The global 3D packaging market is expected to witness moderate growth during the forecast period between 2021 and 2031.
3D packaging is the process of integrating schemes that depend on conventional interconnection methodologies such as flip chip and wire bonding to arrive at vertical stacking. Some of the commonly-deployed types of 3D packaging include package-on-package wherein single dyes are packaged, stacked and interconnected with flip chops and wire bonds.
The other type of 3D packaging which has witnessed high demand includes 3D wafer-packaging which deploys redistribution layers and bumping procedures to develop interconnects.
The outbreak of the COVID-19 pandemic negatively impacted the growth in the overall 3D packaging market. With governments imposing social distancing regulations and lockdowns in a bid to contain the spread of the virus, various industries were forced to shut down temporarily or permanently.
This led to reduced demand for 3D packaging and adversely affected the growth in the overall 3D packaging market.
However, with vaccine availability and approval given to the use of third booster dose for different population sections it is anticipated that industries would start operations close to full capacity soon which could increase the demand for 3D packaging and help the overall market grow at a steady pace.
Rising need to reduce electricity consumption and improve overall packaging efficiency is the key growth driver for the global 3D packaging market.
Also, increasing demand for flexible printing technology for different applications could offer revenue-generating opportunities for 3D packaging market players, in the coming years.
In addition to this, growing need to reduce waste could also propel the demand for 3D packaging in various industries, in the years ahead.
Other factors such as cost-effective nature of 3D packaging could also lead to increased demand, in the coming years.
Medical end-use segment is expected to make the largest contribution to the overall market because of increasing product deployment during various surgeries for different human organs such as kidneys, liver, and heart.
The global 3D packaging market is extremely competitive, with the presence of several well-established market players. Many of them have become successful owing to years of delivering consistent results and are expected to account for a large share in the overall market, in future.
Growth strategies such as novel packaging methods could help leading market players generate more revenue and gain a competitive edge over other players.
Collaboration with smaller players could help well-established market players expand their market presence and increase their revenue shares.
Amkor signed a collaborative agreement with Mentor to develop a ‘SmartPackage Package Assembly Design Kit’ to assist the latter’s high-density packaging design methods and tools.
R&D undertakings could be a key growth strategy for prominent 3D packaging market players, in the years ahead.
A few leading players in the 3D packaging market include Intel, Samsung, Toshiba, Qualcomm, and Amkor.
The global 3D packaging market is divided into four regions, namely, North America, Asia Pacific, Europe, and rest of the world.
North America is expected to offer maximum revenue-generating opportunities for the global 3D packaging market because of the presence of several well-established market players in countries such as US and Canada, contributing hugely to market growth in the region.
Europe is expected to witness strong growth in the overall market in future because of growing developments in hardware technology in countries such as UK and Germany.
Asia Pacific is anticipated to witness moderate growth in the overall 3D packaging market owing to the reduced presence of several well-established market players in both the developed and developing economies such as China and India.
The rest of the world is expected to witness sluggish growth in the global 3D packaging market, in future.
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3D Packaging Market
