+1-518-618-1030 866 - 552 - 3453 USA-Canada Toll Free

Packaged IC Component Inspector Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2017 - 2025

Pre Book Price: $ 5216

Original Price: $ 5795

Integrated circuits are placed into protective packages in order to allow efficient assembly and handling onto PCBs (printed circuit boards) and to protect the electronic devices from damage. Different sort of packaging techniques are present. Packaged IC component inspector systems primarily increase the throughput and boost the package changeover than traditional methods. The market has been segmented into by IC packaged inspection type surface mounting, through-hole mounting, pin grid array, ball grid array, flip chip inspection, plastic encapsulated IC inspection, flat package, molded underfill inspection among others. Moreover, the market has been also segmented by end use industry which includes consumer electronics, industrial equipment, aerospace and military, automotive, telecommunication, healthcare among others. The market for packaged IC component inspector by region has been segmented into, Europe, Asia Pacific, North America, MEA (Middle East and Africa) and South America. 

Integrated circuit packages are made of different sort of materials for instance plastic of a molded package, silicon circuit contained within the package and ceramic package.  Each package material carries different mechanical characteristics, for example elastic modulus and thermal expansion, primarily which cater to development of mechanical stresses when the whole package is subjected to thermal excursions. Circuits are exponentially smaller in size and defects have become smaller and much more difficult to identify or detect. Detecting defects is a crucial process in order to prevent mechanical, electrical and thermal failures. To ensure no defects reach the end users, packaged semiconductor producers are looking for advanced analytic capabilities along with finer-resolution imaging to fine-tune their processes and designs. In addition, increasing customer demand for higher throughput to enable 100% semiconductor inspection at production speeds is also fueling the market for packaged IC component inspector. Some of the defects which are inspected by the packaged IC component inspector include number of the cracks in the IC die, delamination of one package interface from another and cracks in the body of the package.  Some of the major inspection system application includes flip chip inspection, stacked die imaging, multi-chip and hybrid module inspection and ball grid arrays among others. Increasing technological advancement in the field of semiconductor component manufacturing is one of the prime reasons behind the growth of packaged IC inspection globally. Major semiconductor component manufacturer are focusing on innovating improved semiconductor inspection technology to meet the complex packaging challenges. Improved performance, fault less semiconductor components, higher throughput are some of the prime characterization of packaged IC component inspector, which in turn is fueling the application in different end use industries. Cyclical nature of semiconductor industry may be considered as one of the restraining factor which may inhibit the growth of the packaged IC component inspector market. However, application of packaged IC component inspector for nanoelectronics industry is one of the prime opportunities for the market. 

In 2016, North America held the largest market share in terms of revenue for the packaged IC component inspector market, followed by Asia Pacific and Europe. The U.S. is leading the packaged IC component inspector market in North America. In Asia Pacific, China, Japan, and India, South Korea among others are some of the major market contributing in the positive development of the market for packaged IC component inspector.  Germany, Italy, U.K., France among others are contributing positive share in the packaged IC component inspector market. In Middle East and Africa, there has been considerable advancement and development in the field of electronics and other industries for example, automotive and telecommunication sector is stimulating the demand for packaged IC component inspector market. In South America, Brazil and Argentina are anticipated to contribute positive growth over the forecast period from 2017 to 2025. 

KLA Tencor Corporation (The U.S.), Sonix, Inc. (The U.S.) and Nidec Corporation (Japan) among others are some of the key players operating in the packaged IC component inspector market globally.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market  

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.


Note : All statements of fact, opinion, or analysis expressed in reports are those of the respective analysts. They do not necessarily reflect formal positions or views of Transparency Market Research.


To receive discount, please click on the button below.

Please click on the button below to customize this report.

 
 
Back To Top