Thermal conductive grease is a compound that is typically electrically insulating and thermally conducting, i.e. the heat transfer can occur through such compounds. These are most commonly employed as an interface material between the source of heat and heat sinks. Thermal conductive grease is known by several alternative names such as heat paste, thermal compound, thermal interface material (TIM), heat sink compound, thermal paste, or thermal gel. The basic function of thermal conductive grease is to remove air spaces or gaps from the interface area, which play the role of thermal insulators, and facilitate maximize heat transfer.

Thermal conductive greases do not provide mechanical strength to the bonding between heat sink and source of heat, unlike thermal adhesives. External mechanical mechanisms that creates the pressure between the two are required in order to spread the thermal conductive grease onto the heat source. Thermal conductive grease comprise a polymerizable liquid matrix and thermally conductive filler. Thermally conductive fillers also are typically electrically insulating. Most commonly used matrix materials include silicone, acrylates, epoxies, urethanes, solvent-based systems, and hot-melt adhesives, while aluminum oxide, aluminum nitride, zinc oxide, and boron nitride are commonly used fillers. Among these fillers, usage of aluminum nitride is increasing.

Electronic surfaces are never smooth. Microscopic blemishes are present on any surface, which reduce the heat flow and increase contact resistance. These gaps or roughness of the surface inhibit effective heat transfer, which can potentially lead to device failure. TIMs that have low flowing properties can leave voids, which inhibit heat transfer. Thermal conductive grease, however, completely fills the micro-gaps (due to matrix composition). This ensures the vital parts of a component are protected from the flow of heat.

Key attributes that ensure good performance of thermally conductive grease are its thermal conductivity and resistance, bond line thickness, processing ability, and re-workability. Thermally conductive grease is applied in a wide array of industrial applications including power components and supplies, broadcasting equipment, ignition modules, computer equipments, audio amplifiers, power resistors, semi-conductor mounting devices, transistor diodes, thermal joints, and ballast heat transfer mediums.

Thermally conductive grease is available in varying grades or compositions as different product lines, depending on the end application and conductivity of the grease. The different compositions and features of thermally conductive greases is due to its utilization in applications ranging from the simplest to the most demanding thermal requirements.

Based on type, the market for thermally conductive greases can be divided into silicone-based grease and non-silicone-based grease. Based on end-user industry, the market can be classified into automotive, electricals & electronics, energy & power, telecommunications & IT, and others (including medical & office equipments).

In terms of geography, the thermal conductive grease market can be segmented into Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. On the global level, in terms of both value as well as volume, in 2016, Asia Pacific led the thermal conductive grease market. Demand for thermal conductive grease from different end-use industries primarily in China, India, Japan, and South Korea is a major factor driving the thermal conductive grease market in Asia Pacific. The automotive industry is a major application segment of the market in the region, which is expanding at a rapid pace. This, in turn, is boosting the demand for thermal conductive grease. Moreover, the region is a major hub for the production of electricals and electronics, which also fuels the demand for thermal conductive grease in the region.

Key players operating in the thermal conductive grease market include 3M, Dow Corning Corporation, Parker Hannifin Corp, Laird Technologies, ACC Silicones Ltd (A CHT Group company), LORD Corporation, Wacker Chemie AG, and PolySi Technologies Inc.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market   

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis. 

.