Market Research Reports

Global 3D ICs Market (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) - Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019

83pages
Published Date: 2014-01-15
 

Description



With the technological advancements, global semiconductor industry is witnessing transition from 2D packaging to 3D packaging to cater to the requirements across end-use industries. 3D IC technology finds widespread applications in micro-electro-mechanical systems (MEMS), wireless devices, sensors, smart imagers, displays, and other electronic devices. They can be manufactured using various processes such as beam re-crystallization, wafer bonding and solid-phase crystallization. With exceptional speed, low power consumption, reduction in chip size and circuit security, 3D ICs provide greater opportunities for developing a broader set of electronic systems and products.

The gradual shift towards 3D ICs occurred with increased demand for solutions with higher bandwidths and density of components. Increasing demand for memory enhanced application is one of the major factors contributing to the market growth of 3D ICs. Reduction in response time, power consumption, form factor and improved performance serve as key drivers for acceptance of 3D IC with TSV interconnect solutions. Moreover, 3D IC technologies are witnessing progressive developments towards management of issues associated with restricted communications capacity, memory latency, and chip signaling. Multi-chip packaging and IntSim CAD tools are some of the emerging technological trends in the 3D ICs market

Growing demand for solutions with improved performance, quick turn-around time and increasing number of portable devices such as smartphone and tablet are driving the adoption of 3D ICs. Moreover, various industry products such as MEMS and sensors, RF SiP, optoelectronics and imaging, memories (3D Stacks), logic (3D SiP/SoC) and HB LED are expected to deploy 3D IC integration. The most commonly used substrate types for 3D ICs fabrication are silicon on insulator (SOI) and bulk silicon. SOI chips reduce unwanted heat production and parasitic capacitance, and thus they are widely adopted as compared to bulk silicon wafers. As a result, bulk silicon substrates are gradually being replaced by SOI substrates.

The research report on the 3D ICs market provides a detailed analysis of different products types including MEMS and sensors 3D ICs, RF SiP 3D ICs, Optoelectronics and imaging 3D ICs, Memories (3D Stacks) 3D ICs, Logic 3D SiP/SoC 3D ICs, and HB LED 3D ICs and helps in understanding driving forces behind the popularity of 3D ICs in across various end user industries. It also provides analysis for the end user industries of the 3D ICs for the next six years. The report includes extensive analysis of the industry drivers, restraints, market trends and market structure. The market study provides comprehensive assessment of stakeholder strategies and imperatives for succeeding in the business. The report segregates the market based on fabrication process, end user industry, substrate type, product types, and different geographic regions. The report includes a detailed analysis of the prevalent market situation, company profiles and industry trends for 3D ICs used across different application.

The detailed value chain analysis and porter’s five forces analysis helps the market competitors to formulate their business strategies at every stage of their business. Moreover, the market estimates have been analyzed by keeping in mind the several factors including but not limited to technological, economical, social, environmental and legal.

The key players of QSR Ecosystem Market have been profiled with a focus on competitive details such as company and financial overview, business strategies, and their recent developments. The company profile of major players that have been incorporated in this report include Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Xilinx Inc., 3M Company, Micron Technology Inc., (Elpida Memory Inc.), Ziptronix, Inc., Tezzaron Semiconductor Corporation, MonolithIC 3D Inc., STATS ChipPAC Ltd. and United Microelectronics Corporation (UMC).

This report analyzes the global 3D ICs market in terms of revenue (USD million). The market has been segmented as follows:

3D ICs Market, By End-Use Sectors:
  • Consumer electronics
  • Information and communication technology
  • Transport (automotive and aerospace)
  • Military
  • Others(Biomedical applications and R&D)
3D ICs Market, By Substrate Type:
  • Silicon on insulator(SOI)
  • Bulk Silicon
3D ICs Market, By Fabrication Process:
  • Beam re-crystallization
  • Wafer bonding
  • Silicon epitaxial growth
  • Solid phase crystallization  
3D ICs Market, By Product:
  • MEMS and Sensor
  • RF SiP
  • Optoelectronics and imaging
  • Memories (3D Stacks)
  • Logic (3D Sip/Soc)
  • HB LED
3D ICs Market, By Geography:
  • North America
  • Europe
  • Asia Pacific
  • Rest of World (RoW)

Table of Contents


Table of content

Chapter 1 Preface
1.1 Report description and scope
      1.1.1 Market segmentation
1.2 Research methodology

Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)

Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
      3.2.1 Drivers
               3.2.1.1 Growing demand for efficient solutions
               3.2.1.2 Rise in number of portable devices
      3.2.2 Restraints
               3.2.2.1 High cost, thermal and testing issues
      3.2.3 Opportunities
               3.2.3.1 Big Data and predictive analytics
3.3 Trends and future outlook
      3.3.1 Multi-chip packaging
      3.3.2 IntSim
3.4 Value chain analysis
      3.4.1 Inbound logistics
      3.4.2 Operations
      3.4.3 Out-bound logistics
      3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
      3.5.1 Bargaining power of suppliers
      3.5.2 Bargaining power of buyers
      3.5.3 Threat of substitutes
      3.5.4 Threat of new entrants
      3.5.5 Degree of competition
3.6 Technology overview
      3.6.1 Shift to 3D IC from 2.5D IC technology
      3.6.2 3D IC fabrication processes
      3.6.3 Standards issues at different levels of 3D IC production
      3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
      3.8.1 Market share of key players, 2012 (%)

Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)

Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)

Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)

Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)

Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)

