Underfill technology in semiconductor packaging and assembly applications supports package designs as well as offers the required support and reliability needed for lead-free device as these materials are essential in semiconductors and PCB assembly industry. Technological advancements in underfill such as control of flow rates, enhancements in filler as well as improved modulus properties have brought enhanced performance capabilities to the semiconductor industry. But as the industry will take its pace towards more flexible, efficient devices, more underfill technology will be required. Underfill dispensing systems are jetting systems in which the underfill dispenses fluid between the flip chip and substrate to reduce the thermal stress on the solder bumps. Further these systems addresses the challenges that SiP (System-in-Package) and MEMS (Micromechanical Systems) packages face as these packages are being used in smartphones and many electronic assemblies.
Underfill Dispenser Market: Dynamics
The transition from needle process to jetting technology in the underfill dispensing process has increases the yield of underfill process in the recent years. Through technological innovation, the semiconductors have turned the overall electronic industry in past few years and the development of underfill dispenser market growing parallely with the semiconductor industry. Further, increasing applications of flip chips coupled with rising demand of smaller, cheaper, lighter electronic devices have fueled up the demand for the underfill dispenser market in the near future. Flip chip packaging provides an improved electrical performance, a smaller integrated circuit footprint which are crucial advantages to the semiconductor industry.
Advancement in the materials and techniques engaged in the underfill process, plays a decisive role in driving the underfill dispenser market. Further, the underfill dispenser market is primarily driven by high demand for inventions across the semiconductor industry.
Underfill Dispenser Market: Segmentation
On the basis of product type, the global underfill dispenser market is segmented into,
- Capillary flow underfill (CUF)
- No flow underfill (NUF)
- Molded underfill (MUF)
On the basis of application, the global underfill dispenser market is segmented into,
- Flip chips
- Ball Grid array
- Chip Scale Packaging
Underfill Dispenser Market: Region Wise Outlook
On the basis of region, underfill dispenser market finds its market possibility in North America, Latin America, Middle East & Africa, Europe and Asia-Pacific. Asia Pacific and North America dominates the underfill dispenser market. The growth in Asia Pacific is attributed to the heavy investment done by china in order to create a significant demand for underfill dispenser market. Sluggish growth in china semiconductor industry, owing to moderate economic growth, falling prices, which is projected to keep the underfill dispenser market in the region cost sensitive. More than 40% of the demand for underfill dispenser market is expected to generate from North America and Europe. Latin America and Middle East & Africa are in the next trail.
Underfill Dispenser Market: Key Players
Underfill dispenser manufacturers are tapping opportunities by targeting areas like micro mechanical device, 3D systems and many more. Some of the key market players in the underfill dispenser market are Henkel (Loctite), Newport Corporation, Shenzhen Stihom Electronics Co. LTD, Zmation Inc., Nordson Corporation, Zymet Inc, Master bond Inc., Protec, Speedline Technologies, ITW Dynatec, sulzer and many others.
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