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An interposer is basically an electrical interface whose purpose is to reroute a connection to a different connection. Fan-out WLP (FOWLP) refers to a technology which is an advanced version of the standard wafer level packages and is developed to meet the demand for higher level integration and greater number of external contacts by electrical devices. It facilitates increased speed, better electrical and thermal performance, and increased number of interconnections. Additionally, the FOWLP technology also makes way for cost-effective electronics products.

FOWLP provides electrical connections to semiconductor IC chips allowing reliable routing of circuit traces for connection outside the die. The number of connections required exceeds the area on the chip for area array formation and hence, a mold material is used to provide a larger area around the chip for additional redistribution layer routing in FOWLP. FOWLP consists of a single flipped chip encompassed by a mold material to provide a greater area for routing. Vertical integration of various devices and packages is possible with the help of FOWLP. Consumer electronics, predominantly mobiles, require chips which provide maximum performance and better power efficiency along with smaller physical size. FOWLP makes way for thinner and cost-effective packages, and it allows to vertically stack the dies without the need to redesign the chips.

The growing trend of miniaturization of electronic devices such as mobile phones, tablets, and gaming devices is said to be a major factor driving the interposer and fan-out WLP market. Furthermore, the usage of advanced wafer level packaging technologies in MEMEs and sensors in witnessing an upward trend. Moreover, the rise in usage of wearable and connected devices, which require compact structure of FOWLP, is anticipated to rise in the near future. Moreover, innovations in data storage devices such as flash drives and hybrid memory cubes are increasing the appetite for interposer and fan-out WLP to develop high-performing compact memory solutions. All the factors mentioned above are anticipated to fuel the interposer and fan-out WLP market. However, the utilization of FOWLP in electronic products requires redesigning of the electrical chips and also leads to complex testing procedures. This, in turn, is making the use of the technology expensive. This is expected to affect the market negatively. Nevertheless, expansion of the consumer electronics industry and the demand for complex architectures in smartphones for better performance at optimum cost are projected to fuel the interposer and fan-out WLP market.

The Interposer and fan-out WLP market cookware market has been segmented based on packaging technology, application, end-user industry, and geography. Based on packaging technology, the interposer and fan-out WLP market is segregated into through-silicon vias (TSVs), interposers, and fan-out wafer-level packaging (FOWLP). In terms of application, the market is segmented into logic, imaging & optoelectronics, memory, mems/sensors, LED, power, analog & mixed signal, RF, and photonics. Based on end-user industry, the market is segregated into consumer electronics telecommunication, industrial sector, automotive, military and aerospace, smart technologies, and medical devices. In terms of geography, the interposer and fan-out WLP market cookware market has been segmented into North America, Asia Pacific, Europe, Middle East & Africa, and South America.

Major players operating in the interposer and fan-out WLP market include Intel Corporation., Taiwan Semiconductor Manufacturing Company Limited, Broadcom Ltd., United Microelectronics Corp., Samsung Electronics Co., Ltd., Toshiba Corp., ASE Group, Qualcomm Incorporated, Infineon Technologies AG, and Texas Instruments.

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Interposer Fan Out Wlp Market

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