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Underfill Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2016 - 2024

Pre Book Price: $ 5216

Original Price: $ 5795


Underfill materials are composite formulations of organic polymers and inorganic fillers which are used in semiconductor packaging to achieve improved thermo mechanical performance. Polymer adhesives are used as underfill material to distribute mechanical stresses at solder joint which occurs due to difference in the thermal expansion coefficients at the interconnect. Various phenolic and amine based epoxy materials are used as underfill material in semiconductor packaging industry. High thermal stability and reworkability are desired characteristics for underfill material in the semiconductor packaging industry. They are used in various packaging techniques such as flip chip, ball grid array (BGA), and chip scale packaging (CSP), etc. Flip chip is a major application for underfill material. Global flip chip market is showing strong demand and is estimated to witness double digit growth in near future. The ever growing demand for lighter, smaller, efficient yet cost effective devices has drawn remarkable attention towards the underfill material. Capillary underfill (CUF), no flow underfill (NUF), and molded underfill (MUF) techniques are used for the application of underfill materials. Due to growing pricing pressure from end use industry, CUF being a conventional and relatively costly technique is replaced by MUF process technique. The global semiconductor packaging industry, a parent market for the global underfill material market is expected to continually expand at high growth rates in near future.

Global Underfill Materials Market Dynamics

Recently, the microelectronic industry is governed by more complex devices, due to trending system on chip (SOC) and system in package (SIP). The trends in portable end use market are driving the global underfill material market growth. The growing demand for low cost, high performing, small in size devices is one of the major driving factors for global underfill material market growth.  The increasing use of underfill material from flip chip packaging and wafer level packaging due growing demand in smart phones and tablets is a prominent driving factor for global underfill material market growth. Being a technology driven market, underfill material market is expected to be compelled by the recent advancements in electronic industry. The end use market is posing new requirement of compatibility with lead free solder paste material due latest trend of sustainability in the market. Some of the leading manufacturers in the market are offering underfill material products which are compatible with lead free solder paste.

Global Underfill Material Market Segmentation

The global underfill material market is segmented on the basis of product type and application. On the basis of product type, the global underfill material market is classified as

  • CUF underfill material
  • NUF underfill material
  • MUF underfill Material.

Among these segments, CUF is an oldest type and accounts for maximum share in global underfill market. Due to high cost, the CUF is anticipated to be replaced by MUF materials in near future. The MUF product type segment is estimated to show highest growth in near future.

 On the basis of application, the global underfill material market is segmented as

  • Flip chips
  • Ball grid array (BGA)
  • Chip scale packaging (CSP)

The flip chip application segment is expected to exhibit strong demand for underfill material compared to other application segments.

Global Underfill Material Market: Regional Outlook

On the basis of geography, global underfill material market can be divided by major regions which include North America, Western Europe, Eastern Europe, Asia-Pacific Excluding Japan, Japan, Middle East and Africa, and Latin America. Asia Pacific is a largest market for underfill materials with China, Korea, Japan, and Taiwan being prominent countries producing semiconductor packaging materials. North America and Europe are the largest market after Asia.

Global Underfill Material Market Players 

Some of the major players in global underfill material market are Henkel, Won Chemicals Co. Ltd., Epoxy Technology Inc., AIM solder, Namics Corporation.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, Luxembourg)
  • Eastern Europe (Poland, Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market 

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.

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