Innovation in the packaging industry is driving the demand for 3D semiconductor packaging. 3D semiconductor packaging is likely to be driven by the growth in consumer electronics. 3D packaging uses 3D schemes based on conventional methods. 3D integrated circuits are manufactured by stacking silicon wafers and connecting the wafers to silicon vias, which enables them to become a single device utilizing lesser power compared to conventional technology. Growing demand for devices with high capacity and less storage is anticipated to increase the market demand for 3D semiconductor packaging. Moreover, the trend for miniaturization is rapidly demanded in the manufacturing and designing of electronic products. This is expected to contribute to the market growth of 3D semiconductor packaging.

3D Semiconductor Packaging Market: Dynamics

The key driver of 3D semiconductor packaging is cost control for chip designs. With the advent of technological developments like the Internet of Things (IoT), it is challenging to develop electronics devices that inculcate the latest technology. High designing costs restrain the manufacturers from adapting to aggressive pricing strategies. 3D semiconductor packaging provides the opportunity to the manufacturers to adapt to manufacturing designs which can allow them to control their costs. This is anticipated to propel the growth of 3D semiconductor packaging market. Furthermore, the rising demand for consumer electronic products such as phones, tablets, fitness bands, smartwatches and other wearable devices where latest technology integration plays a predominant role, is expected to augment the market demand for 3D semiconductor packaging. 3D integrated circuits enable more complex integrations, such as gyroscopes, microphones for smartphones, multi-axis accelerometers,  wearable helmet airbag systems and accelerometers for fashionable devices. The innovation and functionality enhance the efficiency of the electronic products which is likely to hike the market demand for 3D semiconductor packaging.

Application processors use advanced technology and are small and faster compared to traditional chip configurations. 3D technology helps in expanding the bandwidth, increasing the efficiency and provides higher power compare to the traditional methods. 3D semiconductor technology helps in lowering risk and reduces cost which makes 3D semiconductor packaging a viable solution across the various application. This is expected to fuel the market demand for 3D packaging market in the years to come.

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3D Semiconductor Packaging Market: Segmentation

3D Semiconductor Packaging Market can be segmented on the basis of technology, material and end-users.

By Technology, 3D Semiconductor Packaging Market can be segmented as

  • 3D Wire Bonded
  • 3D Package on Package
  • 3D Fan Out Based
  • 3D Through Silicon Via
  • Others

By Material, 3D Semiconductor Packaging Market can be segmented as

  • Organic Substrate
  • Encapsulation Resin
  • Die Attach Material
  • Bonding Wire
  • Ceramic Package
  • Leadframe
  • Others

By End-Users , 3D Semiconductor Packaging Market can be segmented as

  • Electronics
  • Industrial
  • Healthcare
  • Automotive & transport
  • Telecommunication
  • Aerospace
  • Défense
  • Others

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3D Semiconductor Packaging Market: Regional Outlook

Asia Pacific region is likely to lead the global 3D semiconductor packaging market owing to the presence of the largest semiconductor industry. The region has the highest number of OEMs and distributors of the 3D semiconductor packaging industry. Moreover, countries such as China, Taiwan, South Korea, and Japan have a stronghold on manufacturing consumer electronics. North America is likely to witness growth in the 3D semiconductor packaging market due to the solid developments in the hardware technology. In addition, consumption and demand for electronic gadgets and AI integrated devices might fuel the growth of 3D semiconductor packaging in the region.

3D Semiconductor Packaging Market: Impact of COVID 19

COVID 19 has a significant impact on the global supply chains and has resulted in disruptions of the production lines. However, the electronics and automotive industry have a larger downside compared to other industries such as food & beverage and pharmaceuticals. The Asia Pacific is the major supplier of electronics and semiconductors. Since China is highly impacted due to COVID 19 it has resulted in uncertainty because of changing scope and reactions by various companies and supplies. COVID 19 has resulted in depressed demand for electronics and has led to supply & demand imbalance. This is likely to hinder the growth of 3D semiconductor packaging in the short run. However, in the long run the market has high growth opportunities due to the inclination of customers toward the latest technological devices enabled with artificial intelligence.

3D Semiconductor Packaging Market: Key Players

Key players in the 3D Semiconductor Packaging Market are as follows,

  • Jiangsu Changjiang Electronics Technology Co. LTD
  • Qualcomm Technology Inc.
  • Taiwan Semiconductor Manufacturing Company Ltd.
  • Siliconware Precision Industries Co., Ltd (SPIL)
  • 3M Company
  • Advanced Semiconductor Engineering
  • United Microelectronics
  • IBM
  • STMicroelectronics
  • STATS ChipPAC
  • Micron Technology
  • Xilinx
  • Suss Microtec AG
  • Amkor Technology Inc.

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3D Semiconductor Packaging Market