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Global Atomic Layer Deposition Equipment (ALD) Market: Wide Application Base to be Profitable for Growth, finds TMR

Posted on Mar 14, 2017

The involvement of numerous local and players in the global atomic layer deposition equipment market is likely to make the competition intense in the coming years, says Transparency Market Research (TMR) in a research report. Competition among the leading players in expected to further intensify as they strive to retain a strong hold in the market. Competitive rivalry in terms of technology and product is expected to grow with new upgrades and innovative products being introduced in the market. The primary factor fuelling the degree of competition in the market is the incessant research and development activities for introducing new and innovative technologies. Moreover, factors such as cost effectiveness along with technological advancement of any single player is expected to it towards a competitive edge over other companies. Thus, the degree of competition in this period is likely to stay high over the forecast period. The key players in the global atomic layer deposition equipment market are Aixtron SE, ASM International N.V., Tokyo Electron Ltd., and Ultratech Inc.

According to a TMR analyst, “The global atomic layer deposition equipment market is expected to rise at an outstanding CAGR of 29.4% between 2016 and 2024. The market was worth US$875.0 mn in 2015 and is likely to touch a valuation of US$8,585.4 mn by the end of 2024.”

atomic layer deposition equipment market

Aluminum Oxide to Emerge Dominant among all Products

Aluminum Oxide ALD dominated the global market in 2015 accounting for over 41% share in the market in terms of revenue. It was followed by metal ALD and catalytic ALD in the same year. The segment of aluminum oxide ALD is likely to retain a lead until the end of the forecast period owing increasing levels of system integration and miniaturization that requires the deposition of thin films which are homogenous, uniform, conformal and free from cracks, pinholes, and defects on standard electronic components are the primary reasons behind the growth of this segment. Aluminum oxide is one of the most researched ALD coated material. Aluminum oxide is extremely robust and stable material and has been researched for a broad range of applications in micro and optoelectronics. Key properties of it include thermodynamic stability on Si up to high temperatures, kinetic stability, large band gap, and band offset. Moreover, low bulk defect density and good interface are likely to be key features augmenting its use over the coming years. 

Region-wise, Asia Pacific led the market for atomic layer deposition equipment with a share of 57% in 2015. It is likely to maintain a lead in the coming years owing to significant growth of the semiconductors industry in the region due to the presence of cheap labor, land, and favorable government subsidies. China emerged as the leading consumer in the atomic layer deposition equipment market in Asia Pacific.

Rising Application in Nanotechnology to Supplement Market Growth

The evolution of atomic layer deposition equipment has increase its application in the field of nanotechnology. This development has been successful owing to technological advancements in terms of performance, scalability, and reliability.  With technological advancements on the go, the use of atomic layer deposition equipment as manipulation and fabrication tools in nanotechnology is the key driving force of the market. Moreover, next generation electronics, sensing devices, and optoelectronics that contain nanoscale measurements, confront progressively troublesome materials and challenges in manufacturing. The growing demand for cost effective and less time consuming semiconductors is likely to boost the sales of atomic layer deposition equipment over the coming years.

This review is based on a Transparency Market Research report titled, “Atomic Layer Deposition Equipment Market (Type - Aluminum Oxide (Al2O3) ALD, Catalytic ALD, Metal ALD, and ALD on Polymers; Application - Semiconductor & Electronics, Barrier Layers, Integrated Circuit (IC) Applications, Solar Panels, Display Panels, and Sensors) - Global Industry Analysis Size Share Growth Trends and Forecast 2016 - 2024.”

The Global atomic layer deposition equipment market has been segmented as follows:

Global Atomic Layer Deposition Equipment Market by Type

  • Aluminum Oxide (Al2O3) ALD
  • Catalytic ALD
  • Metal ALD
  • ALD on Polymers
  • Others

Global Atomic Layer Deposition Equipment Market by Application

  • Semiconductor & Electronics
    • Barrier Layers
    • Integrated Circuit (IC) Applications
    • Solar Panels
    • Display Panels
    • Sensors
    • Others
  • Research & Development Facilities

Global Atomic Layer Deposition Equipment Market by Region

  • North America
    • U.S.
    • Canada
    • Rest of North America
  • Europe
    • U.K
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia Pacific
    • India
    • China
    • Japan
    • Taiwan
    • South Korea
    • Rest of Asia Pacific
  • Latin America
  • Middle East and Africa

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Transparency Market Research (TMR) is a market intelligence company, providing global business information reports and services. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insight for thousands of decision makers. TMR’s experienced team of analysts, researchers, and consultants, use proprietary data sources and various tools and techniques to gather, and analyze information. Our business offerings represent the latest and the most reliable information indispensable for businesses to sustain a competitive edge.

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