The global market for 3D IC and 2.5D IC is expected to witness a stellar growth in the coming few years of the forecast period. There are several notable trends and developments emerging in the global market that are paving the way for further development. Trends such as 2D block assembly into 3D chips, computing and data centers, hybrid memory cubes, and heterogeneous 3D integration are helping the development of the global 3D IC packaging market.
The competitive landscape of the global 3D IC and 2.5D IC market is a fragmented one. Presence of multiple leading players in the market is the prime reason behind this fragmentation. However, there are a few established companies in the market that are consolidating their stronghold on the global market. The leading players in the 3D IC packaging market are concentrating on developing new and innovative products to cater to growing demand. Thus more focus is on product development. Heavy investments and funding are being put for the research and development activities.
Some of the leading companies in the global 3D IC and 2.5D IC market include names such as Samsung Electronics, Taiwan Semiconductor Manufacturing Company Ltd., Advanced Semiconductor Engineering Group, and Intel Corp among others.
There are number of factors that are proving to be pivotal in the growth of the global 3D IC and 2.5D IC market. One of the key driving factors for market growth has been the growing need for highly advanced circuit architecture in electronic product. These 3D IC and 2.5D IC packages are among the best electronic architecture available. Naturally, to cater to the growing needs of the consumers, their demand has been on the high in recent years. Thus, the growth of the market has been improving on a year on year basis.
A key trend that has been emerging in the global market is of miniaturization of electronic devices. Small, handy, compact, yet highly advanced electronic devices are becoming a huge sensation among global population, especially among the millenials. 3D IC packages are a key component in these advanced miniature electronic devices. Thus, their growing sale directly reflects on the overall development of the global 3D IC and 2.5D IC market.
The global 3D IC packaging market has a geographical landscape featuring five key regions. These regions are North America, Middle East and Africa, Asia Pacific, Latin America, and Europe. Among these regional segments, the global 3D IC and 2.5D IC market is currently dominate by the Asia Pacific region. The regional segment is expected to continue to act as a leading contributor in the global market for the next few years. The growth of the regional segment is primarily driven by the growing scope of the 3D IC and 2.5D IC packages in a variety of consumer electronic applications, especially tablets and smartphones. The growing population density in the Asia Pacific segment is one of the key reasons behind the increasing sale of smartphones and tablets. This has thus proved to be helpful for the development of the 3D IC and 2.5D IC market in the region. In addition to this, the region is home to some of the biggest companies operating in the market. Naturally, their presence and constant developments are also helping the growth of the regional market.