BGA Heat Sink Market: Introduction
- The heat sink installed on Ball Grid Array (BGA) device is called BGA heat sink. The BGA heatsink is used to cool ICs, and the device encapsulated by this technology is a surface mount device.
- It offers a wide range of features such as aluminum BGA heat sink low profile, high efficiency cooling product which is ideal for linear air flow environments; made from thermal conductivity 6063-T5 aluminum for optimum heat transfer; designed specifically for BGA and other surface mount packages; and finished with black or silver anodized.
- These features are estimated to boost the demand for BGA worldwide
Rise in Adoption from Electronics & Semiconductors Industry
- Based on the end-use industry, the global BGA heat sink market can be segmented into electronics & semiconductors, IT & telecommunication, automotive & transportation, consumer electronics, healthcare, and others (oil & gas, power & utility, energy, etc.). The electronics & semiconductors segment is expected to at a rapid pace during the forecast period due to the increasing use of BGA heat sink to cool integrated circuits and integrated circuit with ball gate array (BGA) surface mount packaging.
- BGA heat sink is utilized in various ways, including clip connections, solder anchors, push pins, hot tape/epoxy resins, and easy to assemble tape, etc. This factor is significantly driving the demand for BGA heat sink in the electronics & semiconductors industry.
- Rising adoption of BGA heat sink for personal computers and consumer electronics products with high-end design optimizations that meet thermal performance requirements is further propelling the market
North America to Lead the BGA Heat Sink Market
- In terms of region, the global BGA heat sink market can be divided into North America, Europe, Asia Pacific, Middle East & Africa, and South America
- North America is expected to hold the largest share of the BGA heat sink market during the forecast period due to increasing demand from the semiconductor, automotive, and IT and telecommunication industries
- BGA heat sinks are widely utilized in semiconductor and electronic devices to improve their performance, miniaturization, and functionality
- Rising digitalization, the proliferation of the internet of things (IoT), running investment in advanced factory automation solution, and innovations in portable electronic devices such as e-readers, smartphones, tablets, and flash drives are other factors propelling the BGA heat sinks market in North America
- The BGA heat sink market in Asia Pacific and Europe is expected to expand at a significant pace during the forecast period due to rising demand for BGA heat sink from diverse industries such as automotive, consumer electronics, semiconductor, and IT and telecommunication. Moreover, the growth is anticipated to be driven by leading countries such as India, China, Japan, Germany, France, and South Korea. The BGA heat sink market in Middle East & Africa and South America is anticipated to grow at a steady pace during the forecast period.
Key Players Operating in the Global BGA Heat Sink Market
Prominent players operating in the global BGA heat sink market are engaged in developing technologically advanced products to cater to the rising demand for BGA heat sinks. Furthermore, several manufacturers are focusing on strategic mergers and acquisition of local manufacturers and system designers to strengthen their product offerings and expand their geographic reach.
Leading players operating in the global BGA heat sink market include:
- CUI Devices
- Fischer Elektronik GmbH & Co. KG
- MALICO INC.
- Ohmite Mg Co
- IBASE Technology Inc.
- Congatec AG
- Heatwell
- Shenzhen Lori Technology Co., Ltd.
Global BGA Heat Sink Market: Research Scope
Global BGA Heat Sink Market, by Fin Style
- Cross Cut Fin
- Straight Fin
- Forged Fin
- Pin Fin
- Angled Fin
- Channel Cut Fin
- Others (Square, Omnidirectional, Z Finished, etc.)
Global BGA Heat Sink Market, by Heat Sink Material
- Aluminum
- Copper
- Aluminum Alloy
- Composite
Global BGA Heat Sink Market, by End-use Industry
- Electronics & Semiconductors
- IT & Telecommunication
- Automotive & Transportation
- Consumer Electronics
- Healthcare
- Others (Oil & Gas, Power & utility, Energy, etc.)
Global BGA Heat Sink Market, by Region
- North America
- U.S.
- Canada
- Rest of North America
- Europe
- Germany
- France
- U.K.
- Italy
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- China
- Japan
- India
- South Korea
- ASEAN
- Rest of Asia Pacific
- South America
- Brazil
- Mexico
- Rest of South America
- Middle East & Africa
- GCC
- South Africa
- Rest of Middle East & Africa
