Global Wafer Grinder Market – Introduction

The semiconductors industry over the years has attained significance in global economic and societal growth. Enhancing performance and reducing the price of semiconductors are the most influencing factors contributing to its exponential growth worldwide. Manufacturers have been facing immense pressure due to such demand growth to increase production capacity coupled with continuous advancement in semiconductor technology. The trend has subsequently resulted in reducing the size and complicating the design of semiconductors.

These factors have therefore increased the demand for wafer grinding machines that are in line with changing semiconductor designs. Wafer grinding is a sub-process of semiconductor device fabrication that reduces the wafer thickness to enable stacking and high-density packaging of ICs. The market is expected to grow at a moderate rate during the forecast period.

Wafer Grinder Market – Competitive Landscape

Koyo Machinery Industries Co. Ltd.

Koyo Machinery is a Japan-based manufacturer and distributor of machine tools that includes multi-head, center less surface, and special purpose grinding machines. For the semiconductor industry, the company has designed numerous grinding machines used for manufacturing of silicon wafer and IC (integrated chips). The company was established in 1961 and operates as a fully owned subsidiary of JTEKT Corporation. The company has approximately 3761 employees (as per its website), and recorded capital of 1100 million Yen.

DISCO Corporation

DISCO Corporation is among the leading OEMs catering to the wafer grinder market. The company’s business operations are segmented into precision processing tools, precision machines, and other products. The precision machines business division of the company is critical to the wafer grinding market as it provides grinding tools for semiconductor manufacturing. GF01 series, IF series, poligrind, and ultra polygrind are the products specified for wafer grinding application. The company as of March 31, 2019, recorded 3,619 employees and revenue of JPY 147.5 billion.

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Revasum, Inc.

Revasum Inc. engages in designing, developing, and manufacturing semiconductor processing equipment. The company’s product portfolio includes polishing, grinding, and chemical mechanical planarization equipment for manufacturing of sensors, LEDs, microchips, and power devices. The company is headquartered in California and was founded in 2016.

Tokyo Seimitsu Co. Ltd. (ACCRETECH)

Tokyo Seimitsu Co., Ltd., manufactures and markets metrology instruments and Semiconductor Production Equipment (SPE). The semiconductor manufacturing equipment business segment of the company provides dicing machines, probing machines, polish grinders, wafer grinding machines, wafer slicing machines, and Chemical Mechanical Planarizers (CMPs). Wafer grinding machines, and wafer slicing machines offered by the company are designed and manufactured by Tosei Engineering Corporation. As of March 2019, the company had 2,119 (consolidated) employees.

Other key players operating in the global wafer grinder market include G&N Genauigkeits Maschinenbau Nürnberg GmbH, Dikema Precision Machinery, Komatsu NTC, Hunan Yujing Machine Industrial, and Arnold Gruppe.

Wafer Grinder Market – Dynamics

Rising investments directed toward improving conventional wafer grinders

Gradually obsoleting conventional wafer grinders are encouraging IC/semiconductor manufacturers to opt for machines that would allow them to consolidate multiple wafer thinning processes (slicing, probing, grinding, and polishing) at a single point. The trend is expected to significantly hold back the installation and maintenance cost. Currently, such solutions are less prevalent in the market; however, in the coming years, they are expected to be the next generation of wafer grinders, subsequently attracting substantial capital from vendors.

Dynamic advancements in consumer electronics expected to drive the demand for wafer grinders globally

The consumer electronics industry owing to the emergence of novel technologies has seen various advancements. These technological advancements in consumer electronic products including smartphones, intelligent home appliances, and other gadgets have substantially driven the demand for miniaturized integrated circuits, which in response has been driving the wafer grinders market, and is expected to continue driving the market during the forecast period.

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Wafer Grinder Market – Segmentation

The global wafer grinder market can be segmented based on:

  • Grinder Type
  • Configuration
  • Application
  • Region

Wafer Grinder Market Segmentation – by Grinder Type

Based on grinder type, the wafer grinder market can be classified into:

  • Edge Grinder
  • Surface Grinder

Wafer Grinder Market Segmentation – by Configuration

In terms of configuration, the wafer grinder market can be segmented into:

  • Single Side Grinder
  • Double Side Grinder

Wafer Grinder Market Segmentation – By Application

Based on application, the wafer grinder market can be classified into:

  • Silicon Wafer
  • Compound Semiconductor Wafer

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