+1-518-618-1030 866 - 552 - 3453 USA-Canada Toll Free

Multi-Chip Module Packaging Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2017 - 2025

Pre Book Price: $ 5216

Original Price: $ 5795

Multi-chip module packaging has received wide range of attention in the electronics industry. Multi-chip module packaging has been applied in the advanced and high end systems. The technology primarily focuses on leveraging surface mount and integrated circuits (IC) processing technology. The Multi-chip module was primarily designed for multiple ICs (integrated circuits) to increase their application as a single package. The market has been segmented into by end use industry automotive, aerospace and defense, consumer electronics, telecommunications and healthcare among others. The market for multi-chip module packaging by region has been segmented into, Europe, Asia Pacific, North America, MEA (Middle East and Africa) and South America. 

Multi-chip module packaging is playing a prime role in the microelectronic systems and modern electronic miniaturization. The elimination of individual chip packages significantly reduces the inter-chip propagation delay along with power consumption of the whole system. Moreover, increasing demand for further miniaturization of aerospace and defense systems, consumer products, medical devices and LED arrays are anticipated to contribute in the positive growth of the multi-chip module packaging market globally. The design of multi-chip modules varies depending on the end use application and complexity of the electronic devices. Low power consumption owing to shorter interconnects lengths, enables miniaturization and smaller package; increased reliability with decreased number of interconnects between components are some of the prime attributes of multi-chip modules which are propelling the application in different end use industries. It is cost effective solution and flexible to integrate in any semiconductor devices. RF wireless modules, high end communication devices, LED packages, power amplifiers, portable computers and other wearable gadgets among others are some of the prime application areas of multi-chip module packaging market. Additionally, military and aerospace avionics, servers and other high end microelectronics are some of the application field of multi-chip module packaging. Aerospace and defense and automotive industry are major end use industry for multi-chip module packaging market. Improved performance, lower power consumption and high integration density are some of the prime characterization of multi-chip module packaging, which in turn is fueling the application in different end use industries. Cyclical nature of semiconductor industry may be considered as one of the restraining factor which may inhibit the growth of the multi-chip module packaging market. However, application of multi-chip module in satellite communication is one of the prime opportunities for the market. 

In 2016, North America held the largest market share in terms of revenue for the multi-chip module packaging market, followed by Asia Pacific and Europe. The U.S. is leading the multi-chip module packaging market in North America. China, Japan, South Korea and India among others are some of the major market contributing in the positive development of the market for multi-chip module packaging.  Germany, U.K., Italy and France among others are contributing positive share in the multi-chip module packaging market. Brazil, Argentina are anticipated to contribute positive growth over the forecast period from 2017 to 2025. In Middle East and Africa, there has been considerable advancement and development in the field of electronics and other industries for instance, telecommunication and automotive field is stimulating the demand for multi-chip module packaging market. 

Texas Instruments Inc. (The U.S.), Palomar Technologies (The U.S.), Teledyne Technologies Incorporated (The U.S.), Tektronix, Inc. (The U.S.), Micron Technology, Inc. (The U.S.), Maxim Integrated (The U.S.), API Technologies Corporation (The U.S.) and Intel Corporation (The U.S.) are some of the key players operating in the multi-chip module packaging market globally. Acquisition and merger and long term and short business allowances with raw material suppliers and component distributors are some of the major strategies abide by the companies in the multi-chip module packaging market globally.

The report offers a comprehensive evaluation of the market. It does so via in-depth qualitative insights, historical data, and verifiable projections about market size. The projections featured in the report have been derived using proven research methodologies and assumptions. By doing so, the research report serves as a repository of analysis and information for every facet of the market, including but not limited to: Regional markets, technology, types, and applications.

The study is a source of reliable data on:

  • Market segments and sub-segments
  • Market trends and dynamics
  • Supply and demand
  • Market size
  • Current trends/opportunities/challenges
  • Competitive landscape
  • Technological breakthroughs
  • Value chain and stakeholder analysis

The regional analysis covers:

  • North America (U.S. and Canada)
  • Latin America (Mexico, Brazil, Peru, Chile, and others)
  • Western Europe (Germany, U.K., France, Spain, Italy, Nordic countries, Belgium, Netherlands, and Luxembourg)
  • Eastern Europe (Poland and Russia)
  • Asia Pacific (China, India, Japan, ASEAN, Australia, and New Zealand)
  • Middle East and Africa (GCC, Southern Africa, and North Africa)

The report has been compiled through extensive primary research (through interviews, surveys, and observations of seasoned analysts) and secondary research (which entails reputable paid sources, trade journals, and industry body databases). The report also features a complete qualitative and quantitative assessment by analyzing data gathered from industry analysts and market participants across key points in the industry’s value chain.

A separate analysis of prevailing trends in the parent market, macro- and micro-economic indicators, and regulations and mandates is included under the purview of the study. By doing so, the report projects the attractiveness of each major segment over the forecast period.

Highlights of the report:

  • A complete backdrop analysis, which includes an assessment of the parent market
  • Important changes in market dynamics
  • Market segmentation up to the second or third level
  • Historical, current, and projected size of the market from the standpoint of both value and volume
  • Reporting and evaluation of recent industry developments
  • Market shares and strategies of key players
  • Emerging niche segments and regional markets
  • An objective assessment of the trajectory of the market
  • Recommendations to companies for strengthening their foothold in the market   

Note: Although care has been taken to maintain the highest levels of accuracy in TMR’s reports, recent market/vendor-specific changes may take time to reflect in the analysis.


Note : All statements of fact, opinion, or analysis expressed in reports are those of the respective analysts. They do not necessarily reflect formal positions or views of Transparency Market Research.


To receive discount, please click on the button below.

Please click on the button below to customize this report.

 
 
Back To Top