Electromagnetic Compatibility (EMC) can be defined as the capacity of an electrical appliance in an electromagnetic environment, to work efficiently without being influencing or affected by the other devices in its surrounding area. The miniaturization of electronic components and devices has amplified the complexity of devices and acts as a cause for various Electromagnetic interference problems. Electromagnetic Compatibility (EMC) design is emerging as an essential element of product design.
The growth of Wi-Fi, 3G and added features in cell phones and various similar enhancements in product blueprint act as the key driving forces for EMI shielding market. In addition, the steady migration to wireless from wired technology and the development of a various regulations and directives favoring EMC shielding solutions act as a driving force for the EMC shielding market. Alternatively, the rising miniaturization of electronic devices, high cost involved and high complexity act as restrains for the growth of the market. Let’s take an example of automotive industry, the escalating adoption of infotainment systems (wireless based) and navigation systems are acting as novel revenue prospects for EMI shielding solutions. For electromagnetic shielding usual equipments used are sheet metal, metal foam and metal screen. Any holes in the mesh or shield have to be considerably minor than the radiations wavelength that has to be kept out, or else the enclosed space will not efficiently estimated an unbroken conducting shell.
Coating the inside wall of the enclosed surface with a metallic ink or alike material is another frequently used shielding method, particularly with electronic goods in plastic enclosures. The ink contains carrier substance loaded with an appropriate metal, typically nickel or copper, in the form of tiny particulates. The ink is sprayed on to the area and, as dries, converts itself into a continuous conductive layer of metal. This layer can be electrically linked to the chassis ground of the apparatus, therefore offering effective shielding.
Printed circuit board (PCB) level shielding is mostly deployed for most of the electronic components and devices, it is expected that the adoption rate for conductive paints and coatings will steadily rise in the near future due to the rising miniaturization of electronic equipments.
The electromagnetic compatibility shielding market is segmented on the basis of type of EMC shielding material and application areas. The type of EMC shielding material segment includes gaskets, conductive paints and coatings, tapes, EMI filters and printed circuit board (PCB) level shielding. Further, the gaskets segment is sub-segmented on the basis of type into fabric over foam, finger stock gaskets, mesh gaskets, elastomer gaskets and mixed media gaskets. On the basis of application he market is segmented into military, aerospace and defense, automotive, consumer electronics and telecommunications, and medical.
Some of the key players in the electromagnetic compatibility shielding market are Laird Technologies, Chomerics a division of Parker Hannifin Corporation, Comtest engineering B.V., Tech-Etch, Creavac-creative Vakuumbeschichtung GmbH, ERA Technology LTD., Dow Corning Corp, Intermark USA Inc. and Leader Tech. among others.
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