According to a recent market research report published by Transparency Market Research, the global failure analysis equipment market is estimated to expand at a CAGR of 4.5% during the period between 2014 and 2020. The report, titled “Failure Analysis Equipment Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2014 - 2020,” projects the global failure analysis equipment market to register positive growth owing to the growing demand for quality assurance across the semiconductor industry. The overall market was worth US$1.28 bn in 2013.
Browse the full Failure Analysis Equipment Market in Semiconductor Industry - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2014 - 2020 report at https://www.transparencymarketresearch.com/failure-analysis-equipment-in-semiconductor-industry.html
Failure analysis in the semiconductor industry refers to an engineering approach to determine why and how a semiconductor component is not functioning in a desired way. Usually, failures are caused owing to improper maintenance, manufacturing defects, design errors, assembly errors, inadequate quality assurance, improper heat treatments, and inadequate environmental protection.
The report points out that the robust growth in the semiconductor industry and increased investments in research and education infrastructure are expected to boost the growth of the global failure analysis equipment market. However, low adoption rate due to high cost of equipment will restrain the market during the forecast period. The overall market has a huge opportunity to grow with the growing innovative failure analysis techniques such as SDR, SQUID, XIVA, EMMI, and OBIRCH.
On the basis of equipment, the report categorizes the global failure analysis equipment market in the semiconductor industry into transmission electron microscope, (TEM), scanning electron microscope (SEM), dual beam (FIB/ SEM) systems, and focused ion beam (FIB) systems. In 2013, the focused ion beam (FIB) systems contributed significantly towards the market revenue owing to the diverse usage of these systems. During the forecast period, the dual beam systems segment is expected to register the fastest growth, expanding at a CAGR of 5.8%.
According to customers, the report segments the global failure analysis equipment market in the semiconductor industry into fabless FA labs, fab FA labs, specialty labs, and others. Fab FA labs provide world-class analysis with the assistance of multi-disciplinary and skilled analysis teams.
The report studies the failure analysis equipment market in the semiconductor industry across four key regions: Europe, North America, Asia Pacific, and Rest of the World. In 2013, Asia Pacific accounted for over 50% of the market and was the biggest revenue generator. The rapid growth of this regional market can be attributed to the development of semiconductor technologies in countries such as China.
The report describes the competitive landscape of the global failure analysis equipment market in the semiconductor industry and profiles some of the key players in the market such as Hitachi High-Technologies Corporation, FEI, Carl Zeiss SMT GmbH, and JEOL Ltd. The report further provides insightful information about the key players including their product portfolio, business strategy, financial overview, and recent developments. Through SWOT analysis, the report analyzes the growth opportunities for the market players during the forecast horizon.
Global failure analysis equipment market in the semiconductor industry has been segmented as:
Failure analysis equipment market in semiconductor industry: By geography
- North America
- Asia Pacific
Failure analysis equipment market in semiconductor industry: By equipment
- Scanning electron microscope (SEM)
- Transmission electron microscope (TEM)
- Focused Ion Beam system (FIB)
- Dual Beam (FIB/SEM) systems
Failure analysis equipment market in semiconductor industry: By technology
- Transmission electron microscopy
- Scanning electron microscopy
- Scanning Transmission electron microscopy (STEM)
- X-ray imaging
- Laser voltage imaging (LVI)
- Focused ion beam (FIB)
- Broad ion milling (BIM)
- Secondary ion mass spectroscopy (SIMS)
- Energy dispersive X-ray spectroscopy (EDX)
- Reactive ion etching (RIE)
- Chemical mechanical planarization (CMP)
Failure analysis equipment market in semiconductor industry: By application
- Defect localization
- Defect characterization
Failure analysis equipment market in semiconductor industry: By customers
- Fab FA labs
- Fabless FA labs
- Specialty labs
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