Published: Aug, 2018
According to a report by Transparency Market Research (TMR), the global 3D ICs market has highly fragmented and competitive in nature due to the presence of numerous players operating in the global market. Some of the key players in the market are Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Intel Corporation, Micron Technology Inc. (Elpida Memory Inc.), Micron Technology Inc., STATS ChipPAC Ltd., TEZZARON Semiconductor, Samsung Electronics Co. Ltd., United Microelectronics Corporation (UMC), and MonolithIC 3D IC Inc. Knowing the potential opportunities for revenue generation by mass production. Among these, the companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc. Ltd., and Samsung Electronics Co. are having a dominant position in the global market for 3D ICs.
According to a report by Transparency Market Research (TMR), the global 3D ICs market for is expected to expand with a remarkable 18.1% CAGR from 2013 to 2019, reaching a valuation of US$7.52 bn by 2019 from USD 2,408.2 mn in 2012. The information and communication technology segment accounted for the share of 24.2% in overall revenue generated in 2012. Rapidly emerging ICT and consumer electronics in the Asia Pacific are leading to account for the larger share in the overall growth of the market during the forecast period.
Emerging Semiconductor and Microelectronics Industry to Enhance Growth
3D ICs chips are supposed to be the future of electronics as they consume less power by 30 to 40% compared to 2D ICs chips. The demand for 3D ICs chips is expected to increase owing to growing demand for efficient solutions and increased number of portable devices. The emerging semiconductor and microelectronics industry is demanding for the vertically stacked integrated circuits (ICs) as it is a solution to improve performance and functionality also with the reduction of power required to operate electronic devices. Electronic devices with low cost, reliable formation, and low electricity requirement are coupled with smart and advancement is increasing which is a key factor in fuelling the growth of the global 3D ICs market.
Along with the emerging electronic and semiconductor industry, the demand for these ICs is growing from other sectors such as medical and military & aerospace for integrating disparate technologies which include memory, logic, sensor, and RF in all forms of the industrial applications. Expanding its usage from numerous industries is propelling the growth of the global 3D ICs market.
High Manufacturing Costs to Restrain Growth
High manufacturing costs of the 3D ICs is a key factor restraining the growth of the global 3D ICs market. Additionally, some issues in testing and thermal expansion couple with lack of foundries and assembly houses to support this technology is expected to hamper the growth of the global 3D ICs market over the forecast period. Growing usage of the multi-chip packing is expected boost adoption of these ICs in the near future which is again creating growth opportunities for the players operating in the global 3D ICs market.
This information is comprised in the new report by TMR, titled “3D ICs Market ((End-Use Sectors - Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others(Biomedical applications and R&D)); (Substrate Type - Silicon on insulator (SOI), Bulk Silicon); (Fabrication Process - Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization); (Product - MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), and HB LED)) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024.”
Global 3D ICs market has been segmented as:
By End-Use Sectors:
- Consumer electronics
- Information and communication technology
- Transport (automotive and aerospace)
- Others(Biomedical applications and R&D)
By Substrate Type:
- Silicon on insulator (SOI)
- Bulk Silicon
By Fabrication Process:
- Beam re-crystallization
- Wafer bonding
- Silicon epitaxial growth
- Solid phase crystallization
- MEMS and Sensor
- RF SiP
- Optoelectronics and imaging
- Memories (3D Stacks)
- Logic (3D Sip/Soc)
- HB LED
- North America
- Rest of Europe
- Asia Pacific
- Rest of Asia Pacific
- Latin America
- Rest of Latin America
- Middle East & Africa
- South Africa
- Saudi Arabia
- Rest of Middle East & Africa
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