Patterning uses the procedure of photolithography and optical masks to reproduce patterns that control the deposition or removal of material from the wafer at specific steps in the device assembly process.Patterning materials are primarily used in semiconductor and automotive industries. Patterning is used in microelectronic devices, automotive sensors, and glass printed circuit boards.Ithas reduced the size of transistors, thus making modern electronic devices affordable.Currently, majority of electronic devices are fabricated using photolithography techniques that depend on sophisticated instrumentation and tailored materials.Patterning materials consist ofspin-on-carbon layers, G line resist, I-line resist, top coat/barrier layer, positive 248nm resist,positive 193nm Immersion resist, positive 193nm dry resist, I-line BARC, 193nm BARC, 248nm BARC, and spin-on-silicon layers.
The semiconductor industry is growing at a rapid rate, especially in emerging economies of Asia Pacific. Growth in the semiconductor industry is expected to increase demand for nanodevices and boost demand for patterning material technology. Additionally, rising demand for miniaturized components and development of nanotechnology areanticipated to propel demand for patterning material technology and instruments. Semiconductor manufacturers are establishing production plants in emerging economies of Asia Pacific due to availability of cheap labor and land and government subsidies. However, patterning material technology is expensive as compared to conventional technology. This is likely to hamper growth of the market in the near future.Developing economies are anticipated to offer potential opportunities due to strong demand for electronic products such as tablets and mobile phones during the forecast period.
Asia Pacific, Europe, and North America account for majority share of the patterning materials market. North America is projected to be the largest market for patterning materials followed by Asia Pacific. The U.S. is expected to be the largest market in North America due to presence of large number of end-user industries. Taiwan, China, India, Hong Kong, Australia, New Zealand, South Korea, Japan, Vietnam, Malaysia, and Indonesia are anticipated to be major markets in Asia Pacific.In addition, AsiaPacific is the projected to be the fastest-growing patterning material market as packaging of semiconductors,consumer demand, and production of electronics systems has shifted to this region. The patterning material market in Europe is anticipated to expand at a sluggish rate due to ongoing Eurozone economic crisis.
The market is dominated by large and medium technology and electronic manufacturing companies. Key players operating in this market include JSR Micro, Inc. (the U.S.), DongjinSemichem Co., Ltd. (China), Honeywell Electronic Materials, Inc. (the U.S.), Shin-Etsu Chemical Co., Ltd.(Japan), The DowChemical Company (the U.S.), Applied Materials, Inc.(the U.S.), Tokyo Ohka Kogyo Co., Ltd. (Japan), Sumitomo Chemicals Co., Ltd. (Japan), Merck KGaA(Germany), Microchem Corporation (the U.S.) and Brewer Science, Inc. (the U.S.). Companies are using strategic acquisitions and mergers to remain competitive in the market. In addition, companies are trying to maintain an elaborate and consistent distribution network, which would allow themto cater to the globalmarket. Furthermore, companies collaborate with each other to develop new and innovative patterning material technology and instruments for end-user industries. In November 2014, Applied Materials, Inc. collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to produce an advanced patterning solution for fabrication of future generations of NAND and DRAM device designs.
This research report analyzes this market on the basis of its market segments, major geographies, and current market trends. Geographies analyzed under this research report include
- North America
- Asia Pacific
- Middle East and Africa
- Latin America
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