In the manufacturing process of electronics, integrated circuit (IC) packaging is one of the major stages of semiconductor device fabrication in which the small blocks of semiconducting material is encapsulated in a supporting case that prevents physical corrosion and damage. The market is segmented into by application which includes LED, sensors and MEMS, logic, optoelectronics and imaging, memory, among others. The market, by region is segmented into Asia Pacific, North America, Europe, Middle East and Africa and South America.

Lower cost, low power consumption, high speed signal processing and small form factors are some of the prime reasons behind the growing application of 2.5D packaging in smartphone and memory chips. Additionally, high thermal performance is another major feature which is fueling the market for 2.5D integrated circuit packaging globally. In order to increase the efficiency and to cut down the power consumption up to 50%, the usage of 2.5D IC packaging technique is increasing in different processing units which include central processing unit (CPU) and graphics processing unit (GPU). Moreover, application of 2.5D IC packaging technique also reduces latency of different networking equipment. Furthermore, it also helps in interconnection with low power consumption and higher bandwidth. Increasing proliferation of minimization of devices, heterogeneous integration and high I/O density are some the prime factors influencing the growth of 2.5D IC packaging market globally. It is cost effective technique and flexible to integrate in any semiconductor and networking devices. High end communication devices, RF wireless modules, LED packages, portable computers, power amplifiers, and other wearable gadgets among others are some of the key application areas of 2.5D IC packaging market. With the rising research and development activities of 2.5D packaging technologies has enabled different ways of producing advanced packages for the advanced devices. Increasing technological advancement in the field of semiconductor fabrication is one of the fueling factors for the market for 2.5D IC packaging. 2.5D IC packaging enable integration of multiple different chips into a system at lower cost. Furthermore, 2.5D IC packaging refers to stacking chips side by side horizontally on the silicon interposer. Design complexity, tool readiness, heat dissipation and potential yield loss may be considered as some of the restraining factor which may inhibit the growth of the 2.5D IC packaging market.  However, increasing application of 2.5D IC packaging in high end research laboratory equipment, satellite communication devices and advanced medical devices are some of the opportunities for the market.

In 2016, North America accounted for the largest market share in terms of revenue for the 2.5D IC (integrated circuit) packaging market, followed by Asia Pacific and Europe. The U.S. is leading the market for 2.5D IC packaging across North America. In Asia Pacific, China held the largest market share in terms of revenue across Asia Pacific, followed by Japan, South Korea. Germany, Italy, the U.K. and France among others are influencing the positive growth in the 2.5D IC packaging market. Brazil and Argentina are anticipated to contribute positive development over the forecast period from 2017 to 2025. In Middle East and Africa, there has been considerable advancement, miniaturization and development in the sector of electronics and other industries is stimulating the demand for 2.5D IC packaging market.

Taiwan Semiconductor Manufacturing Company, Limited (Taiwan), Palomar Technologies (The U.S.), Amkor Technology, Inc. (The U.S.), Texas Instruments Inc. (The U.S.), Samsung Electronics Co., Ltd. (South Korea), Teledyne Technologies Incorporated (The U.S.), Micron Technology, Inc. (The U.S.), Maxim Integrated (The U.S.), Advanced Semiconductor Engineering, Inc. (Taiwan), API Technologies Corporation (The U.S.), Tektronix, Inc. (The U.S.),  Toshiba Corporation (Japan) and Intel Corporation (The U.S.) are some of the key players operating in the 2.5D IC packaging market globally. Merger and acquisition and long term and short business alliances with raw material suppliers and component distributers are some of the major strategies abide by the companies in the 2.5D IC (Integrated Circuit) packaging market globally.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market   

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

This study by TMR is all-encompassing framework of the dynamics of the market. It mainly comprises critical assessment of consumers' or customers' journeys, current and emerging avenues, and strategic framework to enable CXOs take effective decisions.

Our key underpinning is the 4-Quadrant Framework EIRS that offers detailed visualization of four elements:

  • Customer Experience Maps
  • Insights and Tools based on data-driven research
  • Actionable Results to meet all the business priorities
  • Strategic Frameworks to boost the growth journey

The study strives to evaluate the current and future growth prospects, untapped avenues, factors shaping their revenue potential, and demand and consumption patterns in the global market by breaking it into region-wise assessment.

The following regional segments are covered comprehensively:

  • North America
  • Asia Pacific
  • Europe
  • Latin America
  • The Middle East and Africa

The EIRS quadrant framework in the report sums up our wide spectrum of data-driven research and advisory for CXOs to help them make better decisions for their businesses and stay as leaders.

Below is a snapshot of these quadrants.

1. Customer Experience Map

The study offers an in-depth assessment of various customers’ journeys pertinent to the market and its segments. It offers various customer impressions about the products and service use. The analysis takes a closer look at their pain points and fears across various customer touchpoints. The consultation and business intelligence solutions will help interested stakeholders, including CXOs, define customer experience maps tailored to their needs. This will help them aim at boosting customer engagement with their brands.

2. Insights and Tools

The various insights in the study are based on elaborate cycles of primary and secondary research the analysts engage with during the course of research. The analysts and expert advisors at TMR adopt industry-wide, quantitative customer insights tools and market projection methodologies to arrive at results, which makes them reliable. The study not just offers estimations and projections, but also an uncluttered evaluation of these figures on the market dynamics. These insights merge data-driven research framework with qualitative consultations for business owners, CXOs, policy makers, and investors. The insights will also help their customers overcome their fears.

3. Actionable Results

The findings presented in this study by TMR are an indispensable guide for meeting all business priorities, including mission-critical ones. The results when implemented have shown tangible benefits to business stakeholders and industry entities to boost their performance. The results are tailored to fit the individual strategic framework. The study also illustrates some of the recent case studies on solving various problems by companies they faced in their consolidation journey.

4. Strategic Frameworks

The study equips businesses and anyone interested in the market to frame broad strategic frameworks. This has become more important than ever, given the current uncertainty due to COVID-19. The study deliberates on consultations to overcome various such past disruptions and foresees new ones to boost the preparedness. The frameworks help businesses plan their strategic alignments for recovery from such disruptive trends. Further, analysts at TMR helps you break down the complex scenario and bring resiliency in uncertain times.

The report sheds light on various aspects and answers pertinent questions on the market. Some of the important ones are:

1. What can be the best investment choices for venturing into new product and service lines?

2. What value propositions should businesses aim at while making new research and development funding?

3. Which regulations will be most helpful for stakeholders to boost their supply chain network?

4. Which regions might see the demand maturing in certain segments in near future?

5. What are the some of the best cost optimization strategies with vendors that some well-entrenched players have gained success with?

6. Which are the key perspectives that the C-suite are leveraging to move businesses to new growth trajectory?

7. Which government regulations might challenge the status of key regional markets?

8. How will the emerging political and economic scenario affect opportunities in key growth areas?

9. What are some of the value-grab opportunities in various segments?

10. What will be the barrier to entry for new players in the market?

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

Custom Market Research Services

TMR offers custom market research services that help clients to get information on their business scenario required where syndicated solutions are not enough.

REQUEST CUSTOMIZATION

25d Ic Packaging Market

Pre Book