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Growing Demand for Photonic ICs in Emerging Futuristic Applications will Create New Revenue Streams for Manufacturers, reports TMR

Posted on Oct 19, 2015

The high degree of competition between Infinera Corp., Huawei Technologies Co. Ltd., Ciena Corp., and Alcatel-Lucent S.A. characterizes the competitive landscape of the global photonic integrated circuit (IC) market, finds a recent report by Transparency Market Research (TMR). 

Owing to this rivalry, new entrants with niche offerings can expect growth opportunities in the form of mergers, acquisitions, and strategic alliances with the market leaders. Going forward, the competition in the market is likely to intensify as the number of participants is expected to increase over the forthcoming years.

Benefits of Photonic Integration in Optical Systems Create Demand for Photonic ICs

“The advent of photonic integration has provided optical systems manufacturers a platform for the miniaturization of these systems in order to expand their application area as well as reduce the manufacturing costs,” an analysts at TMR states. Photonic ICs assist these manufacturers in integrating optical devices such as modulators, lasers, multiplexers, optical amplifiers and various others into a single package, making the overall system compact. This assimilation also leads to a reduced production cost on these devices, owing to which the application of photonic ICs has increased significantly in the recent times.

At the same time, photonic ICs also find extensive application in a wide range of emerging futuristic applications, which is likely to impel their demand considerably over the next few years.

Lack of Digitization Could Interrupt Rising Demand for Photonic ICs

On the other hand, inadequate digitization across the world is expected to hamper the usability of photonic ICs in the years to come. As of now, photonics is still at the analog stage; however, electronics actually utilize them in the digital format with the help of analog transistors. Since the usage of photonics in digital format allows a higher level of integration of various components into a single unit structure, digitization is crucial for photonic integration for a number of product applications.

The complex designs of integrated circuits in large-scale photonic integration are also projected to limit the application of these ICs in the forthcoming years.

North America to Continue to Exhibit Strong Demand for Photonic ICs

North America exhibits a high demand for photonic ICs, states TMR. In 2014, the region accounted for a revenue share of 39% in the overall market. Between 2015 and 2022, the demand for photonic ICs in this region is likely to remain high; however, analysts anticipate Asia Pacific to report the fastest growth rate. The opportunity for photonic IC in North America is projected to rise to US$505.8 mn by 2022, whereas Asia Pacific is estimated to register an exponential CAGR of 26.50% during the period from 2015 to 2022.

Optical communication emerged as the leading application area of photonic ICs in 2014 and is expected to remain the key consumer over the coming years. In the meanwhile, photonic ICs with hybrid integration are anticipated to most demanded ICs based on integration. Indium phosphide-based ICs will lead in terms of demand based on raw materials.

The global photonic ICs market is projected to rise from US$0.2 bn in 2014 to US$1.3 bn by 2022, increasing at a remarkable CAGR of 25.30% between 2015 and 2022.

The analysis presented here is based on a report by Transparency Market Research (TMR) titled “Photonic IC Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2015 - 2022.”

Key Takeaways

  • High competition between leading players has reduced entry barriers in photonic ICs market
  • The advent of photonic integration has provided optical system manufacturers a platform to produce their miniaturized versions
  • Opportunity for photonic ICs in Asia Pacific to increase at a 26.50% CAGR between 2015 and 2022

The photonic IC market has been segmented as follows:

By Integration Type

  • Monolithic Integration
  • Hybrid Integration
  • Module Integration

By Raw Materials

  • Indium Phosphide
  • Gallium Arsenide
  • Lithium Niobate
  • Silicon
  • Silicon-on-Insulator
  • Others (Silica-On-Silicon, Silicon Dioxide (SiO2), Silicon Nitride (Si3Ni4))

By Components

  • Lasers
  • Modulators
  • Detectors
  • Attenuators
  • Multiplexers/De-Multiplexers
  • Optical Amplifiers

By Application

  • Optical Communication
    • Fttx and Access Networks
    • Microwave/RF Photonics
    • Long-Haul and Transport Networks
    • Optical Datacom
  • Sensing
    • Structural Engineering
    • Chemical Sensors
    • Transport and Aerospace
    • Energy and Utilities
  • Optical Signal Processing
    • Optical Metrology
    • Optical Instrumentation
    • Quantum Optics
    • Quantum Computing
  • Biophotonics
    • Medical Instrumentation
    • Photonic Lab-On-A-Chip
    • Analytics and Diagnostics
    • Optical Biosensors

By Region

  • North America
  • Europe
  • Asia Pacific
  • Rest of the World (Latin America, Middle East and Africa)

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