech, AIT , All Via among the others.