Chapter 9 Company Profiles
9.1 Taiwan Semiconductor Manufacturing Company, Ltd.
      9.1.1 Company overview
      9.1.2 Financial overview
      9.1.3 Business strategies
      9.1.4 Recent developments
9.2 XILINX, Inc.
      9.2.1 Company overview
      9.2.2 Financial overview
      9.2.3 Business strategies
      9.2.4 Recent developments
9.3 The 3M Company
      9.3.1 Company overview
      9.3.2 Financial overview
      9.3.3 Business strategies
      9.3.4 Recent developments
9.4 STATS ChipPAC Ltd.
      9.4.1 Company overview
      9.4.2 Financial overview
      9.4.3 Business strategies
      9.4.4 Recent developments
9.5 Tezzaron Semiconductor Corporation
      9.5.1 Company overview
      9.5.2 Financial overview
      9.5.3 Business strategies
      9.5.4 Recent developments
9.6 United Microelectronics Corporation
      9.6.1 Company overview
      9.6.2 Financial overview
      9.6.3 Business strategies
      9.6.4 Recent developments
9.7 Ziptronix, Inc.
      9.7.1 Company overview
      9.7.2 Financial overview
      9.7.3 Business strategies
      9.7.4 Recent developments
9.8 Elpida Memory, Inc. (Micron Technology, Inc.)
      9.8.1 Company overview
      9.8.2 Financial overview
      9.8.3 Business strategies
      9.8.4 Recent developments
9.9 MonolithIC 3D Inc.
      9.9.1 Company overview
      9.9.2 Financial overview
      9.9.3 Business strategies
      9.9.4 Recent developments

List of Figures 

FIG. 1 Global 3D ICs market, 2011 – 2019 (USD million) and Y-o-Y growth (%)
FIG. 2 Global smartphone and tablet shipment forecast, 2010 – 2015 (million units)
FIG. 3 Value chain analysis
FIG. 4 Porter’s five forces analysis
FIG. 5 Market attractiveness analysis, by end-use sectors, 2012
FIG. 6 Market share of key players, 2012 (%)
FIG. 7 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
FIG. 8 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
FIG. 9 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
FIG. 10 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
FIG. 11 Military 3D ICs market, 2011 – 2019 (USD million)
FIG. 12 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)
FIG. 13 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
FIG. 14 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
FIG. 15 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)
FIG. 16 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
FIG. 17 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 18 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
FIG. 19 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
FIG. 20 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)
FIG. 21 Global 3D ICs market overview, by product, 2012 & 2019 (%)
FIG. 22 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
FIG. 23 RF SiP 3D ICs market, 2011 – 2019 (USD million)
FIG. 24 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
FIG. 25 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
FIG. 26 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
FIG. 27 HB LED 3D ICs market, 2011 – 2019 (USD million)
FIG. 28 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
FIG. 29 North America 3D ICs market, 2011 – 2019 (USD million)
FIG. 30 Europe 3D ICs market, 2011 – 2019 (USD million)
FIG. 31 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
FIG. 32 RoW 3D ICs market, 2011 – 2019 (USD million)
FIG. 33 Taiwan Semiconductor Manufacturing Company, Ltd. annual revenues, 2010 – 2012 (USD billion)
FIG. 34 Xilinx, Inc., annual revenues, 2010 – 2012 (USD billion)
FIG. 35 3M Company annual revenues, 2010 – 2012 (USD billion)
FIG. 36 STATS ChipPAC Ltd., annual revenues, 2010 – 2012 (USD million)
FIG. 37 United Microelectronics Corporation annual revenues, 2010 – 2012 (USD billion)
FIG. 38 Micron Technology, Inc., annual revenues, 2010 – 2011 (USD billion)

List of Tables

TABLE 1 3D ICs market segmentation
TABLE 2 Global 3D ICs market snapshot, 2012 & 2019
TABLE 3 Impact analysis of drivers
TABLE 4 Comparison for 2D and 3D designs for low density parity check (LDPC) code decoder
TABLE 5 Impact analysis of restraint
TABLE 6 Overview of different 3D IC fabrication processes
TABLE 7 Issues at different levels of 3D IC
TABLE 8 Patents by companies
TABLE 9 Geographical distribution of patents

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Free Market Analysis


The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019. Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide.

3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.

Penetration of 3D IC technology in various applications is dependent on the need of interconnect density and cost related with particular process. Several industry products such as MEMS and sensors, RF SiP, memories, optoelectronics and imaging, logic (3D SiP/SoC) and HB LED are expected to adopt 3D IC integration. Among these products, ‘MEMS and sensors’ and memories are expected to emerge as leading segments. The increasing popularity of memory enhanced applications is expected to drive demand for the memory (3D stacks) segment in the near future. Geographically, Asia Pacific is expected to become largest market for 3D IC technology, with growth primarily supported by its emerging ICT and consumer electronics sector. Asia Pacific is expected to hold largest market share followed by North America throughout the forecast period. 

Eyeing the growth potential with potential breakthrough for mass production, large number of semiconductor and packaging industry players have started to venture into 3D ICs market. Some of the key participants in this market include: Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), Micron Technology Inc. (Elpida Memory Inc.), Intel Corporation, Micron Technology Inc., TEZZARON Semiconductor, STATS ChipPAC Ltd., United Microelectronics Corporation (UMC), Samsung Electronics Co. Ltd., and MonolithIC 3D IC Inc., among others. Among these, players such as Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC), Samsung Electronics Co., Xilinx Inc. Ltd., are considered to have dominant position in the market.

global-3d-ics-market-by-geography-2012
 

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