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Published Date: 2014-10-07Number of Pages: 105

Failure Analysis Equipment Market in Semiconductor Industry - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2014 - 2020

Global failure analysis equipment market in the semiconductor industry was valued at USD 1.28 billion in 2013, growing at a CAGR of 4.5% from 2014 to 2020. Failure analysis is an engineering approach to determine how and why equipment or a component is not functioning in a desired manner. Generally, failures are caused due to manufacturing defects, misuse or abuse, improper maintenance, assembly errors, design errors, improper material, fastener failure, unforeseen operating conditions, inadequate quality assurance, improper heat treatments, inadequate environmental protection\control, and casting discontinuities.

Rising investments in research and education infrastructure across the globe coupled with robust growth in the semiconductor industry are propelling the global failure analysis equipment market in the semiconductor industry. However, high cost of failure analysis equipment leads to their low adoption rate, especially in cost sensitive countries of the Asia Pacific region. This hinders the growth of the failure analysis equipment market to an extent. In 2013, Asia Pacific was the largest revenue generator that accounted for over half of the global market share. The dominance by Asia Pacific is due to immense growth in semiconductor technologies in Asia Pacific countries coupled with increased investments in education and research infrastructure. Furthermore, rising demands for consumer electronics such as smart phones, tablets etc. are further expected to boost the growth of failure analysis equipment. The key industry participants of this market include FEI, Hitachi High-Technologies Corporation, Carl Zeiss SMT GmbH, and JEOL, Ltd.

Transmission electron microscope (TEM), and focused ion beam system (FIB) equipment accounted for over half of the global market revenue share in the year 2013, owing to extensive usage of these equipment. However, dual beam systems (FIB/SEM) are expected to grow at the fastest pace in the coming years owing to their several advantages over a single-beam FIB system. The segment is expected to grow at a CAGR of 5.8% over the forecast period.

Scanning Electron Microscopy is one of the most widely used technologies as it can provide extremely detailed images. The technique is majorly used in failure analysis, process characterization, dimensional analysis, particle identification and reverse engineering. The technology led the market in 2013 by accounting for over 20% of the global market revenue share and is expected to continue its dominance over the forecast period. 

Reduction in particle sizes due to rapid advancements in semiconductor technology has driven the need for defect localization in failure analysis. Thus, for the purpose of defect localization, technologies such as emission microscopy and laser-based techniques such as OBIRCH, TIVA and LIVA are being used increasingly. Thus, the market for defect localization is expected to grow at a significant growth rate over the forecast period. 

Fab failure analysis (FA) labs offer world-class analysis with the help of experienced and multi-disciplinary analysis teams, which use advanced toolsets/equipment. These labs generally provide a large number of failure analysis solutions and manufacture a number of products/components using multiple failure analysis equipment. Thus, the segment is also expected to continue with its dominance over the forecast period. 

global-failure-analysis-equipment-market


Failure analysis is an engineering approach to determine how and why equipment or a component is not functioning in a desired manner. The goal here is to understand the root cause of the failure so as to prevent similar incidences in the future. Generally, failures are caused due to manufacturing defects, misuse or abuse, improper maintenance, assembly errors, design errors, improper material, fastener failure, unforeseen operating conditions, inadequate quality assurance, improper heat treatments, inadequate environmental protection\\control, and casting discontinuities.

This market research study analyzes the failure analysis equipment market in the semiconductor industry on a global level, and provides estimates in terms of revenue (USD billion) from 2014 to 2020. The study identifies the drivers and restraints affecting the industry and analyzes their impact over the forecast period. Moreover, it highlights the significant opportunities for market growth in the coming years.

The report segments the market on the basis of geography into North America, Europe, Asia Pacific (APAC), and Rest of the World (RoW), estimated in terms of revenue (USD billion). In addition, the report segments the market based on equipment which includes Scanning Electron Microscope (SEM), Transmission Electron Microscope (TEM), Focused Ion Beam (FIB) Systems, and Dual Beam (FIB/SEM) Systems. The report has also segmented the market based on technology which include Focused Ion Beam (FIB), Transmission Electron Microscopy, Broad Ion Milling (BIM), Scanning Electron Microscopy, Scanning Transmission Electron Microscopy (STEM), Secondary Ion Mass Spectroscopy (SIMS), X-ray imaging, Energy Dispersive X-ray Spectroscopy (EDX), Nanoprobing, Laser Voltage Imaging (LVI), Reactive Ion Etching (RIE) and Chemical Mechanical Planarization (CMP).

Additionally, the report segments the market based on applications into defect localization, defect characterization and other applications. On the basis of customers, the market has been segmented into fab FA labs, fabless FA labs, specialty labs and other types of labs/customers. All these segments have been estimated on the basis of geography in terms of revenue (USD billion).

A detailed analysis of the value chain offers a better understanding of the failure analysis equipment market in the semiconductor industry. Porter’s five forces analysis throws light on the intensity of competition present in the market. Furthermore, the study comprises a market attractiveness analysis, where the equipment are benchmarked based on their market scope, growth rate and general attractiveness.

The report provides company market share analysis of the various industry participants. Major players have also been profiled on key points such as company overview, financial overview, product portfolio, business strategies, SWOT analysis, and recent developments in the field of failure analysis equipment in the semiconductor industry. Major market participants profiled in this report include FEI, Hitachi High-Technologies Corporation, Carl Zeiss SMT GmbH, and JEOL Ltd.

Failure analysis equipment market in semiconductor industry: By geography
  • North America
  • Europe
  • Asia Pacific
  • RoW
Failure analysis equipment market in semiconductor industry: By equipment
  • Scanning electron microscope (SEM)
  • Transmission electron microscope (TEM)
  • Focused Ion Beam system (FIB)
  • Dual Beam (FIB/SEM) systems
Failure analysis equipment market in semiconductor industry: By technology
  • Transmission electron microscopy
  • Scanning electron microscopy
  • Scanning Transmission electron microscopy (STEM)
  • X-ray imaging
  • Nanoprobing
  • Laser voltage imaging (LVI)
  • Focused ion beam (FIB)
  • Broad ion milling (BIM)
  • Secondary ion mass spectroscopy (SIMS)
  • Energy dispersive X-ray spectroscopy (EDX)
  • Reactive ion etching (RIE)
  • Chemical mechanical planarization (CMP)
Failure analysis equipment market in semiconductor industry: By application
  • Defect localization
  • Defect characterization
  • Others
Failure analysis equipment market in semiconductor industry: By customers
  • Fab FA labs
  • Fabless FA labs
  • Specialty labs
  • Others


 
 
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